JPS5812749A - Manufacture of metallic plate base laminated board - Google Patents
Manufacture of metallic plate base laminated boardInfo
- Publication number
- JPS5812749A JPS5812749A JP11122081A JP11122081A JPS5812749A JP S5812749 A JPS5812749 A JP S5812749A JP 11122081 A JP11122081 A JP 11122081A JP 11122081 A JP11122081 A JP 11122081A JP S5812749 A JPS5812749 A JP S5812749A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- plate
- metal
- plate base
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- 239000011888 foil Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はづリント配線板などに用いられる金属板ベース
積層板の製造方法に関し、金属板（１１の片面に酸化層
＋２１を形成すると共に他の片面を粗面化し、この粗面
（３）側に接着層（４）を介して金属箔張積層板（５）
を貼付けることを特徴とする金属板ベース積層板の製造
方法に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a metal plate-based laminate used for lint wiring boards, etc., which includes forming an oxide layer +21 on one side of a metal plate (11) and roughening the other side; A metal foil-clad laminate (5) is placed on this rough surface (3) side via an adhesive layer (4).
The present invention relates to a method for manufacturing a metal plate-based laminate, characterized by pasting a metal plate base laminate.
銅箔などの金属箔を有しこの金属箔に回路パターンを形
成したプリント配線板にあって、放熱性を良くするため
に金属箔張積層板（５）の金属箔（６）と反対側面に金
属板（１）をベースとして貼付けて使用する場合がある
。この場合、金属板（１）の表面を絶縁化すると共に表
面腐蝕を防止し、さらに表面を保護する等の目的から金
属板（１）の表裏面に金属酸化物の層（２）を形成する
ことが行なわれる。しかし金属板（１）を接着ｊ＠（４
）を介して金属箔張積層板（５）に接着する番こあたっ
ては金属板ｆｌ＋の接着強度を向上させるために金属板
ｆｉｌの表面を粗面化する必要があるが、第１図のよう
に金属板ｆ１）の表裏両面には酸化層＋２１が形成され
ていて硬度が高いために十分な粗面（３）が形成できず
、従って接着層（４）と金属板（１）との接着性が悪く
金属板ｆｌｌと金属箔張積層板（５１との接着強度を十
分に得ることかできないという問題があった。A printed wiring board has a metal foil such as copper foil and a circuit pattern is formed on this metal foil, and in order to improve heat dissipation, a metal foil clad laminate (5) is placed on the opposite side of the metal foil (6). The metal plate (1) may be used as a base by pasting it. In this case, a metal oxide layer (2) is formed on the front and back surfaces of the metal plate (1) for the purpose of insulating the surface of the metal plate (1), preventing surface corrosion, and further protecting the surface. things will be done. However, the metal plate (1) is glued＠(4
), it is necessary to roughen the surface of the metal plate fil in order to improve the adhesive strength of the metal plate fl+. As shown, oxide layers +21 are formed on both the front and back surfaces of the metal plate f1), and due to their high hardness, it is not possible to form a sufficiently rough surface (3), and therefore the bond between the adhesive layer (4) and the metal plate (1) is There was a problem in that adhesive strength was poor and sufficient adhesive strength between the metal plate fl1 and the metal foil clad laminate (51) could not be obtained.
本発明は上記の点に鑑みてなされたものであって、金属
板を金属箔張積層板に接着強度高く接着させることがで
きる金属板ベース４４＝告嚇積層板の製造方法を提供す
ることを目的とするものである。The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing a metal plate base 44 = warning laminate that can bond a metal plate to a metal foil-clad laminate with high adhesive strength. This is the purpose.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
金属板（１）としては厚み１ ｓｍ前后のアＩｂ Ｅニ
ウム板、ステンレス鋼板、ニッケル板、鉄板などを用い
ることができ、片面にば酸化層／ＩＭを塗布するなどの
処理で金属酸化物の酸化層（２）が形成し“てあυ、他
の片面には酸化層（２）を形成せずサシドづラスト法な
ど任意周知の手段で粗面化１７て粗面（３）が形成しで
ある。この粗面（３１ｆｉｌｌ ＄で一＄Ｊ＝４４＝布
Ｈ；で、片面に銅箔などの金属箔（６）を積層した金属
箔張積層板（５）の他面側に接着剤や接着用つりｊ ｌ
／ジなどの接着層（４）を介して金属板（１］を貼り合
わせ、第２図の如き金属板ベース積層板を得るものであ
る。As the metal plate (1), a metal plate with a thickness of 1 sm, a stainless steel plate, a nickel plate, an iron plate, etc. can be used. When the oxide layer (2) is formed, the other side is roughened by any known method such as the sacid blast method without forming the oxide layer (2) to form the rough surface (3). With this rough surface (31 fill $, 1 $ J=44=cloth H; and adhesive hanger j l
A metal plate base laminate as shown in FIG. 2 is obtained by bonding the metal plates (1) together via an adhesive layer (4) such as / or the like.
