JPS58130266A - Uneven pattern forming method by plating - Google Patents

Uneven pattern forming method by plating

Info

Publication number
JPS58130266A
JPS58130266A JP1393382A JP1393382A JPS58130266A JP S58130266 A JPS58130266 A JP S58130266A JP 1393382 A JP1393382 A JP 1393382A JP 1393382 A JP1393382 A JP 1393382A JP S58130266 A JPS58130266 A JP S58130266A
Authority
JP
Japan
Prior art keywords
metal body
matrix
plating
uneven pattern
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1393382A
Other languages
Japanese (ja)
Other versions
JPS634633B2 (en
Inventor
Hiroyuki Koike
弘之 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TANAZAWA HATSUKOUSHIYA KK
Original Assignee
TANAZAWA HATSUKOUSHIYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TANAZAWA HATSUKOUSHIYA KK filed Critical TANAZAWA HATSUKOUSHIYA KK
Priority to JP1393382A priority Critical patent/JPS58130266A/en
Publication of JPS58130266A publication Critical patent/JPS58130266A/en
Publication of JPS634633B2 publication Critical patent/JPS634633B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To form uneven patterns simply by plating by immersing a metallic body in plating liquid, bringing a matrix provided with uneven patterns on the surface into contact with the metallic body, contacting the convex part repeatedly and preventing adhesion of plating to the pressed part of the metallic body. CONSTITUTION:An electrode is provided in a tank 41 containing a plating liquid 4, and a cylindrical metallic body 3 is installed rotatably so that its lower part is immersed in the plating liquid 4. A supporting axis 12 is fitted into a through- hole 11 of a cylindrical matrix 1 having uneven patterns 2 on its outer peripheral face. An energizing device such as a spring is connected to the axis 12, and the matrix 1 is energized to the metallic body 3 to press it against the metallic body 3. When the metallic body 3 and the matrix 1 are rotated in the reverse direction at low speed, the convex part on the surface of the matrix 1 presses the metallic body 3, and obstructs progress of adhesion of plating to the pressed part. Accordingly, plating adheres little on the part of the metallic body 3 that comes into contact with the convex part of the matrix 1, and a thick layer of plating is formed on the part that comes into contact with the concave part.

Description

【発明の詳細な説明】 本発明は金属体の表面にメッキによって凹凸模様を形成
する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming an uneven pattern on the surface of a metal body by plating.

出願人は金属体を腐蝕液に漬は該金属体に対し表面に凹
凸模様を具えた母型を繰り返し当てることにより、金属
体に母型の凹凸とは逆の凹凸模様を形成する方法を以前
に提出した(特願昭56−68748号)。
The applicant has previously proposed a method of forming a pattern of depressions and depressions on the metal body that is opposite to the pattern of depressions and depressions on the surface of the metal body by immersing the metal body in a corrosive solution and repeatedly applying a pattern of protrusions and depressions on the surface of the metal body to the metal body. (Patent Application No. 56-68748).

上記方法は精密且つ深い凹凸模様が簡単に形成出来る利
点があったが、加工した金属体をエンボス加工用等の版
を使用する際、表面にメッキ加工を施さなければならず
、手間が掛かる問題があった。
The above method has the advantage of being able to easily form precise and deep uneven patterns, but when using a plate for embossing the processed metal object, the surface must be plated, which is a time-consuming problem. was there.

本発明はメッキ液に漬けた金属体に対し、表面に凹凸模
様を形成した母型を繰り返し押圧することにより、金属
体の母型の凸部に接する部分に対しメッキの付着進行を
阻冨して金属体にメッキ層の厚みのバラツキによる凹凸
模様を形成する方法を提供し、加工工程の簡素化を画る
ことを目的とする。
The present invention prevents the progress of plating on the parts of the metal body that are in contact with the convex portions of the matrix by repeatedly pressing a matrix with an uneven pattern on the surface against a metal body immersed in a plating solution. The purpose of this invention is to provide a method for forming an uneven pattern on a metal body due to variations in the thickness of a plating layer, and to simplify the processing process.

