JPS5812354A - Manufacture of solid-state colored image pickup device - Google Patents

Abstract

PURPOSE:To improve the bonding property of a bonding wire as well as to enable to directly form a color separation filter on a wafer in uniform thickness by a method wherein, after the color separation filter has been formed on a passivation film, a bonding pad part is exposed by providing an aperture. CONSTITUTION:As a bonding pad 27' is exposed by providing an aperture after a color separation filter 30 has been formed on a passivation film 28 located on the bonding pad 27, the erosion and the contamination of the bonding pad, due to component material used when an alkaline solvant and the color separation filter 30 are formed using the method heretofore in use, can be prevented and the bonding property with a wire can be improved remarkably. Also as the layer to be colored, which will be used for formation of the color separation filter 30, is coated before the bonding pad part 27 is exposed, the layer to be colored is coated on the flat passivation film 28, and the color separation filter 30 having a uniform film and excellent spectral characteristics can be formed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present Iikken has developed a method for color body imaging at, and has created a body image pickup device for cats in which a color separation filter is directly engraved on the image element integrated into the object. It is related to the manufacturing method.

As for the force 2-use logic system 11# & setting in which color separation filters are formed directly on the integrated image sensor for CCD, the one shown in No. 1 wJ is known. This is a set package with a stepped recess inside. The inside and inner surface of this package is coated with conductive adhesive 2.
Solid shooting Yukako 1 through! This makes it possible to see one diamond in the diagram! A color separation filter 4 is formed in the center of the upper m (light receiving surface) of this element 1, and a plurality of ponding filters are formed around the filter 4.
The pad $161... is formed in 11 layers. This pounding pad part... is connected to 7.
- 9 bosses attached to the flat # level inside the package via the rim or extra bonding wire C...
ly connected to gn, and this post) liF is package 1
j&t) is attached to the outside of the oj! and is connected to the nine terminal (- not shown) via a through hole etc. In, package 1
The opening end #cFi of the optical accompaniment glass body 8 for sealing the element S in the trachea is fixed via the sealing material 9. The CCD chip, which consists of a sensor element and a color separation filter, requires a color separation filter to be formed on the sensor and a bonding pad part to be exposed for wire bonding. Conventionally, its production has been carried out as follows: First, the usual method of vapor phase growth on a silicon wafer, impurity 4III mineral dispersion, photo-etching, and solid-state imaging layer.・Next, metal such as aluminum is appropriately vapor-deposited on each of the above-mentioned elements to form a thin substrate;
During contact, form a ponder pad @next.
Form a pudge page film on the metal body. After this,
After selectively ettending a part of the padding film to expose the bonding pad part, a color separation filter is formed on the device, and after AI, it is applied along the dicing fist line. CCD chips are made by cutting each element.

However, in the above-mentioned Kita method, the filter forming film on the exposed bonding pad portion is coated with an alkaline solvent in consideration of the formation of the color separation filter. Washed with the alkaline solvent and eroded δ], a certain %f& is the component material of the filter forming film, on the landing pad part, and on! ! 4
Also, there was a drawback that the bonding property with the bonding wire deteriorated due to contamination.
Since there is a hole in the padding pad part above the bonding pad part to expose the bottom pad part, when forming the color separation filter, the color separation green filter near the bonding pad part is placed in the center of the CCD chip. The drawback was that the thickness of the filter could not be made uniform, and the spectral characteristics were different between the center of the CCD chip and the vicinity of the bonding pad. As a measure to improve the above-mentioned problem, the holes have been drilled, the bonding pads are covered with embellishments, and a resist material is placed over them. According to the Kita method, although it is possible to make the color separation filter uniform, it is possible to eliminate the negative influence of leftovers on the bonding pads, as described in Section 11, and furthermore, it is possible to place them with padding. ! increases, which causes a decrease in peripheral speed efficiency.

