JPS58127335A - Dispenser - Google Patents

Dispenser

Info

Publication number
JPS58127335A
JPS58127335A JP893382A JP893382A JPS58127335A JP S58127335 A JPS58127335 A JP S58127335A JP 893382 A JP893382 A JP 893382A JP 893382 A JP893382 A JP 893382A JP S58127335 A JPS58127335 A JP S58127335A
Authority
JP
Japan
Prior art keywords
piston
cylinder
paste
amount
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP893382A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
巳亦　力
Osamu Sumiya
修 角谷
Yoshihiko Kobayashi
義彦 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP893382A priority Critical patent/JPS58127335A/en
Publication of JPS58127335A publication Critical patent/JPS58127335A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Basic Packing Technique (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To always stably obtain the desired amount of paste material and enhance reliability thereof in spite of change of environmental temperature by forming the structure so that the piston of the cylinder piston mechanism containing paste material can move mechanically and by providing a constant relationship between temperature of paste material within the cylinder and movement of piston. CONSTITUTION:When the axis of a worm 14 is rotated for the specified angle by means of a motor 13, a movable arm 19 moves downward up to the position indicated by a broken line and a piston 20 also integratingly moves downward for the specified stroke. When the piston 20 moves downward, the Ag paste P is pushed out from the exhaust port 17 at the end of cylinder for the amount corresponding to the movement of piston and supplied on the ceramic base B. At this time, since downward movement of piston 20 is closely related to a rotating angle of axis of worm 14, downward movement of piston can be controlled by controlling a rotating angle of axis of worm 14, namely a rotating angle of motor 13. Therefore, movement of piston, namely amount of Ag paste to be supplied can be minutely controlled, improving accuracy of the amount to be supplied.

Description

【発明の詳細な説明】 本発明はペースト状材料會定量ないし適量供給すること
かできる構造の簡単なディスペンサに関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dispenser with a simple structure capable of dispensing a fixed amount or an appropriate amount of a paste-like material.

＊＊体装置の製造工種の一つに、セラミックベースやリ
ードフレーム等の部材に牛導体素子ペレットを固着する
所謂ベレットボンディングエ榴かあるか、このベレット
の固着材料としてＡｇペーストか使用されることか多い
。ｔた、ベレットボンディングされたベレットを摩躾す
る目的でベレット上にレジンを滴下（ポツティング）シ
てベレットを橿うことも行なわれている。ところで、こ
れらの場合、Ａｇペーストやレジンは予め設定されてい
る量たけ供給される必要かあｐ、その供給量によってベ
レットボンディングやポツティングの良否が左右される
。このため、従来からこの株のペースト状の材料を定量
供給するディスペンサか使用されている。**One of the manufacturing methods for body devices is so-called pellet bonding, which fixes conductive element pellets to components such as ceramic bases and lead frames, and Ag paste is used as the fixing material for this pellet. There are many. In addition, for the purpose of polishing a bullet that has been bullet-bonded, resin is dropped onto the bullet and the bullet is removed. Incidentally, in these cases, it is necessary to supply a preset amount of Ag paste or resin, and the quality of pellet bonding and potting depends on the amount of supply. For this reason, dispensers have traditionally been used to supply a fixed amount of paste-like material of this strain.

１１１＠■、（６）は従来のディスペンサのガであｐ、
（４）は吐出口２を有する筒状のノズル１内にペースト
材料を入れる一方、ノズル１の背ｌ５Ｋｔ；ｔエアー圧
を供給できるようにし、このエアー圧と供給時間をメー
タ３およびタイマ４にて制御することにより定量のベー
スト材料を吐出口２から吐出させるようにし危４のであ
る。また、＠は内部にペースト材料を充満させたパイプ
５を円弧面基台６上に置く一方、圧潰ローラ１を一体に
有する回転体８ｆｔ図示矢印方向ＫＷｔ定角ｆ回―する
ことにより、パイプ５ｔ−所定長にわ度って押し潰して
相当量のベースト材料を一方のパイプ端から吐出させる
ようにしたものである。111@■, (6) is the conventional dispenser p,
(4) While putting the paste material into the cylindrical nozzle 1 having the discharge port 2, the back of the nozzle 1 is made to be able to supply l5Kt;t air pressure, and this air pressure and supply time are set to the meter 3 and timer 4. A fixed amount of base material is discharged from the discharge port 2 by controlling the base material. In addition, while placing the pipe 5 filled with the paste material inside on the arcuate base 6, the rotating body 8ft having the crushing roller 1 integrally rotated at a constant angle f times KWt in the direction of the arrow shown in the figure. - The base material is crushed over a predetermined length so that a considerable amount of base material is discharged from one end of the pipe.