以下図面に示す実施例に基づき、本発明を4体的に説明
する。
The present invention will be described in detail below based on embodiments shown in the drawings.

第1図は本発明に使用する母型(1)を示しており、該
母型はメッキ液に侵されない樹脂又は合金で円筒状に形
成され、外周面に凹凸模様(2)を表わしている。
Figure 1 shows a matrix (1) used in the present invention, which is formed into a cylindrical shape from a resin or alloy that is not attacked by the plating solution, and has an uneven pattern (2) on its outer peripheral surface. .

本実施例の凹凸模様(2)は展開すると第2図の様に例
えば世界地図となり、海、平野、山が凹凸で精密に表わ
されている。凹凸模様はその他のシボ加工模様等、任意
のものが実施出来る。
When the uneven pattern (2) of this embodiment is expanded, it becomes, for example, a world map as shown in FIG. 2, in which the sea, plains, and mountains are precisely represented by unevenness. Any other uneven pattern, such as other textured patterns, can be implemented.

第3図は加工されるべき金属体(3)を示しており、該
金属体(3)の直径は前記母型(1)の最大径に略等し
く、全長は母型(1)の全長に等しい。
Figure 3 shows a metal body (3) to be machined, the diameter of the metal body (3) is approximately equal to the maximum diameter of the matrix (1), and the total length is equal to the total length of the matrix (1). equal.

金属体(3)の表面には脱脂等の活性化処理を施す金属
体(3)は加工されるべき面が金属であれば可く、必ら
ずしも全体が金属である必要はない。
The surface of the metal body (3) is subjected to activation treatment such as degreasing.The surface of the metal body (3) to be processed may be metal, and does not necessarily need to be made entirely of metal.

第4図は加工方法を示しており、硫酸銅溶液等のメッキ
液(4)を容れた槽f41)中に電極(図示せず)を配
備すると共に、金属体(3)をその下部がメッキ液(4
)に漬かる様に回転自由に配備する。
Figure 4 shows the processing method, in which an electrode (not shown) is placed in a tank f41) containing a plating solution (4) such as a copper sulfate solution, and the lower part of the metal body (3) is plated. liquid (4
) so that it can rotate freely.

母型(1)の貞通孔Lll)へ支持軸02+を嵌め、該
軸0zにスプリング等の付勢手段(図示せず)を連繋し
て支持軸u2従って母型(1)を金属体(3)に向けて
付勢し金属体(3)に押圧接触させる。
The support shaft 02+ is fitted into the through hole Lll of the mother mold (1), and a biasing means (not shown) such as a spring is connected to the shaft 0z, so that the support shaft U2 and the mother mold (1) are connected to the metal body (3). ) and press it into contact with the metal body (3).

上記状態にして、母型(1)、金属体(3)の何れか一
方或は両方を回転駆動装置(図示せず)に連繋し互いに
逆方向に低速で回転させる。
In the above state, either or both of the mother mold (1) and the metal body (3) are connected to a rotary drive device (not shown) and rotated at low speed in opposite directions.

金属体(3)の直径が50閣程度であれば3〜5秒間に
1回転する速度で可い。
If the diameter of the metal body (3) is about 50 mm, a rotation speed of 1 rotation every 3 to 5 seconds is sufficient.

この時、母型(1)の表面の凸部が金属体(3)を押圧
して金属体(3)の被押圧部へのメッキ付着作用の進行
を妨げる。
At this time, the convex portion on the surface of the matrix (1) presses the metal body (3) and prevents the plating from adhering to the pressed portion of the metal body (3).