The present invention has been made in view of the above-mentioned circumstances, and is designed to prevent damage to the bonding pad portion due to I & D caused by alkaline il agents and residual component materials of color separation filters, and to prevent color separation ! In addition to directly forming the filter uniformly, it also prevents color separation, fading, and separation of the color filter during the post-cleaning process of the dicing line of the bonding pad part, and further improves packaging. We are committed to providing a method for manufacturing a solid-state imager for curling that can prevent damage to wrinkle filters during the process. IIl#A child is shaped like X along the dicing twin.
A step of forming a pudge page coating film on the processed wafer, and applying a color separation filter on the pad page board, except for the area that meets the bonding pad portion of the device and the portion corresponding to the dicing twin. a step of forming;
Far-*m on the passipe VWy membrane surface containing the filter.
The resin film is selectively removed to remove at least the portion corresponding to the bonding pad portion and the dicing twin, and the color separation eye #- forming the oil film is selectively removed.
Work 1 to form a tree fgll pattern surrounding the entire circumference of the
**This process comprises a step of etching away the BYSZ vane film to expose the bonding pad portion and the dicing twin.

As a color separation filter used in this development, a colored layer is formed on the entire PATSU V base carbon film, and this colored layer is patterned to obtain 1'll, ttf. By leaving the colored parts and repeating the process of changing the color to brassy color, we can create a zigzag pattern, a checkered pattern, and a certain percentage/-
A method for forming a desired color separation filter in the form of HID stripes is to form a colored layer on the entire surface of a P7V base film, and then pattern the colored layer.
A method of forming a color separation filter having desired filter portions in a zigzag or checkered pattern by exposing and developing, or
A method may be adopted in which a colored layer is formed on the entire surface of the Budgebage shoulder film, this is exposed to light to form a desired filter portion, and then this is patterned to form a color separation filter. As the colored layer used for ζζ,
Consisting of nine organic materials, mainly gelatinous materials,
One example is turtle fathom, which is made of an emulsion similar to photographic film. Furthermore, in addition to the three primary colors of red, blue, and edge, the colors of the color separation filter can be complementary colors or colors that match the color of the light shield, and the order of coloring is from the color with a φ shift. The resin film used in the present invention may be a photosensitive resin film.
Some have no photo-Ilk response, while others have photo-Ilk responsiveness. Examples of the former type of massage include balsam, isocyanate, urethane, and urethane. Also, the latter resin film is a negative wrinkle resist of #i cyclized butadiene thread, and the body is JBR.

cab (part name manufactured by Nippon Gosei Rubber Co., Ltd., or polyglycidyl methacrylate) (PGMA) and polyvinyl alcohol. For example, the following method can be used to form the liI mackerel pattern.

■ After applying a photosensitive resin film (negative type) to the entire surface of the badge page carbon film that meets the color separation filter, the #resin film is exposed except for the bonding pad area and the area corresponding to the 112-in dicing area. A method of forming a resin film pattern in which the parts corresponding to the bonding pads and dye lines are removed *6 by performing iA image processing. After forming a V-sist pattern on this resin film from which the parts corresponding to the bonding pads and dicing twins have been removed, the above-mentioned koji is applied to the mold to remove the padding pattern by etching using the ridges as a mask. - Method of forming a resin film pattern by removing the oil film - Note that the "9 transparent" e1m film pattern cut out in (■) can be used as an etching mask for the Padge Page blind film.

As the padgage carbon film used in the present invention, for example, a phosphosilicate glass film (Pa(4),
(B8Gjll), arsenic silicate, glass (Mus8G film), silicon electrified film (SisNam), etc.
In addition, methods for forming it include, for example, the CVD method, a method in which a silicon compound or a silicon compound containing compounds such as phosphorus, bone, etc. are fused with an alcohol solution and then coated with a spinner or the like. After incubating the particulate glass with an organic binder and a slag agent, it is printed using a screen printing method.
# It is possible to adopt methods such as

Next, *m examples of the present invention will be explained in detail based on FIGS. 2(a) to (foundation) and 3rd to 5th m(a) to (e).

