JPS58138039A - Manufacture of resin sealed type semiconductor device - Google Patents
Manufacture of resin sealed type semiconductor deviceInfo
- Publication number
- JPS58138039A JPS58138039A JP57020191A JP2019182A JPS58138039A JP S58138039 A JPS58138039 A JP S58138039A JP 57020191 A JP57020191 A JP 57020191A JP 2019182 A JP2019182 A JP 2019182A JP S58138039 A JPS58138039 A JP S58138039A
- Authority
- JP
- Japan
- Prior art keywords
- metal mold
- resin
- cavity
- lead frame
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【発明の詳細な説明】
こＯ発＠はＩＫｌＩ＆ＩＯ外鄭単付鄭材に放熱軟部材鱒
して蝋付け４１１１脂細止−苧擲体社調の一１１Ｔｊｔ
ＲＫ−する。[Detailed description of the invention] From here, IKlI & IO is made of heat dissipating soft material and soldered to the material with IKlI&IO.
RK- Do.
一脂鉗止−ヤ噂体装箇には腋懸槍Ｏ−一を一田ｉ−ｔて
腋−鈑の中導体ペレツシがマｔント畜れ九貴自５ｔａｂ
鱒で鉗止し九タイプ中、敷熱槍のａ−を含む金ｉｋＩを
１ｍＭ脳鉢で尉止し九タイプなど〜途にＴｏシ九条−タ
イプのもＯか番為が、１１Ｌｉ！＆歇０＠向七總出畜（
九タイプＯものが腋熱性に優ね、一般的であ為、ζＯＪ
ｌ自■出声イブ０ＩＩＩｉ封止謙苧導体装−〇−鉤を鵠
ｌ幽乃厘箇Ｊ図で腕−すると、１１１は款島鈑、１１律
）・・・紘ＩＩ数のリードで、中央の７本は先端が腫島
鈑用に一体に遊ｓ！ｉされ、他は腋−一（１３０近傍１
り外ｓｎｃ＊＃Ｂされて−る・挿）は放熱槍１１１０貴
−−−に！クントされたＪＰ櫓体ペレット１、・・剛は
や櫓体ペレ’ｙト（ｍｌ ）ｊＩｇｋｌ １ｍ−とＮめ
す、６１ｊ −Ｆ（１！ｔｌｌ＆をｗｘａｇ酸絖すゐ愈
−―線、１・１に放熱槍１１１の墨向をｍ崩さ（て−馳
モール１Ｊ瘍れ九外餉樹麿材でＴｏる・
上記’Ｐ櫓体ＷＩ−の一箪作絨は艶Ｖ凶に示す１うＫＩ
Ｉ赦０苧礫体会璽におけゐ腋−槍１１１１１）・・噂と
り一ド（！ｌ （１１噛尋−Ｖｌ：タイーーー１で一造
一体化したリードフレーム４１）を懺りてＪｐＨ１体ペ
レット園（組＠嗜・のマタント及び曽Ｊ１１１１１１＋
Ｉ（４）４４）晦−＝０ポンデインダが行われ、そして
協Ｊ−に示す１５に上会＃Ｍｔ帽と下ｍｍ（ＩＩＯ閤に
リードフレーム緯ｋｔ＠＠ ＬテＭｉｉ皺１ｋｍ（８１
１１−−−０Ｊｌｌ −ルド阪形が一熟して行われる＊
ｍｋ上下崗会渥ｉｌｌ Ｉｔ ４Ｅ）各々の対同面には
外装を脂材（ＩＪＯ形状０キャビティ＠−・・＠が形＠
され、ζ０キャビティー−・・・Ｋおける下＊ ｍ （
Ｉｔ ｏ１劇にリードフレーム４７１０＊、ｌＩＩ＆＆
１１１１１１−−−０ａＨＩｌｔ紳圧して１看さゼてお
−て、キャビティー鉤・・・Ｋ＊ｌａｌ麹ｊｉｂ會注入
して皺馳篭−ルド駅珈が行われる。＃４、ζＯ篭−ルド
ｗＬ＃時の上下絢愈脂−１園はＩＩＩ自融点Ｏ駒／ＪＯ
〜／≦０−に加熱され、１１九キャ区ティ鍮を−・・・
へＯ−に注入はｍ−しａｈか上下絢金脂−８，・（旬に
触歇されたポットからランチヤしてゲート會愈して行わ
れる・とζ６で、伽繍麹止Ｉｊｊ！１ＪＰｓ体麺嘗は御
飯にシャーシベースや友熱ｍｌ麹の外部取付部材に腋熱
鈑（亀１のｍ−を酸合畜曽て７−スし丸状謝で堆付けて
いるが、＊近ね放熱槍１１３會外飾権付鄭鮪に馳−して
取付けゐ、−わ９；ｂ絶−タイプ０％Ｏが多く費求壜れ
、１及しククあるｅ七ζで皺熱＆（亀１を外Ｓｍ付１１
材に絶縁する工夫として、俺ｊＩに次のことを行りて強
要。Rumor has it that the armpit hanging spear O-1 is in the armpit, and the conductor Peretsushi in the armpit is 5 tabs.
