JPS58131797A - Method of illuminating lead end of electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an illumination method for detecting the position of a lead tip of an electronic component when the electronic component is inserted into a board.

A lighting method conventionally used for this type of lighting will be explained with reference to FIGS. 1 to 4.

FIG. 1 is a perspective view showing an example of an electronic component inserted into a board;
Figure 2 is an explanatory diagram showing a conventional lighting method for electronic components, Figure 3 is a side view taken in the direction of the arrow ■ in Figure 2, and Figure 4
The figure is an explanatory diagram showing a problem with a conventional lighting method.

1 to 4, a main body 1 of an electronic component to be inserted into a board has two lead wires 2, 2', and these leads 2, 2' are usually taped. This is cut and inserted into the board, but the leads 2 and 2' may shift from the specified position due to the state of taping, force, or chuck state during insertion or insertion, and may not be able to be inserted into the hole in the board. be. Therefore, in the past, the main body 1 was illuminated with fluorescent lights 55' from both sides.
After the position of the lead 2.2' was detected by the TV camera 5 and the amount of deviation was measured, the position of the board was corrected and inserted. In this case, when the main body 1 is illuminated using the fluorescent lamps 5 and 5', the main body 1 and the leads 2 and 2' are exposed to the TV.
This is captured as a camera 50 image, making it difficult to distinguish between the leads 2 and 2'. For this purpose, conventionally, as shown in FIG. 2, a plate 6 with a slit 4 is provided, fluorescent lamps 5 and 5' are arranged on both sides of the slit 4 in the longitudinal direction, and the light is restricted by the slit 4. Lead 2 without irradiating
The above-mentioned problem was solved by irradiating only 2' as shown in FIG. However, the IC socket etc. shown in Figure 4
If the width of the main body 7 is wide and the leads 8.8' are short, even if the plate 6 is used, the main body 7 will be irradiated and erroneous recognition cannot be prevented. Furthermore, in the case of the part shown in the WJ1 diagram above, the lead 22'
Since the lead tip is flat and shiny, the reflected light can be clearly recognized even under fluorescent light. However, for parts that have leads of many different shapes, it is generally difficult to cut each lead with force or a cutter, and the leads may have to be inserted without being cut. Recognizing the lead was difficult in this case, and strong illumination was required to prevent vAg recognition.

The present invention aims to improve the prior art as described above and provide an illumination method that does not require the use of strong illumination and can reliably detect the lead tip.

In order to achieve the above object, the present invention uses substantially parallel light rays and limits the thickness of the light beam so that only the tip of the lead is illuminated without illuminating the main body of the component.

Next, an embodiment of the present invention will be described with reference to FIGS. 5 and 6 (α) t (h).

FIG. 5 is an explanatory diagram showing the one-lead lighting method of the present invention, and FIG.
Figure (α) is a plan view of a device for producing parallel light beams used for lead illumination according to the present invention, and Figure (A) is a side view thereof.

In FIG. 5, 7 is an IC body having leads 8, 8'. Irradiate only leads 8 and 8' of this IC body,
Moreover, if a parallel light beam 9.9' having a certain width and length is irradiated from an oblique direction as shown in FIG.
It can be captured by V camera. In this case parallel rays 9,
9' has sufficient brightness, so that the position of the lead tip can be sufficiently confirmed even if the lead tip is not pressed or turned, and even if the lead tip has a wide variety of shapes and surface conditions.

The parallel light beams 9, 9' are produced by the method shown in FIG. 6(a) l (14). Figure 6 (α),
In (b), the light is focused near the slit 12. This light is narrowed down by a slit 12 and passed through the slit 12 as light close to a linear light source. A cylindrical lens 13 is placed at a position where the light passing through the slit 12 is focused, and the light passing through the cylindrical lens 15 has a thickness d as shown in FIG. 6, and a width l corresponding to the shape of the slit 12. A parallel light beam 9 can be obtained. This light beam 9 is a parallel light beam and has sufficient brightness due to the light condensed by the lens 11, so if it is irradiated from the side of the component, the main body of the component will not be irradiated.
Only the leads can be irradiated.

In this way, only the lead is illuminated, so even if the lead tip is not pushed or bent, and even if it has a wide variety of shapes and surface conditions, it will be sufficiently illuminated, and its position will be captured in the TV camera image. Based on this data, the position of the substrate can be corrected and leads can be easily inserted.

As described above, the method of illuminating the tip of an electronic component lead according to the present invention uses substantially parallel light beams and limits the thickness of the light beam to illuminate only the tip of the lead without illuminating the component body. This method has the necessary illuminance, illuminates only the leads regardless of the number, shape, or surface condition of the leads, and captures this in the image of the TV camera, making it possible to use strong light as in the past. Even if it is not used, the position of the board can be easily corrected and the lead can be inserted.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of an electronic component inserted into a board;
Figure 2 is an explanatory diagram showing conventionally used lighting for electronic components, Figure 3 is a side view of Figure 2 as viewed from the ■ direction, and Figure 4 is the
FIG. 3 is an explanatory diagram showing a problem with the illumination method shown in the figure. Figure 5 is an explanatory diagram showing the lead illumination method of the present invention, Figure 6 (α)
5 is a plan view showing the method of creating parallel rays shown in FIG. 5, and FIG. 5(b) is a side view thereof. 7......IC body 8.8' -... IC leads 9,9
'-...Parallel rays 10...Filament 11...Lens 12...Slit 13...Cylindrical lens!・・・・・・Width of parallel rays d・・・・・・Thickness of parallel rays! 1 ■ 2nd map 4-Kuni l 5 En

Claims (1)

[Claims] In an illumination method for detecting the position of the lead tip of an electronic component inserted into a board, a nearly parallel light beam is used, the thickness of the light beam is limited, and the main body of the component is not illuminated.
A method for illuminating the tip of an electronic component lead, characterized in that only the tip of the lead is illuminated.