*Example L [1] First, selective diffusion, etching removal, holes, etc. are performed on a P-type silicon substrate (wafer) by a known predetermined method to form an Layer 22..., n+ of the source and drain of the output circuit
Layer 2J... and channel cut p+ layer 24...
At the same time, a polysilicon electrode (not shown) such as a gate electrode is formed on the substrate υ via an insulating film. Next, an inter-glabellar insulating film 25 is deposited on the entire surface including the inner electrode, and further an interlayer insulating film 2 corresponding to the n layer 11... and the polysilicon electrode leads (rjIJ not shown), etc.
Contact holes z6 are opened in 5 portions, and at the same time, a portion of the interlayer insulating film 11s along the dicing/2-in formation area between each chip is selectively etched away. Furthermore,
A/film is vacuum deposited on the insulating film J5 and patterned so that one end is connected to n+ through the contact hole xti...
The wires are connected to the layers 2J, and the ends thereof are ground on the glabellar insulator 25 to form bonding pads 27. Next, a padded bevel shoulder made of cylindrical glass (PSG) was prepared by the CVD method.
Deposit xs.

Subsequently, a colored layer 19, which also serves as a preparation, is formed on the pad page carbon layer 28, excluding the bonding pad 21 and the surrounding area including the portion corresponding to the portion where the dicing φ line is to be formed. (Total 2 figures -) As shown).

[-] Subsequently, the coloring layer 2# is exposed to light through a mask of a predetermined shape, and is colored by, for example, red development, and the red filter portion 30. After forming, other colored areas are similarly exposed and developed J6 corresponding to the film color is carried out, and a green filter part 308, a blue filter part 10a1 and a black filter part JO4 are formed in order to create a color separation filter U. do. If so, this color separation filter υt-t Muhatsushibesi day lN25 gold'fkJ#c.

A transparent resin film (negative photoresist) 31 is formed by applying illumination pumediene rubber-based JSR (part name manufactured by Japan Synthetic Rubber Co., Ltd.) (see Figure 2(b) Ill).

[Field] Next, the parts of the negative photoresist 31 other than those corresponding to the bonding pad parts and the parts where dicing lines are to be formed are exposed to no light, and developed to form a resist pattern (resin film pattern) Sl. Figure 12 (c)
eZ indication). Next, using this resin film pattern J2 as a mask, expose the exposed spacer film xttm tcy4.
The bonding pad @
Spray out sr'... and at the same time start dicing line 3.
3 (as shown in Figures 2(d), 3, and 4). Note that FIG. 3 shows an enlarged plan view 411 of FIG. 3 of the sea urchin 1121 on which the CCD tip 34 is formed. After forming the tip 34 on the wafer L as described above, dicing is performed.
CCD tip 34 cut along line 13 and prayed
A resin film pattern 82 is incorporated into a large package to manufacture a color solid-state imaging device similar to that shown in Figure 1.

However, the above *111A? According to No. 11, the following effects can be obtained as shown below.

(() In order to expose the bonding fist pad s2y' by drilling a hole in the upper badge page 87 @ 28 after forming the color separation filter L!, the bonding fist pad s2y'... Bonding pads based on component materials when forming Wt type color separation filter U*z
This prevents erosion and contamination of r'... and significantly improves the condensing performance with the wire.

(b) Since the colored layer for forming the color separation filter L1 is covered before the bonding pad portion JF'... is atomized, the colored layer is covered with the flat passivation film 28.
9. Expose this colored layer to light, 3I process W
By performing a*, a crimson color separation filter 3 with a uniform film and spectral characteristics is created! ! can be formed.