母型(1)及び金属体(3)が回転を続けることにより
金属体表面の母型(1)の凹部に対応する部分には厚く
メッキ層が形成されるが、母型(1)の凸部が当る部分
には殆んどメッキは付着せず、終いにはメッキ層の厚み
のバラツキによって金属体(3)に母型(1)の凹凸模
様とは立体的な凹凸が逆な凹凸模様が形成される。
As the matrix (1) and the metal body (3) continue to rotate, a thick plating layer is formed on the surface of the metal body corresponding to the concave portion of the matrix (1), but the convexity of the matrix (1) Almost no plating adheres to the areas where the parts touch, and in the end, due to variations in the thickness of the plating layer, the metal body (3) has unevenness that is three-dimensional unevenness that is the opposite of the uneven pattern of the matrix (1). A pattern is formed.

尚、母型(1)にシリコンオイルの如く、メッキ付着作
用を阻害する液を塗布しておけば、金属体(3)上の母
型(1)の凸部に接する部分にシリコンオイルが転移さ
れ、該部分へのメッキ付着に対する限外効果は大きく、
一層間凸模様が明瞭に表われる。
In addition, if a liquid that inhibits plating adhesion, such as silicone oil, is applied to the matrix (1), the silicone oil will transfer to the part of the metal body (3) that is in contact with the convex part of the matrix (1). , and the ultrasonic effect on plating adhesion to the part is large,
A convex pattern between layers is clearly visible.

又、金属体(3)を母型(1)に接することなくメッキ
液(4)に漬けて金属体表面に一様厚みのメッキ1急を
形成し、その後、前記の如く母型(1)を金属体に当て
つつメッキを行なうことも出来る。この場合、金属体(
3)の表面に地金が露出した侭、残ることはない。
Also, the metal body (3) is immersed in the plating solution (4) without coming into contact with the matrix (1) to form a plating layer of uniform thickness on the surface of the metal body, and then the matrix (1) is coated as described above. It is also possible to perform plating while applying the metal to the metal body. In this case, the metal body (
3) No bare metal remains on the surface.

第5図〜第8図は他の実施例を示しており、第5図は板
状の母型(1)で円筒状金属体(3)に凹凸模様を形成
する方法を示している。
5 to 8 show other embodiments, and FIG. 5 shows a method of forming an uneven pattern on a cylindrical metal body (3) using a plate-shaped matrix (1).

下面に凹凸模様を形成した板状母型(1)は横往復装置
(5)に連繋されており、メッキ液(4)に下半分を漬
けた円筒状金属体(3)の上面を擦りつつ、溝に繰り返
し往復動する。
A plate-shaped matrix (1) with an uneven pattern formed on its lower surface is connected to a horizontal reciprocating device (5), and is rubbed against the upper surface of a cylindrical metal body (3) whose lower half is dipped in a plating solution (4). , reciprocating repeatedly in the groove.

第6図は板状母型(1)で、板状金属体(3)に凹凸模
様を形成する方法を示している。
FIG. 6 shows a method of forming an uneven pattern on a plate-shaped metal body (3) using a plate-shaped matrix (1).

下面に凹凸模様を形成した板状母型(1)は上下往復装
置61)に連繋されており、メッキ液(4)に漬けた板
状金属体(3)に対して押圧接触と離間を繰り返す第7
図は円筒状母型+1)で板状金属体(3)に凹凸模様を
形成する方法を示している。
A plate-shaped matrix (1) with an uneven pattern formed on its lower surface is connected to a vertical reciprocating device 61), and is repeatedly pressed into contact with and separated from a plate-shaped metal body (3) immersed in a plating solution (4). 7th
The figure shows a method of forming an uneven pattern on a plate-shaped metal body (3) using a cylindrical matrix (+1).

メッキf&+4+に漬けた板状金属体(3)上を、外周
に凹凸模様を形成した円筒状母型(1)を転動させつつ
横方向に往復移動させるのである。
A cylindrical master mold (1) having an uneven pattern formed on its outer periphery is rolled and reciprocated in the lateral direction over a plate-shaped metal body (3) soaked in plating f&+4+.

第8図は被加工面全体が太き(凹んでいる金属体(3)
に凹凸模様を形成する方法を示している。
Figure 8 shows that the entire surface to be machined is thick (concave metal body (3)
shows a method of forming an uneven pattern.