Among the 9 types that are hooked with trout, the gold ikI including the a- of Shiki Netsuyari is stopped with 1mM brain bowl and the 9 types, etc., and the Toshi Kujo-type MoO or Banme is 11Li! & 0＠ Mukai Nansou (
Type 9 is superior to axillary fever and is common, ζOJ
l Self■ Voice Eve 0IIIi Sealed conductor body - 〇 - Hook with Goe l Yuno Rika J diagram and arm -, 111 is Kenjima plate, 11 Ritsu) ... with the lead of Ko II number, The tips of the seven rods in the center are loose in one piece for the Masajima plate! i, and the others are axilla-1 (near 130 1)
Outside SNC*#B is inserted) is heat dissipation spear 1110 Takashi---! Kunded JP oar body pellet 1, ... rigid oar body pellet (ml) jIgkl 1m- and N female, 61j -F (1! In 1, the ink direction of the heat dissipation spear 111 is broken (Te-chi mall 1J is broken, and it is made of wood from the outside).
11111) Rumor Tori Ichido (!l (11 bites - Vl: lead frame 41 integrated with Tie-1) and JpH 1 pellet Garden (Kumi@Ko・no Matant and So J111111+
I (4) 44) 晦-=0pondeinda was performed, and the upper meeting #Mt hat and lower mm (IIO) were carried out on the 15 shown in the association J-.
11---0Jll - Rudo Sakata is fully matured*
mk upper and lower walls ill it 4E) The exterior of each pair is made of resin (IJO shape 0 cavity @-... @ is shaped @
and ζ0 cavity -... K can be placed below * m (
It o1 play lead frame 4710*, lII &&
111111---0aHilt is pressed down and held for a while, then the cavity hook... K*lal koji jib is injected and a closed station coffee is performed. #4, ζO cage - Rudo wL # Time's upper and lower layers - 1 garden is III self-melting point O piece / JO
It is heated to ~/≦0-, and the 119-ku brass is heated to -...
The injection into O- is m-shiah or upper and lower ayankin fat-8, (it is done by launching from a pot that has been touched in the season and making a gate meeting), and at ζ6, the porridge is stopped Ijj! 1JPs For body noodles, I put axillary heat plate (Kame 1 m- to 7-s) on the chassis base and the external mounting member of Yunetsu ml koji to the rice, but I put it in a round shape. Heat dissipation spear 113 Attachment to the tuna with external decoration rights. 1 with outside Sm 11
As a way to insulate the material, I forced myself to do the following:
（−や導体Ｖ７Ｉ鎗を外５ＩｌｉＬ付部材に取付ける際
に、両者間に熱伝導性の良−マイカ槍嶋０薄−絶縁板を
介在させている・しかし、この方法にと取付けの−に＃
１！ｌ縁鈑を敷かねばならす１歇が多くａｎ、筐九牛噂
体＊＊と絶縁鈑が別髄体であ４Ｏ′ｃ伽！菅珈が禦麹で
轟る。(When attaching the conductor V7I to the external 5IliL attachment member, an insulating plate with good thermal conductivity is interposed between the two. However, this method does not allow for installation.
1! There are a lot of times when you have to lay a frame plate, and the 40'c case is that the body ** and the insulation plate are separate bodies! The suga koji roars with the koji.
＜ｍ ＪＰｓ体ｉｉｊ皺の一愈後、放熱板Ｏ畠自に書
ｍ糸Ｏ細縁臆料會−（膜状に麹布して１看する場合には
、ＪＰ場体饋−〇取付けか容易になる。<m After the JP body is wrinkled, write on the heat dissipation plate O. becomes easier.
