JPS5812754A - Manufacture of laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention mainly relates to a method for manufacturing a laminate in which a metal foil such as a copper foil is laminated on the surface thereof, and more specifically, a metal foil such as a copper foil ( A method for producing a laminate in which a laminate material (3) on which 2) has been laid is heated and pressed between a mold 14) and a hot platen (5), the method comprising: A second metal plate (7) is interposed between the laminate material (3) and the mold (4), and the first metal plate (6) is interposed between the first metal plate (6) and the first metal plate (6).
This relates to a method for manufacturing a laminate, characterized in that the coefficient of thermal expansion of the second metal plate 7) is made larger than the coefficient of thermal expansion of the second metal plate 7).

Conventionally, in a method for manufacturing a laminate in which a metal foil such as copper foil is laid on at least one surface of the base material, the laminate material is heated and pressurized between a metal receiving mold and a hot platen. and,
A metal plate made of the same material and having the same thickness was interposed between the laminate material and the mold. However, with this manufacturing method, there is a difference in thermal expansion between the metal plate closer to the heating plate and the metal plate farther from the heating plate, and the metal plate closer to the heating plate expands more. The disadvantage was that if the laminates were warped, they would become twisted.

The present invention has been made in view of these conventional drawbacks, and its purpose is to provide a method for manufacturing a laminate that can suppress warping and twisting of the laminate through simple improvements. be.

〇, which will be described in detail below based on the drawings of the apparatus implementing the method of the present invention, is a multi-animal laminated structure. Metal foils such as copper foil +21121 are respectively laminated on the upper and lower surfaces of the base material f1+ to form a laminate material (3). The laminate material + 3) is cured by heating and pressurizing the laminate material (+3) with the hot platen (6) and the mold 14).
A first metal plate (1θ) is interposed between the mold (4) and the laminate material (3).
7) is interposed. Then, the coefficient of thermal expansion of the second metal plate (7) is made larger than the coefficient of thermal expansion of the first metal plate (6). Specifically, the first metal plate +6+f
:1B chrome, and the second metal plate (7) is 17 chrome-7 nickel ((ASTM standard 801 (JIS standard 5)
Figure 2 shows a second embodiment, in which a copper foil is laminated as a metal foil (2) only on the upper surface of the base U'i1+ as a laminate material (3).

As an example, an adhesive was applied to one side of a copper foil having a thickness of 85 microns and allowed to dry. The base material (1) is made by adhering phenol varnish with a solid content of 50 heavy fibers to kraft paper with a thickness of α1%, and after drying, the phenol varnish with a solid content of 50 yen is layered to a thickness of 1.6% and formed. Pressure (50Kg/crA, 150
The mixture was heated and pressurized at ℃ for 60 minutes, and then cooled. In such a case, in the embodiment shown in FIG. 1 (double-sided copper-clad laminate), 10
The warpage rate with respect to 00% was 8. In the example shown in FIG. 2 (single-sided copper-clad laminate), the warpage rate was 8. Further, in the comparative example shown in FIG. 8 (a double-sided steel laminated board, the first and second gold maple plates were made of 18 chrome), the warpage rate was 5. In addition, the comparative example shown in Fig. 4 (one-sided steel laminated board, the first and second metal plates were made of 18 chromium)
In this case, the warpage rate was 10.

In summary, the present invention provides a first
A second metal plate is interposed between the laminate material and the mold, and the coefficient of thermal expansion of the second gold plate is made thicker than that of the first metal plate. In other words, the coefficient of thermal expansion of the second metal plate, which is far from the hot plate and has little thermal influence, is 1; it is larger than the coefficient of thermal expansion of the first metal plate, which is close to the hot plate and has a large thermal influence. , it is possible to suppress the generation of a difference in thermal expansion between the first metal plate and the second metal plate, and as a result, there is an advantage that the sandwiched laminate material is not warped or twisted.

[Brief explanation of the drawing]

FIG. 1 shows a cross-sectional medical device (4
) is the receiving mold, (6) is the heating plate, (6) is the first metal plate,
(7) is a second metal plate. Agent Patent Attorney Ishi 1) Choshichi

Claims (1)

[Claims] fx) A method for manufacturing a laminate in which a laminate material having a metal foil such as copper foil laid on at least one surface of the base material is heated and pressed between a mold and a hot plate, the method comprising: A first metal plate is interposed between them, and a second metal plate is interposed between the laminate material and the receiving mold, so that the coefficient of thermal expansion of the second metal plate is larger than the coefficient of thermal expansion of the first metal plate. A method for manufacturing a laminate, characterized by the following.