金属体(3)の被加工面Gl)は、金属体(3)の鋳造
成形と同時に或は切削等の前加工によって碗状に凹ませ
ておく。
The processed surface Gl) of the metal body (3) is recessed into a bowl shape at the same time as the metal body (3) is cast, or by pre-processing such as cutting.

母型(1)は金属体(3)の被加工面Gl+の大きな凹
みに対応して膨らんでおり、該膨らみ部u3)の表面に
抜は勾配の凹凸模様(2)を形成している。
The matrix (1) is bulged in correspondence with the large depression on the processed surface Gl+ of the metal body (3), and an uneven pattern (2) with a vertical slope is formed on the surface of the bulge U3).

金属体(3)をメッキ液(4)に漬け、母型(1)を上
下往復装置6υによって繰り返し金属体(3)の被加工
面−に押圧する。
The metal body (3) is immersed in the plating solution (4), and the master die (1) is repeatedly pressed against the surface to be processed of the metal body (3) by the up-and-down reciprocating device 6υ.

の実施例と同様にして、金属体(3)表面の母型11)
の凸部に対応する部分はメッキ付着が阻害され、凹部に
対応する部分にはメッキが厚く付着することにより一1
凹凸模様が形成されるのである。
In the same manner as in the example, the matrix 11) on the surface of the metal body (3) is
The plating adhesion is inhibited in the areas corresponding to the convex parts, and the plating adheres thickly in the areas corresponding to the concave parts.
An uneven pattern is formed.

本発明は上記の如く、表面に凹凸模様を形成した母型(
1)を繰り返し金属体(3)に押圧して、金・置体(3
)上の母型の凸部が当たる部分と他の部分とにメッキ層
の厚さにバラツキを生じさせて、母型・1)の凹凸模様
とは凹凸が逆の模様が簡単に形成出来る尚、本発明は上
記構成に限定されることはなく特許請求の範囲に記載の
技術範囲内で種々の変形が可能であるのは勿論である。
As described above, the present invention provides a matrix (
Repeat 1) to press the metal object (3) to remove the metal object (3).
) By creating variations in the thickness of the plating layer between the part where the convex part of the upper matrix touches and the other parts, it is possible to easily form a pattern in which the convexes and convexities are opposite to the concave and convex pattern of the matrix 1). However, it goes without saying that the present invention is not limited to the above-mentioned configuration, and that various modifications can be made within the technical scope of the claims.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は母型の斜面図、第2図は母型表面の展開図、第
3図は金属体の斜面図、第4図はメッキ方法の説明図、
第5図〜gJ8図は他の実施例の説明図である。
Figure 1 is a slope view of the matrix, Figure 2 is a developed view of the surface of the matrix, Figure 3 is a slope view of the metal body, Figure 4 is an explanatory diagram of the plating method,
FIGS. 5-gJ8 are explanatory diagrams of other embodiments.

Claims (1)