しかし、−一麹科の一奄工数大中臆布むらＯ闘−かあ参
、＊に１に布むらは敷島軟の絶縁不良の１２−となって
ｅＩＩＩ牲劣下を鵜（ことかある・（＠Ｊ 叔ＩＩＩ！
４歇のｍｍか愈厳のキャビティ〇−自ρ・ら微小胞−を
もって浮くように会−のキイ１４４円に爪片を一体に央
崩させてＩｌ島法人を行−１繭配全−内に溶融伽脂を光
楓させて菖障鈑０ａ−Ｋｌ１％−脂展を外装−脂材と一
体に一時威影する・ζＯ場合も外部取付部材Ｏ取付けが
１＠ＩＩｂＫｅるΦとζろが、ζＯ↓う璋餉叡は菖熱験
ｏ＊ｎ＊Ｊ！ｏ着ｆＯ俵楓豹−７４）４９Ｗｄｆ中、款
−鈑が金撤の爪片に安定しぇ−Ｎの伏Ｓで乗珈−いこと
があって、放＃＆％槍の畠＃１に影駅され為１１１１１
１０厚さが不均一になってビンホールが′Ｃ自、絶縁不
良を龜九すことが島る・崗、鋳配倫ｋｌ１４を廖（＃叙
す４ようにすればビン本−ｋＫＡｋ−縁不良に無くなる
が、ＩＩｊ自腋熱槍の敷島協が龜くなｐ、物性に鯵暢が
田て好ましく１ｋＶ％・
本脅−はかか為−一点に鍮みてなされ丸もので、菖膳軟
ｏａｇｏｇ−−麹廖〇−廁論會逸嘗０曽撤を使りて一単
Ｋｍ歇し僧る７ｊ訳を備供する・
本実＃０１１黴はＪｌＫ−槍の一自を島出瘍（て外装−
に鮪を篭−ｋＦ＃ＩＬ鰺する曽−Ｏキャビティと１１！
鵬軟Ｏ鈎に予め麹馳バタダーを介奄盛ゼてかｉて、キャ
ビテ４に霞ＩＫ鞠廁を征λすることである＊ ｍｋｌｌ
ＪＩＩａｔ’ｌ〆−Ｏ介毫苧験はリードフレームがｉ＋
ｕｉ＊れ為劇Ｏ会−のキャビティにｋｋバタグーを予め
散布してお（ことによ夕、′ＩＲ鉱愈１ｉ１に入れ為−
〇リードフレームＯ旗−軟ａｔ向Ｋ１１ｌｌｋバクダー
を予め付看場せてお（ζ七により行われる吻以下、本発
明を一由Ｏ舅總―でもってＩｌ！明すゐ。However, in the battle between Ichikoji's man-hours and O-chu-fu-mura O-kaasan, *1 and Nuno-mura became 12- due to poor insulation of Shikishima Soft, resulting in eIII deterioration.・(@J Uncle III!
4mm or 100mm cavity 〇-selfρ・ra microvesicles--to make it float in the key 144 yen, the nail piece is collapsed in the center, and the Il island corporation is executed--1 cocoon distribution--inside. The molten resin is applied to the iris plate 0a-Kl1%-the resin is exposed temporarily together with the exterior-fat material.In the case of ζO, the external mounting member O is attached to 1@IIbKe. , ζO↓Usho 餉叡is the irises experience o*n*J! 74) During 49 Wdf, there was a time when I was riding on the down S of the N, and the board was stable on the nail piece of the gold removal, and I went to Haku # & % Yari no Hatake #1. Kage Station Sareme 11111
10 If the thickness is uneven and the bottle hole is 'C', it is difficult to avoid poor insulation. However, the Shikishima association of the IIj self-axillary heat spear is not strong, and the physical properties are preferably 1kV%. --Koji Liao 〇-Liuronkai It's 0 Zeng Removal is used to provide a translation of 7j for the monk who took a Km pause. −
So-O cavity and 11 for placing tuna in a basket-kF#IL mackerel!
