JPS5911695A - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a hybrid integrated circuit device in which electrical components are connected to electrodes or other electrical components through a resistor layer, either a thin film resistor layer or a thick film resistor layer. It is related to.

Conventionally, in hybrid integrated circuit devices, when electrical parts are short-circuited to electrodes or other abnormal conditions, there is a need to prevent electrical parts from overheating or burning out due to overcurrent. and the electrode are electrically connected through a resistor layer, and by suppressing overcurrent by this resistor layer or by burning out the resistor layer itself first,
A structure is adopted to prevent accidents involving electrical parts.

That is, as shown in FIG. 1, conductive layers (2a), (2b
) (2c), and further conductor layers (2b), (
A resistor layer (3) is formed on the upper layer of 2c) to form a conductor layer (
2b) After electrically connecting q2c), an electrical component (4) such as a chip capacitor is connected to the conductive layer (2a) and (2).
b) by making an electrical connection between the electrical component (
4) is configured to allow a current to flow through the resistor layer (3) to prevent an accident with the electrical component (4).

However, in such a configuration, if the resistor layer (3) is to be burned out first, it is necessary to design the circuit so that at least 100 times more current flows than during normal operation, and special measures are required in the design. The disadvantage is that it requires consideration. In addition, since it is extremely difficult to design a circuit with such sufficient margin, in reality, the resistor layer (3) may deteriorate or burn out even during normal operation. ing. In this case, it is conceivable to provide a fuse outside the hybrid integrated circuit, but when a closed loop circuit is formed inside the hybrid integrated circuit, the function of the fuse becomes completely useless1. The purpose was to create a hybrid integrated circuit device that does not require special consideration in circuit design and that can reliably prevent accidents such as burnout of the circuit system including electrical parts in the event of an abnormality. 1. For this reason, the present invention provides a conductor layer formed on the upper layer of the resistor layer via an insulator layer and electrically connected with a low melting point conductive metal, The layer and the electrical component are electrically connected through the conductor layer, and in the event of an abnormality such as a short circuit, the heat generated by the resistor layer melts the low-melting point conductor metal, thereby electrically opening the circuit system. It is something that is made to become a state.

Hereinafter, the present invention will be described in detail based on illustrated embodiments.

FIG. 2 is a plan view showing an embodiment of a thick film hybrid integrated circuit device to which the present invention is applied, and here, patterns such as a resistor layer are shown in a transparent manner.

Note that the same parts as in FIG. 1 are represented by the same symbols.

In FIG. 2, the upper layer of the insulating substrate (1) includes a first conductive layer (2a) t (2bx) t (2b2) +
(2c) is formed, and an inclusion layer (3) is formed on the upper layer thereof, and both ends of this resistor layer (3) are electrically connected to the first conductor layer (2b2) and (2c). connected. Further, an insulator layer (5) is formed on the upper layer of the resistor layer (3), and a resistor layer (5) is formed on the upper layer of the insulator layer (5).
The second conductive layer (6a) t (6
b) is formed, and this second conductor layer (6a) and (6b)
and are electrically connected to each other by a low melting point conductive metal (7) made of a material used for cattle or the like. Moreover, this second conductor layer (6a
)? One end of (6b) is the connection part (8a)?
(8b) and are electrically connected to the lowermost first conductor layers (2bl) and (2b2), respectively. An electric component (4) is electrically connected between the first conductor layer (2bl) and (2a), and this electric component (4) has a second conductor layer (6a) t ( 6b) and a low melting point conductor metal (force) and is configured to allow current to flow through the resistor layer (3).

In such a configuration, if a short circuit occurs in the electrical component ('/4), an excessive short circuit current will flow through the resistor layer (3), causing the resistor layer (3) to generate heat, and the temperature at which it generates will decrease. When the melting temperature of the melting point conductor metal (force is exceeded), the melting point of the low melting point conductor metal (7
) will dissolve. For this reason, the second conductor layer (6a)
+ (6b) is electrically open, and the current path to the electrical component (4) is cut off. As a result,
Accidents such as burnout of electrical parts (4) can be prevented in advance and reliably. In this case, there is no need to burn out the resistor layer (3) itself, and it is only necessary to select one with a good heat generation effect, so there is no need to take any special consideration when designing the circuit as in the past.

Although this embodiment describes a thick film hybrid integrated circuit device, the invention can be similarly applied to a thin film hybrid integrated circuit device. In addition, the connecting portion of the second conductive layer (6a) and (6b) connected by the low melting point conductive metal (7) is a low melting point conductive metal (with a pattern shape that is easily separated electrically when melted by force). Even better.

As explained above, the present invention provides a conductor layer formed on the upper layer of the resistor layer via an insulator layer and electrically connected with a low melting point conductive metal, and electrically connects to the resistor layer. The circuit system is electrically connected to the parts through the conductive layer, and in the event of an abnormality such as a short circuit, the heat generated by the resistor layer melts the low-melting point conductive metal, so that the circuit system becomes electrically open. This is what I did.

Therefore, there is no need to take special consideration in circuit design, and in the event of an abnormality such as a short circuit, it is possible to reliably prevent accidents such as burnout of the circuit system including electrical parts.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an example of a conventional hybrid integrated circuit device;
FIG. 2 is a plan view showing an embodiment of the present invention. (2a), (2b1), (2b2), (2c)...
First conductor layer, (3)...Resistor layer, (4)...
・Electrical component, (5)...Insulator layer, (6a)y(6
b)...Second conductor layer, (7)...Low melting point conductor metal, (8a), (8b)...Connection portion.

Claims (1)

[Claims] In a hybrid integrated circuit device in which electrical components are connected through a resistor layer, either a thin film resistor layer or a thick film resistor layer, a low 1. A hybrid integrated circuit device comprising: a conductor layer electrically connected with a melting point conductor metal; and the resistor layer and an electrical component are connected via the conductor layer.