(c) The color separation filter U is formed except for the periphery where the portion corresponding to the dicing pad portion sr'... and the dicing line J5... is formed 6 cm above the badge page shoulder H1#, and A transparent *kinship pattern 31 is formed on the "fine film L" except for the parts corresponding to the bonding pads sr'... The 900D chip 34 is assembled into a package by dicing a 90mm wafer L with a resin film pattern 31 on it, so color separation will not occur even if a slight shock is applied to the armpit tip 34 at the time of assembly. In this case, since the resin film pattern SX is transparent, it becomes an obstacle to the spectral characteristics of the color separation filter U after being packaged. By using the above-mentioned Senzo, the bonding pad part 27'... and dicing
The side surface of the color filter U is not exposed to the opening of the resin film pattern 31 corresponding to the line 17..., and as a result, the bonding pad 527I... and the dicing 0 twin JJ are cleaned after exposure. During the process, resin film pattern Jzl
Cough Filter L for extra protection! It is possible to prevent L from discoloring, fading, or peeling due to washing water.

(F) As mentioned above, the Fi pattern Mm pattern 32 is formed on the color separation filter U formed by the breast strip, the bonding pad portion 22I... and the dicing line 33...
Since the side wall of the filter L1 is set back a sufficient distance from the side edge of the resin film pattern S2, the resin film pattern 321 is covered in the cleaning process after dicing. It also prevents washing water from entering and prevents discoloration, fading, and peeling of the filter membrane.

(f) Since the etching process for exposing the bonding pad portions 27' and dicing lines 33 is performed using the resin film pattern 32 that functions as a protective film, dicing is not performed as in the conventional method.・Line 33...
can be prevented from getting stuck on the protective film of the color separation filter U, and as a result, the protective film becomes sticky due to the heat during the cutting process of the wafer Lu, and this sticky film becomes sticky. p by I membrane
It is possible to prevent the color separation filter kl from being stretched and damaged.

9i12゜[1] First, in the same manner as in Example 1, an interlayer insulating metal 2δ, a bonding pad 11..., and a padding page carbon Ji Z 8% colored layer xp were applied on Ueno S■.
Next, form (#15 Figure 6) (illustrated). Next, the colored layer 2# is exposed to light through a master having a predetermined shape, and 3il#I
After forming the color separation filter U, the entire surface including the color separation filter υ is coated with a transparent lI made of balsam, for example.
Form i'&resin film J5 (Fig. 5 (indication) 0 [
Noodles] Next, the bonding pad part and dicing
The peripheral resin film 31 including the portion corresponding to the planned line formation portion is selectively removed to form a resin film pattern J J' that covers the entire circumference of the color filter L.
A photoresist film is coated on the entire surface including the IIt resin pattern Jjt, and after drying, exposure and development are performed to form a photoresist film in which a hole is opened in a portion corresponding to the portion where the Ribbonting pad part Daishinku 2-in is planned to be formed. A pattern 1g is formed (FIG. 5(e)). Next, using this 7-photoresist pattern 11 as a master, the exposed pad base 2I is dry-etched with CF4, and bonding pads 1sJF'... , and at the same time form dicing twin II... (II5i1(
d) As shown).

(1m) Next, the photoresist pattern J- is
, removed by dry etching in gas and incinerated (
Figure 5 (-). In addition, the chip 34 was formed on the wafer L, and the color separation filter L1 was coated with the resin film pattern J51 in the same way as in Example 1, and the chip 34 was assembled into a package on the ninth step 341. 1. A solid-state imaging g# bushing for force 2 shown in FIG. 1 is manufactured.

According to the above-mentioned embodiment, the resin film pattern 35' is formed on the bathy basin carbon BXa near the dicing 112-in JJ as in the above-mentioned embodiment 1. Resin family pattern J J
' becomes sticky, and the color separation filter 141 can be prevented from being pulled and damaged by the resin film pattern J5' that absorbs this stickiness. In addition, the resin film bar J 6' is attached to the bonding pad portion 2 on the pad page etchant film 28.
Bonding pad portions 11', middle dicing lines J3, etc. are formed on the solder resin film pattern jJI, except for the periphery including the portions corresponding to the dicing lines JJ, 1', and dicing lines JJ.・The ±7 photoresist pattern 16 is covered corresponding to Example 1. As shown in FIG.
The color separation film pz prevents water from floating during peeling and prevents water from entering from the boundary between the pad page M'/membrane 28 and the resin film pattern J6' during subsequent cleaning.