The first thing to do is to put kojichi butter on the Hoso O hook in advance, and then to conquer Kasumi IK Mariko in Cavite 4 * mkll
The lead frame for the JII at'l〆-O intervention experiment is i+
Spray KK Batagu in advance in the cavity of the ui*retamegeki Okai (especially in the evening, put it in the IR mine 1i1)
〇 Lead frame O flag - Soft direction K11llk backer is attached in advance (below the proboscis performed by ζ7, the present invention will be explained as follows).
飼えば、零脅＠ｔｓダ図屓び協Ｊ−に示し九リードフレ
ーム（？）と會淑（匍１ｓ１を使り丸−ｊ１万能で１１
１１！すると、先ず暢１図に示すように下金−（８１Ｏ
＠キャビテイーー・Φ−０鷹如にエポキシ伽麿時”ＩＤ
１１ｊｉｋ１４クダー四四・０・を定電すり散布する。If you keep it, Zero Threat @tsda Zukaikyo J- shows 9 lead frames (?) and Kaishu (Using 1s1, Maru-j1 is 11
11! Then, first, as shown in Figure 1, Shimogane-(81O
@Cavity・Φ-0 Takanyo epoxy “ID”
Spray 11jik14kuda44.0. with a constant electric current.
この散布は下愈艙−１上にキャビｆ４４ｗ−・・嗜を總
ａ＄させるアスク（図示ぜず）を値ゼて行えばｌ１ｉ１
４ＬＫ行える。１九−タｆ−の散布でＩｈるから４にキ
ャビテイ４Ｍ１−・・・へｏｍ奄鳳の定態コント書−ｋ
が１！墨であゐ一次に下金―ｔｉｌｌ Ｏ％キャビティ
ー９１＃嗜−嗜Ｏ紙−に散布し九（２）膣パタグー藝り
四・噂・上に鋤？−に示す１うにリードｙ ｖ−ｉ（ｖ
）（１＊ｌＩ稙１１！４１） １嗜＊ Ｏｌｋ向をｊＩ
！曽てリードフレーム屯１１會餉暑し、（Ｏ畿下会朧ｔ
ｉｌ＋と１会＆（＠ｌでリード７レー五も１）を挾持し
て！＆Ｉ締め上行う０面して、よ下崗金緘Ｃａ１ＩＩ
を内−ｗ−＊（６ＩＡ示着す）で−膳―−に近−一属（
＆／ＪＯ〜／４０＠ｃ）Ｋ加ｊｌ Ｌ７ｔａ、ｌｌ−ｔ
’ｌ ｆｆ ヒＰイレー・・・Ｋｉｌ融傭勤を注入して
麹脂モールドＩ［ｊｉＩＩを行う、すゐとＩＩＪ’図に
示す１９に、キャビティ＠−・・・に注入され九ｓｉｍ
＊謝て外装ｍｋ材ｌｉｔ ｌｉｔ・・・がａ隻される−
１て、予イノ歇布壜れ九ｗ倉パタダー四四・脅・が下金
−（−１０熱で溶融して腋熱槍ｔｉｔ（１）・Φ・の−
一金城に◆廖のｌＩ＆１１に四−・・・となってｔｍ看
する・この麹−ｍ輪部−・・は髄−バタダー参Ｑ圓嘩Φ
００１［１１ｋＫ！りて次筐る犀さで形歇される。筐た
一脂展鯖Ｏ彎・・・Ｏ辱さは散布量とＨ篇（エポキシを
珈やシリコン伽脂なと）Ｋよ４１ｍ一時の結反のＩＩＩ
択によってコントロール丁ゐζト４−麹である。This scattering is done by asking (not shown) that makes the cab f44w-... taste on the lower chamber-1.
Can do 4LK. 19-ta-f- spraying Ih, so to 4 cavity 4M1-... om Amao's regular sketch book-k
is 1! Sprinkle with ink on the lower gold - till O% cavity 91 # pleasure - taste O paper - nine (2) vagina pattern - art 4 - rumors - spade on top? -1 sea urchin lead y v-i (v
) (1*lI稙11!41) 1st* Olk direction jI
! The 11th lead frame meeting was very hot.
Hold il+ and 1 meeting & (@l lead 7 lay 5 also 1)! &I Tighten the 0 side, Yoshigangkintan Ca1II
In -w-* (6IA shows), -Zen-- is close to -1 genus (
＆/JO~/40@c)K 加jl L7ta, ll-t
'l ff HiP Erre... Inject the koji resin into the koji resin mold I [jiII, Sui and IIJ' shown in the figure 19, and inject into the cavity @-...9sim
*As apologies, the exterior mk material lit lit... will be sent to a ship.