しかしなから、前記（４）のディスペンサにあってはエ
アー圧の微妙なコントロールか歎かしくしたかつて吐出
量の微小＆ｌｌｌ１Ｉ１１か困難になり、ま几ペースト
状材料の粘度か湯度変化等によって変化し。However, with the dispenser described in (4) above, delicate control of the air pressure was once a problem, but now it has become difficult to control the minute amount of discharge, and the viscosity of the pasty material or the temperature of the hot water changes. .

７を場合にはコントロールか殆んどで春なくなるという
問題かある。また、（至）のディスペンサにあっては、
パイプの圧潰ｉＩ！にパイプか膨れることかめって前例
と同様に微妙なコントロールか腸かしいと共に、パイプ
の寿命か短かく反復使！＠に耐えられないという間＠か
める。In the case of 7, there is a problem that the spring disappears in most cases, whether it is control or not. In addition, for the (to) dispenser,
Pipe crush II! As with the previous example, if the pipe swells, it requires delicate control, and with repeated use, the life of the pipe will be shortened! While I can't stand @, I bite @.

したかつて本発明の目的は、ペースト材料倉入れたシリ
ンダ・ピストン構体のピストンを機械的に移動し得るよ
う構成すると共に、シリンダ内のベースト材料のｉｉ１
度とピストンの移動量との間に一定の関係を持九せるこ
とにより、環境のＩｌ＆（特に気Ｓ）の変化等にかかわ
らず所望量のベースト材料を常に安定して得ることかで
きかつその信頼性を高めることができるディスペンサを
提供することにある。An object of the present invention is to configure a piston of a cylinder-piston assembly containing a paste material so as to be mechanically movable, and to move the paste material in the cylinder.
By establishing a certain relationship between the temperature and the amount of movement of the piston, it is possible to always stably obtain the desired amount of base material regardless of changes in Il& (especially air S) in the environment. An object of the present invention is to provide a dispenser that can improve reliability.

以下、本発明を図示の実ｍ岡によｐ説明する。Hereinafter, the present invention will be explained with reference to the illustrated example.

第２図は本発明の一実施１１を示し、基台１０上にはガ
イドロッド１１を喬厘に立設してその上端にブラケット
１２ｔ−固着すると共に、基台１０上に固定しｔモータ
１３＃／ｃより軸転されるウオーム１４の上端をこのブ
ラケツ）１２により軸受けしている。また、前記１台１
０の先１１ｉｌＫは注射器形状をし危シリンダ・ピスト
ン構体１５のシリンダ１６を、その先端吐出口１７を下
方に向けて支持している。この場合、シリンダ１６の１
ＩａｓＫはガえはヒータやサーモスタット等からなる恒
温器１８を一体的に付設している。FIG. 2 shows one embodiment 11 of the present invention, in which a guide rod 11 is erected on a base 10, a bracket 12t is fixed to the upper end of the guide rod 11, and a t motor 13 is fixed on the base 10. The upper end of the worm 14, which is rotated from #/c, is supported by this bracket 12. In addition, the above 1 unit 1
The tip 11ilK of 0 has a syringe shape and supports the cylinder 16 of the dangerous cylinder/piston assembly 15 with its tip discharge port 17 facing downward. In this case, 1 of cylinder 16
The IasK is integrally equipped with a constant temperature chamber 18 consisting of a heater, thermostat, etc.

一方、前記ウオーム１４には可曽ステム１９を螺合させ
ており、可−ステム１９はｔオーム１４の一転によって
ガイドロッド１ＩＩＩｃ案内されながら上下動される。On the other hand, a flexible stem 19 is screwed onto the worm 14, and the flexible stem 19 is moved up and down while being guided by the guide rod 1IIIc by one rotation of the t-ohm 14.

