JPS634633B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming an uneven pattern on the surface of a metal body by plating.

The applicant has previously developed a method of forming a pattern of depressions and depressions on a metal body that is opposite to that of the matrix by soaking the metal body in a corrosive solution and repeatedly applying a matrix with a pattern of depressions and depressions on the surface of the metal body. Submitted (Special application 1984-
No. 68748).

The above method has the advantage of being able to easily form a precise and deep uneven pattern, but when using a plate for embossing the processed metal object, the surface must be plated, which is a time-consuming problem. It was hot.

The present invention inhibits the progress of plating on the parts of the metal body that are in contact with the convex portions of the matrix by repeatedly pressing a matrix with an uneven pattern on the surface against a metal body immersed in a plating solution. The purpose of the present invention is to provide a method for forming an uneven pattern on a metal body by varying the thickness of a plating layer, and to simplify the processing process.

The present invention will be specifically described below based on embodiments shown in the drawings.

FIG. 1 shows a mother mold 1 used in the present invention, which is formed into a cylindrical shape from a resin or alloy that is not attacked by plating liquid, and has an uneven pattern 2 on its outer peripheral surface.

When the uneven pattern 2 of this embodiment is developed, it becomes, for example, a world map as shown in FIG. 2, in which the sea, plains, and mountains are precisely represented by unevenness. Any other uneven pattern, such as other textured patterns, can be implemented.

FIG. 3 shows a metal body 3 to be machined, the diameter of which is approximately equal to the largest dimension of the matrix 1, and its total length equal to the total length of the matrix 1.

The surface of the metal body 3 is subjected to activation treatment such as degreasing.

The metal body 3 can be used as long as the surface to be processed is metal, and the entire metal body 3 does not necessarily need to be made of metal.

FIG. 4 shows the processing method, in which an electrode (not shown) is placed in a tank 41 containing a plating liquid 4 such as a copper sulfate solution, and the lower part of the metal body 3 is immersed in the plating liquid 4. It can be freely rotated.

A support shaft 12 is fitted into the through hole 11 of the mother mold 1, and a biasing means (not shown) such as a spring is connected to the shaft 12 to urge the support shaft 12 and therefore the mother mold 1 toward the metal body 3. and press it into contact with the metal body 3.

In the above state, either or both of the mother die 1 and the metal body 3 are connected to a rotation drive device (not shown) and rotated at low speed in opposite directions.

If the diameter of the metal body 3 is about 50 mm, a rotation speed of 1 rotation every 3 to 5 seconds is sufficient.

At this time, the convex portion on the surface of the matrix 1 presses the metal body 3 and prevents the plating from adhering to the pressed portion of the metal body 3.

As the matrix 1 and the metal body 3 continue to rotate, a thick plating layer is formed on the surface of the metal body in areas corresponding to the concave portions of the matrix 1, but almost no plating layer is formed on the areas where the convex portions of the matrix 1 contact. The plating does not adhere, and eventually the matrix 1 is attached to the metal body 3 due to variations in the thickness of the plating layer.
A concavo-convex pattern with three-dimensional concavities and convexities opposite to the concavo-convex pattern is formed.

In addition, if a liquid that inhibits plating adhesion, such as silicone oil, is applied to the matrix 1, the metal body 3
The silicone oil is transferred to the portions of the upper matrix 1 that are in contact with the convex portions, and the effect of preventing plating from adhering to these portions is large, and the uneven pattern appears even more clearly.

Also, the metal body 3 is immersed in the plating liquid 4 without coming into contact with the matrix 1 to form a plating layer of uniform thickness on the surface of the metal body, and then plating is performed while the matrix 1 is applied to the metal body as described above. You can also do that. in this case,
No bare metal remains exposed on the surface of the metal body 3.

5 to 8 show other embodiments, and FIG. 5 shows a method of forming an uneven pattern on a cylindrical metal body 3 using a plate-shaped matrix 1.

A plate-shaped master mold 1 having an uneven pattern formed on its lower surface is connected to a lateral reciprocating device 5, and repeatedly reciprocates laterally while rubbing the upper surface of a cylindrical metal body 3 whose lower half is soaked in plating liquid 4.