1, Pre-innocent cloth bottle, 9 w warehouse patadar 44, threats, lower gold - (-10 melted with heat and axillary heat spear tit (1), Φ, -
In Ichijin City ◆Liao's lI & 11 is 4-... and I look at this koji - m limbus... is marrow - batada san Q round fight Φ
001[11kK! It is perpetuated by the rhinoceros that lingers. The humiliation is the amount of spraying and the H part (epoxy with coffee and silicone resin) Kyo 41m one-time rebellion III
Depending on the selection, the control method is 4-Koji.
次に本脅鳴の伽Ｏ真１ｉｉｈｔ−貌一すゐと、先ず協ｊ
’ｌ！ｌｉＫ示す１うにリードフレーム４＄１０６ＪＩ
ｋｌｌｌ撫田（ｌＩ−１嗜のＪＩＩＩＩＫ予め１ト（り
メー四四＠脅９をに重すり付１１ａ匁ておく・ζＯ場会
０１１１１＆バクグー（ｌｌｌ （ｍｌ）９嗜・Ｋは嵌
肴削としてのパイン〆−を混−しておいてＩＩＬ熱歇（
１１（１７１１噂に＆皺、１１′ａ４：る・而して、艶
ｌＱ図に示すように各放熱板（幻（凰１・・・を下金Ｊ
［Ｉ）０キャビティー−・・−の魔向に押圧名せ九状廖
で、リードフレーム４１）を上下両会−１剃−）ｆ抛細
めして、従来ＭｉｉＫｍＭ篭−ルド阪影すれに、−脂パ
ｔダー９υ四・・・が癖−して１１１島軟４１？４１ｊ
・・・Ｏ畠−ＫＩ＄−鋤廖Ｏ僑ｋｌ１４が一時駅か盛れ
る・或は箇／／−に示すように者干ｌｌＩ４なる上会脂
圃′七下金−一）１を１＠−１上金細ｔａｆｔｏキャビ
ティー−・・・Ｏ天１ｋＫ放１１ｉ撫１１１１１１−−
−Ｑ＠幽を―麹ハ９１−圓すυ・・・を介して押圧”ａ
＜九状跡で、リードフレーム１１）を上下両会−−１（
副で＃Ｍ細めして僑―（−ルド［＃してｔｌ−じ結電か
優られｉ・以上’ｌｉｔ＠シ九工うに、本Ｉｉ−に１れ
は菖島鈑蟲自０ｍｋ−１ａＫ）鯵駅作細が１幽で、崗を
廖堪Ｏ均一化が春Ｊｉ６に違欧堪れて、龜障槍七外鄭単
付伽材との絶縁不良ｏｙ４纏が皆無とな）、僑−壮Ｏｖ
４上が幽れゐ・鵞九智胸な自−では攻（憾摩−斂Ｏ金−
Ｏ便用が鵬謝で、款備設資帥に有利て＆る。Next, we will meet Kao Shin 1iih of Honyōmei, and first, Kyōj.
'l! liK show 1 sea urchin lead frame 4$106JI
klll Naduda (lI-1 taste's JIIIK 1 to 1 in advance (rime 44 @ threat 9 with 11a momme), ζO field meeting 01111 & Bakugou (lll (ml) 9 taste, K is as a side dish) Mix in the pineapple paste and heat the IIL heat (
11 (1711 rumors & wrinkles, 11'a4:ru,
[I) Press the 0 cavity...- in the nine-shape direction, narrow the lead frame 41) on both the upper and lower sides -1 shave-)f, and make it close to the conventional MiiKmM cage. , - fat padder 9υ4... is a habit - 111 island soft 41?41j
・・・Obata-KI$-Poke LiaoOkl14 is a temporary station or a place//- As shown in -1 upper gold thin tafto cavity-...O heaven 1kK release 11i stroke 111111--
-Q@Yuwo-Kojiha91-Ensu υ...press through "a"
<At the nine-shaped trace, attach the lead frame 11) to both the upper and lower sides --1 (
By the side, #M narrows it down - (-Lude [# then tl- the electricity is better than i/'lit@shikukouni, this Ii- is 1 is Awashima Katamushi 0mk-1aK ) The construction details of the horse mackerel station were 1, the uniformity of the granite was improved in the spring Ji6, and there was no poor insulation between the three parts and the material with the third part. - Soo Ov
4.The upper part is hidden, and the goose is the one who is the one who is the one who is the one who is the one who is the one who is the one who is the best.
