JPS58135958U

JPS58135958U - IC package

Info

Publication number: JPS58135958U
Application number: JP3182282U
Authority: JP
Inventors: 博吉村
Original assignee: 白光金属工業株式会社
Priority date: 1982-03-05
Filing date: 1982-03-05
Publication date: 1983-09-13

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来の一実施例の側面図、第２図はこの考案の
一実施例の側面図、第３図は同正面図、第４図と第５図
はそれぞれ異なる他の実施例の側面図、第６図は係止突
部と取付は孔との関係を示す説明図、第７図はさらに他
の実施例を示す要部正面図である。１・・・・・・ピン、２・・・・・・パッケージ本体、
３・・・・・・係止突部、３ａ・・・・・・半円形の突
出部、３ｂ・・・・・・山形の突出部、３Ｃ・・・・・
・直角三角形状の突出部、３Ａ・・・・・・突出先端、
３　Ａ１．　３　Ａ２・・・・・・突出先端の左右両端
、４・・・・・・プリント基板、５・・・・・・取付は
孔。Fig. 1 is a side view of one conventional embodiment, Fig. 2 is a side view of one embodiment of the present invention, Fig. 3 is a front view of the same, and Figs. 4 and 5 are of other different embodiments. A side view, FIG. 6 is an explanatory view showing the relationship between the locking protrusion and the mounting hole, and FIG. 7 is a front view of main parts showing still another embodiment. 1...Pin, 2...Package body,
3...Locking protrusion, 3a...Semicircular protrusion, 3b...Chevron-shaped protrusion, 3C...
・Right triangular protrusion, 3A...protrusion tip,
3 A1. 3 A2...Both left and right ends of the protruding tip, 4...Printed circuit board, 5...Mounting holes.

Claims

[Scope of utility model registration request]

(1) A DIP type IC package, characterized in that a plurality of opposing pins are formed parallel to each other on the same side of the package body, and a locking protrusion is provided at the tip of each pin.

(2) The IC package according to claim 1, wherein the locking protrusion is formed in the thickness direction of the pin.

(3) The IC package according to claim 2, wherein the locking protrusion is a semicircular protrusion.

(4) The IC package according to claim 2, wherein the locking protrusion is a chevron-shaped protrusion formed by bending.

(5) The IC package according to claim 2, wherein the locking protrusion is a triangular protrusion whose upper end is formed at right angles to the longitudinal direction of the pin.

(6) A utility model registration claim described in any one of claims 3 to 5, in which both widthwise ends of the protruding tip of the locking protrusion are formed so as to protrude slightly outward from the mounting hole of the printed circuit board. IC package.