JPS58130595A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention (a) is a method for producing a printed circuit board, particularly in the manufacturing process of a printed wiring board, and is characterized by "Solmer resist printing"
This is a method of coating Ushiyama T on the entire surface of the masking tube, etc., except for the ny'cm portion of the edge masking.

The manufacturing method of through-hole printed wiring boards, which is carried out on a regular basis, allows through-holes to be formed after drilling, thereby forming an inexpensive circuit. Then, on this circuit, VC solder resist) t-
1ft of printing is applied by the baking method, and after the parts are mounted, Ushida is sometimes selectively applied on the solder r@, to connect with S products, improve the reliability of through holes, and prevent copper corrosion. There is 0C
(1) When the steel surface of the soldering surface is oxidized and contaminated, it is not possible to apply enough bander to the steel. T: It is not perfect for preventing scratches, connection with parts, through-hole reliability, and corrosion of copper. Therefore, we decided to apply a smooth and damp solder to Jin's steel plate ↓ to solve the above problem, and there are solder plating methods and hot air leveling methods, but the hot air leveling method is often used due to economic efficiency. I am doing @
This method involves printing a solder resist on a printed wiring board after circuit formation or performing edge masking on a masking chip.
t7t is a method of hot air leveling by immersing the board in molten solder for the purpose of quickly coating the entire surface except for the part 7.
Temperature is 0°C.
There were times when I would give a love oath to the board, such as hot tears, ξ-zuring, etc. As a counterweight to this, 7 lacs of cloth was used to punish the board by dipping it in pre-melted solder.
Yc pre-preparation *7JU to achieve surface TNA degree of 0 to 100℃
A method of immersing in hot water and molten solder is also used in some cases.
The device has a complex structure (there are six problems with maintenance and difficulty).The purpose is to prevent the influence of metallurgy, etc., which occurs due to hot tearing when suddenly removed from the main board. ?This relates to improvements in the heat-of-mouth method.

In response to the unexploited 91a request, Shun Sugitori fabricated a substrate with through-holes, which was shortened in advance to form a quick-release resist for the next pattern, and immersed the board in FJIJ processing solution, which was kept at a high temperature above room temperature. It is characterized by being immersed in molten clay and leveled with hot air.

That is, in the present invention, the amount of solder is usually 20℃ before immersion in solder.
) The place where the board is placed in 72x is 70~10
Soak in slacks for 1 second to 6 minutes at 0°C, and then soak in molten Ushida Gaya at 220 to 260°C for 6 seconds.
The whole analogy is immersion in darkness for 50 seconds and then hot air for 1■/J.
The sprayed solder is leveled in the range of ~6/- and air-cooled for nine times.

The present invention will be explained in detail by way of Examples below.

After forming the example circuit, the substrate was heated to 70 to 100°C and placed in 7T7 flux (for example, water-soluble rosin thread flux) for 1 second to 100°C.
After dipping for 5 minutes and raising the temperature of the substrate,
Immerse it in a #I&l morning bath at 0°C and then add 1 kg/7~
Remove excess solder by pulling up the board while blowing air from a 6 kg/pan fan, and coat the solder of several microns to several tens of microns on the steel such as the engineering land inside the through hole.・Unformally 151i! The heat resistance of the remaining 2Ii'a was evaluated and the results are shown in Table 1.As explained above, it is possible to uninventively accomplish the two purposes of slack application and preheating at the same time with one stroke. In other words, the manufacturing method according to the present invention improves the instantaneous property and minimizes the amount of q to the substrate during lW1, improving the gi axis property [Φ90]. Although it is simple, it has become a problem in the past when using Tomo Senda coating A4! By solving the impact on i, it is possible to provide inexpensive and reliable printing M82r.O Agent Patent Attorney Kuni Wakabayashi

Claims (1)

[Claims] 1. Form the circuit on the board with the through holes attached b)
Form a solder resist of humid ILL butter, put it on a pre-preparation mgK island plate at a height higher than a sill, dip it in the bath, and put it in hot air. A method for manufacturing a printed wiring board using leveling and t% copying.