JPS58133738A - Polysilicon fuse element - Google Patents

Polysilicon fuse element

Info

Publication number
JPS58133738A
JPS58133738A JP1507182A JP1507182A JPS58133738A JP S58133738 A JPS58133738 A JP S58133738A JP 1507182 A JP1507182 A JP 1507182A JP 1507182 A JP1507182 A JP 1507182A JP S58133738 A JPS58133738 A JP S58133738A
Authority
JP
Japan
Prior art keywords
fuse element
fuse
silicon
current
polysilicon fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1507182A
Other languages
Japanese (ja)
Inventor
岩橋 弘
正通 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP1507182A priority Critical patent/JPS58133738A/en
Publication of JPS58133738A publication Critical patent/JPS58133738A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は小さな電流で##できるIリシリコンヒュー
ズ素子に911’f6゜ 〔発明の独酌的背景〕 峡近の半導体東横回路においては、正規回路に不艮部分
がある場合、この部分を予備回路1二(dさかえるだめ
の予備回路を備えたものが多く現われて来ている。この
ような予備回路は記憶量@昂に中いられ、信幀性の向上
を針っている。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an I-silicon fuse element that can be used with a small current. If there is an unreadable part in the memory, many devices are now equipped with a spare circuit that can be used to restore this part. The aim is to improve credibility.

実偵には同じ記憶素子を含む回T!6を2経路設け。Episode T includes the same memory element in the actual detective! 6 has two routes.

−h゛のddを正規の回路とし、他方の@路を予備回路
とし、正規回路に不艮部分があった場合・二はLl:、
現回i内に介在する41図のような形状を有する一リV
リコyヒユーズ素子をS*することC;より、上記正規
回路を回路的にオフして予備回路を回路的にオンさせて
いる。また%纂1図に示すような4すシリコンヒユーズ
素子を11!1ltlする場合(二はIすシリコンに過
大な電流を流し、その時発生するジュール熱により溶断
している。第1図1=おいて、11及び12はそれぞれ
電極部で、11はぼりシリコンヒユーズである。このよ
うな電流を流子か流さないかは上記ポリシリコンヒュ、
−オ累子と電源間に設けられたトランジスタをスイッチ
ング制御すること1:よりなされている。
- If the dd of h゛ is a regular circuit and the other @ route is a backup circuit, and there is an invalid part in the regular circuit, the second is Ll:,
A line V having a shape as shown in Fig. 41 intervening within the current i
By performing S* on the fuse element C;, the normal circuit is turned off circuit-wise and the spare circuit is turned on circuit-wise. In addition, when a 4-silicon fuse element as shown in Fig. 1 is made 11!1ltl (2), an excessive current is passed through the silicon, and the Joule heat generated at that time causes it to melt. 11 and 12 are electrode parts, respectively, and 11 is a raised silicon fuse.Whether such a current flows or not flows depends on the polysilicon fuse,
- Switching control of the transistor provided between the resistor and the power supply 1:

〔背景挟挿の問題点〕[Problems with background insertion]

つまり%L紀Iすシリコンヒユーズ素子を溶断するため
に大きな電流を流す必要があるため、その電流を制御す
るためのトランジスタのチップ占有−檀が大きくなって
しまうという欠点があった。
In other words, since it is necessary to flow a large current to blow out the silicon fuse element, there is a drawback that the chip occupancy of the transistor for controlling the current becomes large.

〔発明の目的〕[Purpose of the invention]

この発明は上記の点(;鑑みてなされたもので、七の目
的は小さな電流でll1thさせることができる4リレ
リプンヒユーズ素子を提供することC二ある。
This invention has been made in view of the above points, and the seventh object is to provide a four-reliance fuse element that can perform 11th operation with a small current.

〔発明の砥普〕[Sharpening of invention]

/リシリコンヒューtg子の形状を折り曲がった形状と
している。
/The shape of the silicon fuse tg is bent.

〔発明の夷弛例〕[Example of invention failure]

以上、肉面を参照してこの発明の一実施例を説明する。 An embodiment of the present invention will be described above with reference to the meat side.