FIG. 6 shows a method for forming an uneven pattern on a plate-shaped metal body 3 using a plate-shaped matrix 1.

A plate-shaped master mold 1 having an uneven pattern formed on its lower surface is connected to a vertically reciprocating device 51, and repeatedly presses into contact with and separates from a plate-shaped metal body 3 immersed in a plating liquid 4.

FIG. 7 shows a method of forming an uneven pattern on a plate-shaped metal body 3 using a cylindrical master mold 1. As shown in FIG.

A cylindrical master die 1 having an uneven pattern formed on its outer periphery is rolled and reciprocated in the lateral direction over a plate metal body 3 soaked in plating liquid 4.

FIG. 8 shows a method for forming an uneven pattern on a metal body 3 whose entire surface to be processed is largely concave.

The processed surface 31 of the metal body 3 is recessed into a bowl shape at the same time as the metal body 3 is cast or formed by pre-processing such as cutting.

The mother mold 1 is bulged to correspond to the large depression on the processed surface 31 of the metal body 3, and an uneven pattern 2 having a draft slope is formed on the surface of the bulge 13.

The metal body 3 is immersed in the plating liquid 4, and the master mold 1 is repeatedly pressed against the surface 31 of the metal body 3 to be machined by the up-and-down reciprocating device 51.

In each of the embodiments shown in FIGS. 5 to 8, the mother mold 1 on the surface of the metal body 3 is formed in the same manner as the embodiment shown in FIG.
Plating adhesion is inhibited on the part corresponding to the convex part,
The plating thickly adheres to the areas corresponding to the recesses, forming an uneven pattern.

As described above, the present invention involves repeatedly pressing the matrix 1 having an uneven pattern on the surface against the metal body 3 to form a thick plating layer on the part of the metal body 3 that is in contact with the protrusions of the matrix and other parts. By causing variations in the pattern, a pattern with unevenness that is opposite to that of the mother die 1 can be easily formed.

It goes without saying that the present invention is not limited to the above configuration, and that various modifications can be made within the technical scope of the claims.

[Brief explanation of the drawing]

Figure 1 is a slope view of the matrix, Figure 2 is a developed view of the surface of the matrix, Figure 3 is a slope view of the metal body, Figure 4 is an explanatory diagram of the plating method, and Figures 5 to 8 are other illustrations. It is an explanatory view of an example of. 1...Mother mold, 3...Metal body.

Claims (1)

[Scope of Claims] 1. A metal body to be processed is immersed in a plating solution, a matrix with a pattern of protrusions and recesses on the surface is brought into contact with the metal body, and the same surface of the metal body is repeatedly pressed with the convex portions of the matrix. This prevents the progress of plating adhesion to the pressed part of the metal body, increases the thickness of the plating layer on parts of the metal body other than the pressed part, and prevents variations in the thickness of the plating layer on the surface of the metal body. A method for forming an uneven pattern by plating, characterized by forming an uneven pattern. 2. The matrix and the metal body are cylindrical and are arranged in contact with each other so as to freely rotate, and the matrix presses the metal body while rotating in opposite directions. A method for forming an uneven pattern. 3. The method for forming an uneven pattern by plating according to claim 1, wherein the matrix and the metal body are plate-shaped, and the matrix and the metal body are repeatedly brought into contact and separated from each other so that the matrix presses the metal body. 4. The method for forming an uneven pattern by plating according to claim 1, wherein the matrix is cylindrical and the metal body is plate-shaped, and the matrix presses the metal body while rolling on the metal body. 5. The uneven pattern by plating according to claim 1, wherein the matrix is plate-shaped and the metal body is cylindrical, and the matrix is in contact with the metal body and presses the metal body while reciprocating in the lateral direction. Formation method. 6. The method for forming an uneven pattern by plating according to claim 2 or 4, wherein a part of the matrix is immersed in a plating bath. 7. The method for forming an uneven pattern by plating according to any one of claims 1 to 6, wherein the matrix is coated with a liquid such as silicone oil that has the effect of inhibiting plating adhesion. 8. A method for forming an uneven pattern by plating according to any one of claims 1 to 7, which comprises forming a plating layer with a uniform thickness on the surface of a metal body, and then repeatedly pressing a matrix onto the surface of the metal body. .