JPS58124235A - 半導体装置用アルミ合金極細線 - Google Patents

半導体装置用アルミ合金極細線

Info

Publication number
JPS58124235A
JPS58124235A JP57007237A JP723782A JPS58124235A JP S58124235 A JPS58124235 A JP S58124235A JP 57007237 A JP57007237 A JP 57007237A JP 723782 A JP723782 A JP 723782A JP S58124235 A JPS58124235 A JP S58124235A
Authority
JP
Japan
Prior art keywords
aluminum alloy
alloy wire
wire
strength
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57007237A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0254667B2 (ref
Inventor
Sadahiko Sanki
参木　貞彦
Yasuhiko Miyake
三宅　保彦
Koichi Tamura
幸一 田村
Osamu Nakamura
修 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP57007237A priority Critical patent/JPS58124235A/ja
Publication of JPS58124235A publication Critical patent/JPS58124235A/ja
Publication of JPH0254667B2 publication Critical patent/JPH0254667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07555—Controlling the environment, e.g. atmosphere composition or temperature changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Wire Bonding (AREA)
JP57007237A 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線 Granted JPS58124235A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57007237A JPS58124235A (ja) 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57007237A JPS58124235A (ja) 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線

Publications (2)

Publication Number Publication Date
JPS58124235A true JPS58124235A (ja) 1983-07-23
JPH0254667B2 JPH0254667B2 (ref) 1990-11-22

Family

ID=11660383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57007237A Granted JPS58124235A (ja) 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線

Country Status (1)

Country Link
JP (1) JPS58124235A (ref)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208770A (ja) * 1983-05-12 1984-11-27 Hitachi Ltd ボ−ルボンデイング用アルミ合金極細線
WO1988002788A1 (fr) * 1986-10-09 1988-04-21 Sky Aluminium Co., Ltd. Materiau pour parties conductrices d'appareils electroniques et electriques
US4845543A (en) * 1983-09-28 1989-07-04 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US5393703A (en) * 1993-11-12 1995-02-28 Motorola, Inc. Process for forming a conductive layer for semiconductor devices
US5851920A (en) * 1996-01-22 1998-12-22 Motorola, Inc. Method of fabrication of metallization system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164542A (en) * 1981-04-01 1982-10-09 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164542A (en) * 1981-04-01 1982-10-09 Hitachi Ltd Semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208770A (ja) * 1983-05-12 1984-11-27 Hitachi Ltd ボ−ルボンデイング用アルミ合金極細線
US4845543A (en) * 1983-09-28 1989-07-04 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
WO1988002788A1 (fr) * 1986-10-09 1988-04-21 Sky Aluminium Co., Ltd. Materiau pour parties conductrices d'appareils electroniques et electriques
US4908078A (en) * 1986-10-09 1990-03-13 Sky Aluminium Co., Ltd. Material for conductive parts of electronic or electric devices
US5393703A (en) * 1993-11-12 1995-02-28 Motorola, Inc. Process for forming a conductive layer for semiconductor devices
US5623166A (en) * 1993-11-12 1997-04-22 Motorola, Inc. Al-Ni-Cr conductive layer for semiconductor devices
US5851920A (en) * 1996-01-22 1998-12-22 Motorola, Inc. Method of fabrication of metallization system

Also Published As

Publication number Publication date
JPH0254667B2 (ref) 1990-11-22

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