JPS6210117Y2 - - Google Patents
Info
- Publication number
- JPS6210117Y2 JPS6210117Y2 JP1978177246U JP17724678U JPS6210117Y2 JP S6210117 Y2 JPS6210117 Y2 JP S6210117Y2 JP 1978177246 U JP1978177246 U JP 1978177246U JP 17724678 U JP17724678 U JP 17724678U JP S6210117 Y2 JPS6210117 Y2 JP S6210117Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- aluminum
- copper
- base material
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
Description
【考案の詳細な説明】 本考案は、金属張り積層板の改良に関する。[Detailed explanation of the idea] The present invention relates to improvements in metal-clad laminates.
従来、金属張り積層板は、銅箔張り積層板が最
も一般的であるが、その他にアルミニウム箔張り
積層板が知られている。アルミニウム箔張り積層
板は、低価格でありかつ、エツチング速度が速い
などの利点があるが、(1)銅に比べて電気伝導度が
劣るため印刷回路基板としては箔厚さを厚くする
必要がある。(2)はんだとの密着が悪く部品の接合
が困難である。(3)合成樹脂含浸基材中に含まれる
電解質により基材層と接触しているアルミニウム
箔表面が通電中に腐食され易いなどの欠点があ
り、従来印刷回路用基板としては広く使用されて
いないのが実状である。 Conventionally, the most common metal-clad laminate is a copper foil-clad laminate, but aluminum foil-clad laminates are also known. Aluminum foil-clad laminates have advantages such as low cost and fast etching speed, but (1) they have inferior electrical conductivity compared to copper, so it is necessary to thicken the foil for printed circuit boards. be. (2) Poor adhesion with solder, making it difficult to join parts. (3) Due to the electrolyte contained in the synthetic resin-impregnated base material, the surface of the aluminum foil that is in contact with the base material layer is easily corroded when electricity is applied, so it has not been widely used as a conventional printed circuit board. This is the actual situation.
本考案は、上述のようなアルミニウム箔張り積
層板の従来の欠点を除去し、電気伝導性、はんだ
接合性、耐電気腐蝕性がともに優れかつ低価格な
複合金属張り積層板を提供することを目的とす
る。 The present invention aims to eliminate the conventional drawbacks of aluminum foil-clad laminates as described above, and to provide a composite metal-clad laminate that has excellent electrical conductivity, solderability, and electrical corrosion resistance, and is inexpensive. purpose.
以下本考案を図面により説明する。 The present invention will be explained below with reference to the drawings.
１，１′はアルミニウム箔で、該アルミニウム
箔１，１の両表面には電気メツキなどにより薄い
銅層２，２′を被着形成させる。上記導電回路と
なるアルミニウム−銅複合金属層を合成樹脂基材
層３の片側（第１図）、または両側表面（第２
図）に配置構成してこれを接合一体化させたもの
である。また複合金属層は合成樹脂含浸基材層３
の中間層に構成することもできる。 1 and 1' are aluminum foils, and thin copper layers 2 and 2' are formed on both surfaces of the aluminum foils 1 and 1 by electroplating or the like. The aluminum-copper composite metal layer that will become the conductive circuit is placed on one side (Fig. 1) or both sides (second side) of the synthetic resin base layer 3.
Figure) is arranged and configured and these are joined and integrated. In addition, the composite metal layer is the synthetic resin impregnated base material layer 3.
It can also be configured as an intermediate layer.
上述のように本考案の金属張り積層板は、アル
ミニウム層の両表面に電気電導性が良好な銅層を
形成した複合金属層で構成しているため、アルミ
ニウム層の厚さを薄くしても印刷回路用基板とし
て要求される電気伝導度を確保することができ
る。また、最表面にははんだ接合性が良好な銅層
が形成されているため従来の銅箔張り積層板と同
様にはんだによる部品接合が可能である。さら
に、アルミニウム層は合成樹脂含浸基材層には接
触せず銅層が接触しているので通電中の電気腐蝕
の惧れはない。 As mentioned above, the metal-clad laminate of the present invention is composed of a composite metal layer in which a copper layer with good electrical conductivity is formed on both surfaces of an aluminum layer, so even if the thickness of the aluminum layer is reduced, The electrical conductivity required for a printed circuit board can be ensured. In addition, since a copper layer with good solderability is formed on the outermost surface, components can be joined by solder in the same way as conventional copper foil clad laminates. Furthermore, since the aluminum layer does not contact the synthetic resin-impregnated base material layer but the copper layer, there is no fear of electrical corrosion during energization.
本考案は上述の如き種々の利点があり、その実
用的価値は極めて大である。 The present invention has various advantages as described above, and its practical value is extremely great.
第１図は本考案の一例を示す断面図、第２図は
本考案の他の例を示す断面図である。
１，１′はアルミニウム箔、２，２′は銅層、３
は合成樹脂含浸基材層。
FIG. 1 is a cross-sectional view showing one example of the present invention, and FIG. 2 is a cross-sectional view showing another example of the present invention. 1, 1' are aluminum foils, 2, 2' are copper layers, 3
is a synthetic resin-impregnated base material layer.
Claims (1)
導電回路となる複合金属層を合成樹脂含浸基材層
の少なくとも一方の面に配置構成しこれを積層成
形してなる印刷回路用の金属張り積層板。 A metal clad laminate for printed circuits made by laminating and molding a composite metal layer that forms a conductive circuit on at least one side of a synthetic resin-impregnated base material layer, in which a copper layer is adhered to both surfaces of an aluminum layer. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978177246U JPS6210117Y2 (en) | 1978-12-20 | 1978-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978177246U JPS6210117Y2 (en) | 1978-12-20 | 1978-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5590441U JPS5590441U (en) | 1980-06-23 |
| JPS6210117Y2 true JPS6210117Y2 (en) | 1987-03-09 |
Family
ID=29186565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978177246U Expired JPS6210117Y2 (en) | 1978-12-20 | 1978-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6210117Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49125851A (en) * | 1973-04-06 | 1974-12-02 |
-
1978
- 1978-12-20 JP JP1978177246U patent/JPS6210117Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49125851A (en) * | 1973-04-06 | 1974-12-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5590441U (en) | 1980-06-23 |
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