上述のように本発明によれば、金属板の片面に酸化層を
形成すると共に他の片面を粗面化（７、この粗面側に接
着銅層を介して金属箔偏積゛層板を貼付けるようにした
ので、酸化層によって金属板の表面絶縁性等を確保でき
るのはもちろんのこと、金属板を粗面化する側の片面に
は酸化層は設けられておらず十分に粗い粗面を得ること
ができ、接着剤層に十分な投錨効果を与えて金属板と金
属箔張積層板とを接着強度高く接着させるこ吉ができる
ものである。As described above, according to the present invention, an oxide layer is formed on one side of the metal plate, and the other side is roughened (7, a uneven laminated metal foil plate is applied to this rough side via an adhesive copper layer). Since the oxide layer is pasted, the surface insulation properties of the metal plate can be ensured by the oxide layer, and there is no oxide layer on one side of the metal plate to be roughened. It is possible to obtain a surface, give a sufficient anchoring effect to the adhesive layer, and bond a metal plate and a metal foil-clad laminate with high adhesive strength.
次に本発明を実施例により例証する。The invention will now be illustrated by examples.
〈実施例〉
゛片面に酸化層を形成した厚みｌ龍のア１し三ニウム板
の他の片面（こ粗面を形成し、ハラス布にエポ＋シ樹脂
を含浸乾燥せ１．めて得た厚み０．１ｍの絶縁性接着用
づりづレフをア１１．三ニウム板の粗面に重ね、加熱加
圧することによりアルミニウム板に接着層を積層させた
。<Example> ゛An oxidized layer was formed on one side and the other side of a trinium plate with a thickness of 1 and 3 (a rough surface was formed), and a Haras cloth was impregnated with epoxy resin and dried. A11. A 0.1 m thick insulating adhesive tape was placed on the rough surface of the trinium plate and heated and pressed to form an adhesive layer on the aluminum plate.
〈比較例〉
両面に酸化層を形成した厚み１削のアルミニウム板の一
方の酸化層の表面を粗面化し、Ｊｊラス布にエボ＋シ樹
脂を含浸乾燥せしめて得た厚み０．ＩＭの絶縁性接着用
プリつレフをアルミニウム板の粗面に重ね、加熱加圧す
ることによりアルミニウム板に接着ｊ―を積層させた。<Comparative Example> The surface of one of the oxidized layers of an aluminum plate with a thickness of 1 cut having oxidized layers formed on both sides was roughened, and a JJ lath cloth was impregnated with Evo+Si resin and dried to obtain a thickness of 0. IM's insulating adhesive Puritsulev was placed on the rough surface of the aluminum plate, and the adhesive J- was laminated on the aluminum plate by heating and pressing.
実施例、比較例で得た試料について、金属板と接着層と
の接着性を測定した結果を次表に示す。The following table shows the results of measuring the adhesion between the metal plate and the adhesive layer for the samples obtained in Examples and Comparative Examples.
実施例のものでは金属板と接着層との接着性が向上して
いることが確認される。It is confirmed that the adhesiveness between the metal plate and the adhesive layer is improved in the example.
第１図は従来例における金属板ベース積層板の断面図、
第２図は本発明における金属板ベース積層板の断面図で
ある。
（１）は金属板、（２）は酸化層、（３）は粗面、（４
）は接着剤層、（５）は金属箔張積層板である。
代理人 弁理士 石 Ｉｆｌ 長 七第１図Figure 1 is a cross-sectional view of a conventional metal plate-based laminate;
FIG. 2 is a sectional view of a metal plate-based laminate according to the present invention. (1) is a metal plate, (2) is an oxide layer, (3) is a rough surface, (4
) is an adhesive layer, and (5) is a metal foil-clad laminate. Agent Patent Attorney Stone Ifl Long Figure 7 1
Claims (1)
を粗面化し、この粗面側に接ＩＪ−を介して金属箔張積
層板を貼付けることを特徴とする金属板ベース積層板の
製造方法。(1) A metal plate base laminate characterized in that an oxide layer is formed on one side of the metal plate and the other side is roughened, and a metal foil clad laminate is attached to this rough side via a contact IJ-. Method of manufacturing the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11122081A JPS5812749A (en) | 1981-07-15 | 1981-07-15 | Manufacture of metallic plate base laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11122081A JPS5812749A (en) | 1981-07-15 | 1981-07-15 | Manufacture of metallic plate base laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5812749A true JPS5812749A (en) | 1983-01-24 |
Family
ID=14555567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11122081A Pending JPS5812749A (en) | 1981-07-15 | 1981-07-15 | Manufacture of metallic plate base laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812749A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60145837A (en) * | 1984-01-06 | 1985-08-01 | 三菱電線工業株式会社 | Manufacture of electric insulating substrate |
-
1981
- 1981-07-15 JP JP11122081A patent/JPS5812749A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60145837A (en) * | 1984-01-06 | 1985-08-01 | 三菱電線工業株式会社 | Manufacture of electric insulating substrate |
| JPH047296B2 (en) * | 1984-01-06 | 1992-02-10 | Mitsubishi Cable Ind Ltd |
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