【特許請求の範囲】 ■ 加工すべき金属体をメッキ液に漬け、表面に凹凸模
様を具えた母型を金属体に接触させて母型の凸部で金属
体表面を繰り返して接触させることにより、金属体の被
押圧部へのメッキ付着作用の進行を妨げ、金属体の被押
圧部以外の部分のメッキ層の厚さを増して金属体の表面
にメッキ層の厚みのバラツキによる凹凸模様を形成する
ことを特徴とするメッキによる凹凸模様形成方法。 ■ 母型及び金属体は円筒状であって、接触状態にて回
転自由に配備され、夫々逆方向に回転しつつ母型が金属
体を押圧する特許請求の範囲第1項に記載のメッキによ
る凹凸模様形成方法。 ■ 母型及び金属体は板状であって、母型と金属体は接
触、離間を繰り返して母型が金属体を押圧する特許請求
の範囲第1項に記載のメッキによる凹凸模様形成方法。 ■ 母型は円筒状、金属体は板状であって、母型が金属
体上を転動しつつ金属体を押圧する特許請求の範囲第1
項に記載のメッキによる凹凸模様形成方法。 ■ 母型は板状、金属体は円筒状であって、母型が金属
体と接しつつ横方向に往復移動しながら金属体を押圧す
る特許請求の範囲第1項に記載のメッキによる凹凸模様
形成方法。 ■ 母型は一部がメッキ槽に漬かっている特許請求の範
囲第2項又は第4項に記載のメッキによる凹凸模様形成
方法。 ■ 母型にはシリコンオイル等、メッキ付着を阻害する
作用のある液が塗布されている特許請求の範囲第1項乃
至11J6項の何れかに記載のメッキによる凹凸模様形
成方法。 ■ 金属体の表面に一様厚みにメッキ層を形成した後、
母型を金属体表面に繰り返し押圧する特許請求の範囲第
1項乃至第7項の何れかに記載のメッキによる凹凸模様
形成方法。
[Claims] ■ By immersing the metal body to be processed in a plating solution, bringing a matrix with an uneven pattern on the surface into contact with the metal body, and repeatedly bringing the surface of the metal body into contact with the convex portions of the matrix. This prevents the progress of plating adhesion to the pressed part of the metal body, increases the thickness of the plating layer on parts of the metal body other than the pressed part, and creates an uneven pattern on the surface of the metal body due to variations in the thickness of the plating layer. A method for forming an uneven pattern by plating, characterized by forming an uneven pattern. ■ The matrix and the metal body are cylindrical and are arranged in contact with each other so as to freely rotate, and the matrix presses the metal body while rotating in opposite directions. A method for forming an uneven pattern. (2) The method for forming an uneven pattern by plating according to claim 1, wherein the matrix and the metal body are plate-shaped, and the matrix and the metal body are repeatedly brought into contact and separated from each other so that the matrix presses the metal body. ■ The matrix is cylindrical, the metal body is plate-shaped, and the matrix presses the metal body while rolling on the metal body.Claim 1
A method for forming an uneven pattern by plating as described in . ■ The pattern of protrusions and recesses formed by plating according to claim 1, wherein the matrix is plate-shaped and the metal body is cylindrical, and the matrix is in contact with the metal body and presses the metal body while reciprocating in the lateral direction. Formation method. (2) A method for forming an uneven pattern by plating according to claim 2 or 4, wherein a part of the mother mold is immersed in a plating bath. (2) The method for forming an uneven pattern by plating according to any one of claims 1 to 11J6, wherein the mother mold is coated with a liquid having the effect of inhibiting plating adhesion, such as silicone oil. ■ After forming a plating layer with a uniform thickness on the surface of the metal object,
8. A method for forming an uneven pattern by plating according to any one of claims 1 to 7, wherein a matrix is repeatedly pressed onto the surface of a metal body.
JP1393382A 1982-01-28 1982-01-28 Uneven pattern forming method by plating Granted JPS58130266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1393382A JPS58130266A (en) 1982-01-28 1982-01-28 Uneven pattern forming method by plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1393382A JPS58130266A (en) 1982-01-28 1982-01-28 Uneven pattern forming method by plating

Publications (2)

Publication Number Publication Date
JPS58130266A true JPS58130266A (en) 1983-08-03
JPS634633B2 JPS634633B2 (en) 1988-01-29

Family

ID=11846988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1393382A Granted JPS58130266A (en) 1982-01-28 1982-01-28 Uneven pattern forming method by plating

Country Status (1)

Country Link
JP (1) JPS58130266A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128100U (en) * 1987-02-16 1988-08-22
JP2007051762A (en) * 2005-07-22 2007-03-01 Yokogawa Electric Corp Connecting shaft and angle sensor using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128100U (en) * 1987-02-16 1988-08-22
JP2007051762A (en) * 2005-07-22 2007-03-01 Yokogawa Electric Corp Connecting shaft and angle sensor using the same

Also Published As

Publication number Publication date
JPS634633B2 (en) 1988-01-29

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