そして、この可−ステム１９の先ｇｌ／ＡＫは前記シリ
ンダーピストン構体１５のピストン２０に連結したビス
トンロッド２１４０上ｍを一体的に結合し、可−ステム
１９と共にピストン２０ｔ−上下−させるようにしてい
る。The tip gl/AK of this movable stem 19 is integrally connected to the upper m of the piston rod 2140 connected to the piston 20 of the cylinder piston structure 15, so that the piston 20t can be moved up and down together with the movable stem 19. There is.

なお、前記シリンダ１６内には内えばムｇベーストＰか
入れられ、またシリンダ１６の先端吐出０１７の下方に
はベレット會ボンゲイングするセラオツクベースＢｔ装
置できるようにしている。A mug base P is placed inside the cylinder 16, and a ceramic base Bt device for pellet bonding is provided below the discharge end 017 of the cylinder 16.

また、前配恒潟器１８ＦｉそのＳ度を過室１１１警でき
るように構成しているものとする。In addition, it is assumed that the front panel 18Fi is configured so that the S degree can be adjusted to 111 degrees.

以上のＩＩＩＩＩｉｔＫよればシリンダ１６内のムｇベ
ース）ｒｒｉ恒傷器１８の作用によってＷｒ＊ｏｉｉｉ
置に保持賂れ、外気の１１１度変化による粘度や体積変
化は殆んどない。この状１でモータ１ａ＆’Ｃよりクオ
ームＩＱ−所定角度だけ一転すれは町−アーム１９は同
図鎮■のように下−され、これと一体にピストン２０が
所定ストロークだけ下動される。ピストン２００下−に
より、シリンダ１６内のムｇペース）Ｐはピストン下動
量に見合った童だけ先端吐出口１７かも押し出され、セ
ラミックベース１上に供給されることになる。このとき
、ピストン２０の下動量はウオーム１４の軸転角と密接
な関係ｔ−；１１ている几め、ウオーム１４の軸転角、
りｔｎモータ１３の回転角を制御すればピストン下物量
を制御で盲、Ｌ７ｔかつてピストン下動量、即ちムｇペ
ーストＰの供給量を微妙にコントロールでき、供給１！
１１ｆ′ｆ：向上することかできる。これにより、本例
の場合には外１ｉ１１に変化和かかわらずセラミックベ
ース１上に定量のムｇペーストを供給シてペレットボン
ディングを良好に行なうことかできるのである。According to the above IIIitK, Wr*oiii is
There is almost no change in viscosity or volume due to a 111 degree change in the outside air. In this state 1, the motor 1a&'C rotates the quom IQ by a predetermined angle, and the arm 19 is lowered as shown in the figure, and the piston 20 is moved down by a predetermined stroke. Due to the downward movement of the piston 200, the amount of powder P in the cylinder 16 corresponding to the downward movement of the piston is also pushed out from the tip discharge port 17, and is supplied onto the ceramic base 1. At this time, the amount of downward movement of the piston 20 has a close relationship with the axial rotation angle of the worm 14.
By controlling the rotation angle of the motor 13, you can control the amount of material under the piston.
11f'f: Can be improved. As a result, in the case of this example, it is possible to supply a fixed amount of mug paste onto the ceramic base 1 and to perform pellet bonding satisfactorily, regardless of the changes in the outside 1i11.

纂３図は本発明の他Ｏ実ｍ１ＰＩｔ示し、纂２図と同一
部分には同一符号を付して詳細な説明は省略する。事実
ｍガは、シリンダ１６およびムｇベーストＰｔ一定−縦
に保持する代りにシリンダ１６の外周一部ＫｍｌＫセン
ナ２２を付設してシリンダｌａ＆を検出すると共和、こ
の検出値に応じてモータ１３の回転角（ステップ回転角
）ｔ−；シトロールする制御１ＥＩＩＩ２３ｔ−設け、
これによ）ムｇペーストとピストンの移動量とＯ関に関
係を持たせている。Figure 3 shows the other embodiments of the present invention, and the same parts as in Figure 2 are given the same reference numerals and detailed explanations are omitted. In fact, the cylinder 16 and the base plate Pt are constant.Instead of holding the cylinder 16 vertically, a part of the outer periphery of the cylinder KmlK is attached to a sensor 22 to detect the cylinder la&, and the motor 13 rotates according to this detected value. Angle (step rotation angle) t-; control 1EIII23t- to control,
As a result, there is a relationship between the amount of movement of the mug paste, the amount of movement of the piston, and the O-sensor.

