JPS58122475U - composite printed circuit board - Google Patents
composite printed circuit boardInfo
- Publication number
- JPS58122475U JPS58122475U JP1871982U JP1871982U JPS58122475U JP S58122475 U JPS58122475 U JP S58122475U JP 1871982 U JP1871982 U JP 1871982U JP 1871982 U JP1871982 U JP 1871982U JP S58122475 U JPS58122475 U JP S58122475U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- composite printed
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第３図はいずれも本考案実施例を示す概略図
である。
１Ａ、 ｌＢ、 １ｃ・−・・・・複数基板部、２
・・・・・・ミシン目、３・・・・・・補助基板部、４
・・・・・・基板固定用穴、５・・・・・・リード処理
用溝、５Ａ、５Ｂ、５Ｃ・・・・・・リード処理用ガイ
ドレイン、７・・・・・・リード、８・・・・・・クラ
ンプ材。1 to 3 are schematic diagrams showing embodiments of the present invention. 1A, 1B, 1c...Multiple board section, 2
...Perforation, 3...Auxiliary board part, 4
...Board fixing hole, 5...Groove for lead processing, 5A, 5B, 5C...Guide train for lead processing, 7...Lead, 8・・・・・・Clamp material.
Claims (1)
ているプリント基板において、基板固定用穴、リード処
理用溝およびリード処理用ガイドラインを有する補助基
板部をミシン目を介してプリント基板の一部に設け、一
体化基板状態で所望のリード処理が行われるように構成
したことを特徴とする複合プリント基板。In a printed circuit board in which multiple board sections for each function are integrated through perforations, the auxiliary board section, which has board fixing holes, lead processing grooves, and lead processing guidelines, is connected to the printed circuit board through the perforations. What is claimed is: 1. A composite printed circuit board, characterized in that the composite printed circuit board is provided in a portion thereof, and is configured so that a desired lead process can be performed in an integrated board state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1871982U JPS58122475U (en) | 1982-02-12 | 1982-02-12 | composite printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1871982U JPS58122475U (en) | 1982-02-12 | 1982-02-12 | composite printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58122475U true JPS58122475U (en) | 1983-08-20 |
Family
ID=30030970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1871982U Pending JPS58122475U (en) | 1982-02-12 | 1982-02-12 | composite printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58122475U (en) |
-
1982
- 1982-02-12 JP JP1871982U patent/JPS58122475U/en active Pending
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