−2図において、Jl及び21はそれぞれ電橋−である
。また、21はd9vリコンヒューズである。図示した
ようにポリシリコンヒユーズを折り曲がった形状鑑:す
ること1=より、折り曲がり部ム?二おける電流は4す
シリコンヒユーズの抵抗の小さい部分すなわち内側を凍
れることによりこの部分の電流密度が大無くなり、より
高いジュール熱を発生する。これにより、小さな電流に
よりIすシリコンヒユーズを嬉耕させることができる。
In Figure 2, Jl and 21 are electric bridges, respectively. Further, 21 is a d9v recon fuse. A diagram of the shape of a polysilicon fuse bent as shown in the figure: What to do 1=Is the bent part M? The current flowing through the 4th point freezes in the lower resistance portion of the silicon fuse, that is, the inside, so that the current density in this portion is greatly reduced and higher Joule heat is generated. This allows the silicon fuse to be energized with a small current.

また、第3図はこの発明の他の実施例を示すポリシリコ
ンヒユーズ素子を示す図である。図ν替コンヒユーズで
ある。第3図C=示したようにこの発明の他の実施例に
係るIリシリコンヒューズ1Jはコの字状ζ:形成され
ている。このことにより、折り曲がり部B、Clニーお
ける電流密度が太き(なり、82図に示したIすVリコ
ンヒューを素子と同11(二小さな電流(二よりIすシ
リコンヒユーズを111IIlrさせることができる。
Further, FIG. 3 is a diagram showing a polysilicon fuse element showing another embodiment of the present invention. This is the figure ν replacement configuration. As shown in FIG. 3C, an I silicon fuse 1J according to another embodiment of the present invention is formed in a U-shape ζ. As a result, the current density at the bending part B and the Cl knee becomes thicker (the current density at the bending part B and the Cl knee becomes thicker), and it becomes possible to make the silicon fuse shown in Figure 82 have the same current density as the element. can.

〔発明の効果〕〔Effect of the invention〕

以上詳述したよう6二この発明によれば、4すVv2ン
ヒューズ素子に用いられるfすシリコンの形状を折り曲
がった形状とすることにより小さな電流によりぼりシリ
コンヒユーズ素子をIIIIIkさせることができる。
As described in detail above, according to the present invention, by making the shape of the silicon used in the 4S Vv2 fuse element into a bent shape, a small current can be applied to the silicon fuse element to cause the silicon fuse element to function as III.

このことにより、ぽりシリコンヒユーズ素子の電流を制
−するトランジスタのチップ占有面積を小さくすること
ができる。
This makes it possible to reduce the chip area occupied by the transistor that controls the current of the polysilicon fuse element.

【図面の簡単な説明】[Brief explanation of drawings]

111li!従来(DxlMvす”:zyヒz−,1e
lR子ヲ示す図、@3図はこの発明の一実施例を示すI
リシリコンLユーズ累子を示す図、第3図はこの発明の
他の実施例を示すIすシリコンヒユーズ菓子を不す図で
ある。 21.21.II、II・・・電極部、13’、73・
・・4リシリコンヒユーズ。 出−人代理人弁理士鉤江武彦 第1図 第2図I!3図
111li! Conventional (DxlMvsu":zyhiz-,1e
Figure 3 shows an embodiment of the present invention.
FIG. 3 is a diagram illustrating a silicone fuse confectionery according to another embodiment of the present invention. 21.21. II, II... electrode part, 13', 73.
...4 silicone fuse. Representative Patent Attorney Takehiko Kamie Figure 1 Figure 2 I! Figure 3

Claims (1)

【特許請求の範囲】[Claims] 折り曲がった形状を一部に持つことを特徴とfるポリシ
リコンヒユー!素子。
A polysilicon hue that is characterized by having a partially bent shape! element.
JP1507182A 1982-02-02 1982-02-02 Polysilicon fuse element Pending JPS58133738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1507182A JPS58133738A (en) 1982-02-02 1982-02-02 Polysilicon fuse element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1507182A JPS58133738A (en) 1982-02-02 1982-02-02 Polysilicon fuse element

Publications (1)

Publication Number Publication Date
JPS58133738A true JPS58133738A (en) 1983-08-09

Family

ID=11878615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1507182A Pending JPS58133738A (en) 1982-02-02 1982-02-02 Polysilicon fuse element

Country Status (1)

Country Link
JP (1) JPS58133738A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039220A (en) * 2003-06-26 2005-02-10 Nec Electronics Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039220A (en) * 2003-06-26 2005-02-10 Nec Electronics Corp Semiconductor device
US7795699B2 (en) 2003-06-26 2010-09-14 Nec Electronics Corporation Semiconductor device

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