即ち、前ガではムｇペーストを定温に保持し尺ことから
ピストン移動量も一定に保っているか、本ガではムｇペ
ーストのＩｌｆ変化に対応してピストン移動量を変化さ
せ、結果としてムｇペースト供給量を一定にｖ！、持し
ている。具体的に般明すれば、外気１１＆変化によりＡ
ｇペーストＰとシリンダ１６とか夫々異なる繰膨４Ｉ！
率で体積（容積）変化し、ピストン２０の一定量移一で
は吐出ムｇペースト量か変化してしまう。この几め　Ｓ
度センサ２２にてｉ１度を検出し、制御＠２１ではこの
温度に基づいてシリンダ１４ｉとムｇペースト１０６＊
＊亭の相違による供給量誤差を算出し、これを補正する
ようにモータ１３０回転角を設定する。In other words, in the previous model, the amount of piston movement was kept constant because the mug paste was kept at a constant temperature, or in this case, the amount of piston movement was changed in response to the change in Ilf of the mug paste, and as a result, the amount of piston movement was kept constant. Keep the paste supply amount constant v! , have. To be more specific, A due to outside air 11 & change
g Paste P and cylinder 16 have different expansions 4I!
The volume changes at a constant rate, and when the piston 20 moves a certain amount, the amount of mug paste discharged changes. This method S
The temperature sensor 22 detects i1 degree, and the control @21 connects the cylinder 14i and the mug paste 106* based on this temperature.
*Calculate the supply amount error due to the difference in the feeder, and set the rotation angle of the motor 130 to correct this.

これにより、Ｓ屓変化に応じて毫−−１３の回転角およ
びピストン移動量が変化されるか、供給ムｇペースト量
は一定に保持されるのである。As a result, the rotation angle of the shell 13 and the amount of piston movement are changed in accordance with the change in S level, or the amount of supplied mug paste is kept constant.

ここで、シリンダ・ピストン構体１５の構成中、ピスト
ン２０ｔ−移動させるための構成等を適宜変更し得るこ
とは言うまでもない。Here, it goes without saying that in the configuration of the cylinder/piston assembly 15, the configuration for moving the piston 20t, etc. can be changed as appropriate.

以上のように本発明のデイスペンサによれば、ペースト
材料を入れたシリンダ・ピストン一体のピストンｔ！！
！械的にＩＩ動じ得るよう構成すると共和シリンダやペ
ースト材料Ｏｓ度とピストンの移動量との関に一定の関
係を持たせるようにしたので、外気温の蜜化等にもかか
わらずペースト材料を常に安定に定量供給することがで
き、かり微妙なコントロールを可能にして供給量種度の
同上を笑構することができる。As described above, according to the dispenser of the present invention, the piston t! is an integrated cylinder and piston containing paste material. !
! When configured to be able to move mechanically, a certain relationship is established between the cylinder and paste material Os degree and the amount of piston movement, so the paste material can be moved at all times regardless of the outside temperature. It is possible to stably supply a fixed amount, and it is possible to perform delicate control, thereby making it possible to vary the supply amount.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（４）、（６）は夫々異なる従来のディスペンテ
ノｌ１ｌＪｉａｃ図、ｊ１２図Ｆｉ本発ｍ（Ｄ実１ａＨ
（Ｄｆｌｌ成図、第３図は他の実Ｊｕｌ内の構成図であ
る。 １０・・・基台、１３・・・モータ、１４・・・ウオー
ム、１５・・・シリンダ・ピストン構体、１６・・・シ
リンダ、１８・・・恒温器、１９・・・可働ステム、２
Ｇ・・・ピストン、２　ｘ・　ｇｘトン’ｔｙド、１に
一１１１１１／’？。 ２３・・・制御部。 代理人　弁理士　薄　１）ｆＩＩｌ　　令第　　１　　
図 （Ａン （Ｂ〕Figures 1 (4) and (6) are different conventional dispenteno l1l Jiac diagrams, j12 Figures Fi main development m (D real 1aH
(Dfl configuration, Figure 3 is a configuration diagram in another actual Jul. 10... Base, 13... Motor, 14... Worm, 15... Cylinder/piston structure, 16... ...Cylinder, 18...Thermostat, 19...Movable stem, 2
G... Piston, 2 x gx tons 'tyd, 1 to 11111/'? . 23...control unit. Agent Patent Attorney Susuki 1) fIIl Ordinance No. 1
Figure (A (B)