O convenience is Peng Xie, giving an advantage to the equipment and resources manager.
【図面の簡単な説明】
ＩＩ／図乃ｊ＊Ｊ図は一一尉止急中等体装璽〇−例を示
す一１１１ｋｌ＋平釦図とムームー謝幽−とＢ−１１１
１１向図 Ｓダー及びｌｌｌ因は協／図ヤ擲体ＷｉＩｗ
ｌＯＩｌｌ造Ｏ各工娠におけるリードフレームＳ分平ｒ
ｌＩＪ図及び曽抛齢分敵冑−１艶４−乃自１！１ｌ１１
．Ｉは本脅−〇−餉を鋺−する九めＯ僑ニーにおける曽
―鄭分謝自凶、鶴り凶及び−１０図は本脅−〇−〇−伽
會睨明する九めＯ僑ニーにおけるリード７レームー分−
■凶及び金撤部分動ｍ図、簡ｌ／凶ね讐１０凶における
に法Ｏ爽ｉ＊＊＊ａｔ親−するための曽細部分−一−で
ある・[Brief explanation of the drawings] II/Figure J *J figure shows an example of the 11th Lieutenant's Emergency Medium Body Seal - 1111kl + flat button figure, Mumu Xie Yu - and B-111
11 Mukai Suda and llll cause are cooperative/figure ya body WiIw
Lead frame S for each construction
lIJ diagram and Zheng age division enemy helmet-1 gloss 4-noself 1!1l11
．． I is a threat -〇 鋺 九 鋺 鋺 鋺 鋺 睨 睨 會 伽 會 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽 伽7 remu minutes of lead at the knee -
■ A diagram of the movement of the enemy and the money withdrawal, simple l / detailed part-1 for the purpose of exchanging the law in the ten evils of the enemy and the parent.
Claims (1)
向を押庄してキャビティに書＃１ｌｉ１１謝を注入する
―劇モールドエＩ！において、−配キャビテイの内向と
放熱槍ａｍｏ四に予め倫謝バク〆一を介ａＳ＜ておいて
Ｉｇｌｌａ人を行う１うにし九ことを智黴とする伽＆真
止朧牛導体鯖−Ｏ皺造万沃・111 The cavity of the meeting KIP 绽体輌璽O Hōjūyari Hatake Mukai is forced and the cavity is injected with Book #1li11 Xie - Geki Mold E I! In the inner inside of the caviiti and the heat dissipation spear AMO 4, the 倫 〆 〆 〆 Wizou Manyo・
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57020191A JPS58138039A (en) | 1982-02-10 | 1982-02-10 | Manufacture of resin sealed type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57020191A JPS58138039A (en) | 1982-02-10 | 1982-02-10 | Manufacture of resin sealed type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58138039A true JPS58138039A (en) | 1983-08-16 |
Family
ID=12020279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57020191A Pending JPS58138039A (en) | 1982-02-10 | 1982-02-10 | Manufacture of resin sealed type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138039A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05198707A (en) * | 1992-01-22 | 1993-08-06 | Nec Kyushu Ltd | Manufacture of semiconductor device |
| JPH05243301A (en) * | 1992-02-28 | 1993-09-21 | Nec Kyushu Ltd | Production of semiconductor device |
| WO2013061183A1 (en) * | 2011-09-27 | 2013-05-02 | Rupprecht Gabriel | Molded electrically insulating housing for semiconductor components or assemblies and production method |
-
1982
- 1982-02-10 JP JP57020191A patent/JPS58138039A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05198707A (en) * | 1992-01-22 | 1993-08-06 | Nec Kyushu Ltd | Manufacture of semiconductor device |
| JPH05243301A (en) * | 1992-02-28 | 1993-09-21 | Nec Kyushu Ltd | Production of semiconductor device |
| WO2013061183A1 (en) * | 2011-09-27 | 2013-05-02 | Rupprecht Gabriel | Molded electrically insulating housing for semiconductor components or assemblies and production method |
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