Prevents discoloration, fading, and peeling.

Moreover, since peeling and floating of the resin film pattern 1jI can be prevented, the maintenance of the color separation and filter L after packaging can be further improved.

Note that the above Example 2. Then, the die synchronizer of "Que^1" was performed after photoresist pattern J# was removed p1, n7j, but this is not limited to photoresist pattern 3.
Pieces of the wafer L may be removed by performing dicing using # as a nuclide and removing the photoresist pattern 1-.

In addition, the above II can be used to prevent chips during dicing. There is also a method of handling HoIIM that is different from Koji example.

Furthermore, the solid-state imaging device used in the solid-state imaging device according to the present invention can be applied not only to CCDK but also to MO8-type imaging devices as described in the above embodiments. For example, since the bonding wire has good bonding properties, a brown color separation filter can be formed directly on the entire surface of the sea urchin with a uniform thickness, and the color separation and filter discoloration can be prevented during the wafer cleaning process. It is possible to provide a method that can prevent damage to the filter due to damage during packaging, and can easily produce a monolithic imager for use with power 2 having good spectral characteristics. be.

[Brief explanation of the drawing]

The 1st wA is a cross-sectional view of the integrated image pickup device for the main body 2-, and the 160th (a) to 160 (a) to 160 (a) to 160 (a) show the manufacturing process of the chip used in the color integrated image pickup device in an embodiment of the present invention. The cross section shown [, I*s1m is a plan view of a wafer on which a plurality of chips shown in FIG. 1 is a cross-sectional view showing a 1 m manufacturing process for a tip used in a color peripheral gymnastics imaging device according to another embodiment of the present invention. 4. LjL... Color separation filter, 5', J F'
... bonding pad part, 8 ... optical window glass body, U ... Pffi/9: f group &(') Eva),
xi. 23...n layer, 24...plriszs...interlayer insulation IA, 27...bonding pad, 28...
...Padge page image jLJ #1...Red filter section, go meeting...Green filter section, 3o,...Blue filler section *w SJ ('4・ay filter section, s J, 3
J ・1hklk, 82°J 5'...Resin film pattern, 31...Dicing line, J4...CCD
Chip, 36...photoresist pattern.

Claims (4)

[Claims] (1) On a wafer on which a plurality of transverse imaging elements with mending pads are formed along the dicing 2-in.
a step of forming a passivation film; a step of forming a color separation filter on the passivation film except for the periphery including a portion corresponding to a bonding pad portion and a dicing line of the element; Badge page The process of forming a transparent double resin film on the entire surface of the film, and selectively removing this resin film to perform bonding.
At least the portion corresponding to the pad portion and the dicing line is removed, and a resin film pattern is formed that covers the entire periphery of the color separation filter, and the passivation film is selectively etched to remove the bonding pad portion. and a process of eliminating the use of a dicing line. (2) Patent eyelid ice characterized by having a transparent oil film having photosensitivity Part 1 Fujihang's manufacturing method for color solid imitation operation 0 (3) m! The parts of the J1m pattern corresponding to the bonding pads and dicing lines are excluded.
A special # feature in which the exposed passivation film is removed by etching using the patterned resin film pattern as a mask to expose the bonding pad portion and dicing line! f- A method for manufacturing a color directional imaging device according to item 1 or 2. (4) Using a photoresist pattern different from the resin film pattern, the passivation film portions corresponding to the bonding pad portions and dicing lines are selectively removed by etching using the andn as a mask. A method for manufacturing a color directional imaging device according to item 1.