Claims (1)

【特許請求の範囲】 １、Ａｇペーストやレジン等のペースト状材料を内Ｓに
入れたシリンダ・ピストン構体と、このシリンダーピス
トン構体のピストン構体動させて前記ペースト状材料を
シリンダ外へ吐出させる機械手段とを備え、かつ前記シ
リンダ・ピストン構体のシリンダやペースト状材料ｅ）
ｍ度とピストンの林＃書との間尺一定の関係を持たせる
ようにし几ことを特徴とするディスペンサ。 ２、前記シリンダに恒温器を付設する一方、ピストン移
動量を一定に保持してなる特許請求の範囲第１項記載の
ディスペンサ。 ３、前記シリンダＫＩｉ［センサを付設する一方、この
一度センナの出力に基づいてｌｌＩ記ピストンの移動量
を制御する制御Ｓｔ＊えてなる特許請求の範囲第１項記
載のディスペンサ。[Claims] 1. A cylinder/piston structure in which a paste-like material such as Ag paste or resin is placed inside S, and a machine that moves the piston structure of the cylinder-piston structure to discharge the paste-like material out of the cylinder. and the cylinder and paste material of the cylinder/piston structure e)
A dispenser characterized by having a constant relationship between the distance between the m degree and the piston. 2. The dispenser according to claim 1, wherein the cylinder is provided with a thermostat while maintaining the piston movement amount constant. 3. The dispenser according to claim 1, wherein the cylinder KIi is equipped with a sensor and has a control St* for controlling the movement amount of the piston based on the output of the sensor.
JP893382A 1982-01-25 1982-01-25 Dispenser Pending JPS58127335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP893382A JPS58127335A (en) 1982-01-25 1982-01-25 Dispenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP893382A JPS58127335A (en) 1982-01-25 1982-01-25 Dispenser

Publications (1)

Publication Number Publication Date
JPS58127335A true JPS58127335A (en) 1983-07-29

Family

ID=11706460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP893382A Pending JPS58127335A (en) 1982-01-25 1982-01-25 Dispenser

Country Status (1)

Country Link
JP (1) JPS58127335A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60115237A (en) * 1983-11-28 1985-06-21 Fuji Xerox Co Ltd Dispenser
JPS60204404A (en) * 1984-03-30 1985-10-16 昭和瀝青工業株式会社 Filling valve for high-consistency composition
JPS6359843A (en) * 1986-08-29 1988-03-15 Konfuekushiyonarii Kotobuki:Kk Feeder for pasty material and control thereof
JP2007007611A (en) * 2005-07-01 2007-01-18 Shibaura Mechatronics Corp Apparatus and method for dropping liquid material
JP2015077568A (en) * 2013-10-17 2015-04-23 富士電機株式会社 High viscosity solder coating device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60115237A (en) * 1983-11-28 1985-06-21 Fuji Xerox Co Ltd Dispenser
JPS60204404A (en) * 1984-03-30 1985-10-16 昭和瀝青工業株式会社 Filling valve for high-consistency composition
JPS6359843A (en) * 1986-08-29 1988-03-15 Konfuekushiyonarii Kotobuki:Kk Feeder for pasty material and control thereof
JP2007007611A (en) * 2005-07-01 2007-01-18 Shibaura Mechatronics Corp Apparatus and method for dropping liquid material
JP2015077568A (en) * 2013-10-17 2015-04-23 富士電機株式会社 High viscosity solder coating device

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