JPS58120579A - Method of bonding ceramics, etc. and metallic base material - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adhering an inorganic material base material such as a metal base material such as a metal base material such as a metal base material such as platinum or copper material to a base material such as a metal base material such as platinum or copper material.

Conventionally, as a method for bonding ceramic and metal, there have been seven methods in which the two base materials to be bonded are made of different materials and bonded through glass. However, this method of bonding using glass has the following drawbacks.

■Adhesion strength is low.

The strength of the glass used as an adhesive is lower than that of ceramic and metal alone. Therefore, the adhesive strength is determined by the strength of the glass with the lowest strength. The actual adhesive strength is often less than the strength of glass. That is,
Adhesion failure tends to occur at the glass-ceramic interface and the glass-metal interface, and the contact 51f strength is a rounding that depends on the adhesive strength at the glass-ceramic and metal interfaces. Further, the adhesive strength at this interface is lower than the strength of the glass alone.

■Weak against thermal shock.

This is because there is a large difference between the coefficient of thermal expansion of ceramic and the coefficient of thermal expansion of metal. That is, when the adhesive part is exposed to thermal cycles, fine cracks are generated in the glass of the annular part, and the adhesive strength is significantly reduced.

The present invention eliminates the drawbacks of the prior art described above and provides a method for bonding an inorganic material base material such as ceramic or glass with a metal base material such as platinum or copper, which has high adhesive strength and excellent thermal shock resistance. The object of the present invention is to apply inorganic material powder, which is an inner adhesive member, to the adhesive part of these base materials.
This is achieved by applying a paste containing 80wt5 and 9 to 20wt of metal base powder and then heating it.

The bonding method of the present invention will be explained in detail below.

In order to solve the above-mentioned drawbacks of the conventional technology and to bond an inorganic material base material and a metal base material with high bonding strength and high thermal shock resistance, it is necessary to The particles and the particles of the metal base material may be mixed and bonded to each other through the next layer. That is, a paste prepared by mixing a mixed powder of an inorganic material and a metal of the base material of both wave contact layers and a vehicle or the like may be applied to the adhesive portion and heated.

Due to the 7Xl heat, the inorganic material powder contained in the paste is sintered with the inorganic powder, and the metal powder is sintered with the metal powder, creating a sintered layer in which the inorganic material powder wood particles and metal powder particles are mixed. can. In addition, at the interface where the choreography agent made of paste and both substrates to be touched are in contact, inorganic material powder particles ris
The WA material substrate and also the metal powder particles are sintered with the metal substrate. As a result, the double-wave adhesive base material is firmly adhered through the mixed layer of inorganic material base material particles and metal base material particles. This is t
As shown in the figure. 1 is a metal base material, 4 is an inorganic material base material,
The figure shows an example in which an alumina substrate is used as the inorganic material base material and platinum (platinum plate) 1 is used as the metal base material. In the figure, 2 indicates expanded platinum particles, 3 indicates alumina particles, and 5 indicates adhesive M.

Such a mounting mechanism allows for greater contact mfilf compared to the case of contacting through glass. In addition, the thermal expansion coefficient of the mixed layer of inorganic material powder particles and metallic material powder particles in the contact layer is:
Since it takes an intermediate value depending on the mixing ratio of the inorganic material base material and the metal base material, which are both compatible base materials, it serves as a buffer layer that absorbs distortion caused by thermal shock or the like. That is, thermal shock resistance is improved. As described above, according to the invention, it is possible to bond an inorganic material base material and a metal material base material with (1) high contact strength and (2) excellent thermal shock resistance.

The mixing ratio of the inorganic material base powder bed and the metal base powder used in the present invention is such that the former is added to 80 Wt- and the latter is 80-
20 vt% is suitable. Either of them is 20v
When t- is less than t-, rupture occurs at the contact 51s between the base materials 9, and the metal base material, for example, a platinum wire, is pulled out.

By the way, additives are generally used to accelerate sintering. Therefore, in addition to the inorganic material base powder to be bonded, a sintering aid powder that is generally added when the base material of the dandelion is made may be added as the inorganic material base powder. For example, when the inorganic material base material is an aluminum base material, MgO is used as a sintering aid.

Powders such as 8102 and CaO may also be added. Similarly, the metal atoms contained in the metal base material as a metal material powder and l! Metal particle powder forming a d#lI body may be added.

The mixing ratio in this case is the same as above, where the mixed powder of the inorganic material base powder bed and the additive is added to 80 wt %, and the mixed powder of the metal base material powder and the additive is added to 1.

The paste used in the present invention is made by adding an organic vehicle, etc. to a mixed powder of inorganic material base particles such as aluminacera ζtsk powder, ~80vt IG, and metal base particles such as platinum powder, ~2Dwt9. Mix well and adjust! <,
Organic solvents such as n-butylcarpitol acetate
7J11 to obtain the desired viscosity.

Next, the present invention will be explained with reference to examples.

Example 1 Adhesion between an alumina ceramic tube and a platinum wire will be described. MgO as an alumina ceramic tube.

A pure I96 alumina containing a corax component such as 8102 was used. In addition, the dimensions are length 5cm, outer diameter 0.5cm.
-φ1, and the inner diameter is 0.3φ. Also, platinum m is 0.25-
1 length 10- was used. The following paste was used to bond the alumina ceramic tube and the platinum wire.

As the inorganic material base material powder, a powder obtained by pulverizing the above alumina ceramic tube in an alumina mortar was used. Note that the particle size of the crushed powder is 5 μm or less. 2μ for metal base powder
m platinum powder was used. Next, an organic vehicle is added to a mixed powder of the alumina ceramic powder t40wt*s platinum powder at 60vt, and the mixture is sufficiently mixed in an alumina mortar to form a mixed paste.

Next, n-butylcarpitol acetate was added to this mixed paste to give a viscous [TV4] adhesive paste. This adhesive paste was applied to the platinum wires described above, and then one wire was inserted into each side of the aluminum wire. In this way, the platinum wire and the alumina ceramic tube were temporarily bonded, and after death, the platinum wire and the alumina ceramic tube were bonded together and fired in air at 1550°C for 1 hour.

When the adhesive strength of this bonding method (example of the present invention) and a method of bonding a platinum wire and an alumina ceramic tube with boric acid glass were compared in a tensile 9 test, it was found that the glass bonding broke at the glass part, whereas the bonding method The samples made with the inventive bonding method were stronger than those bonded to glass and broke at the platinum wire. Also -5
In a tensile test after a thermal cycle test from 0°C to 150°C, the adhesive strength of the glass adhesive decreased by 30 to 40%, which was 9, whereas in the case of the adhesive method of the present invention, the adhesive strength changed. There was no.

Example 2 [Adhesion of alumina filler glass substrate and copper plate] Alumina powder 40v was used as a filler on the inorganic material base material.
A borosilicate glass substrate was used.

Further, a copper plate having a thickness of 0.5 was used as the metal base material. As the inorganic material base powder, the above-mentioned glass plate was ground in a mortar made of alumina and used. 40 wt % of these inorganic material base powders were mixed with 60 wt % of copper powder, and an adhesive paste was prepared in the same manner as described above. Next, 0.1 m of the above adhesive paste was applied onto the alumina filler glass substrate. After temporarily fixing the copper plate by applying the coating to a thickness of
Firing was performed at 800° C. to bond the copper plate and the glass substrate. (Hereinafter referred to as sample A) In addition, a bonding paste containing only argina filler glass powder without mixing copper powder was prepared in the same manner, and bonding was carried out in the same manner as described above.

(Hereinafter referred to as sample B) Further, using borosilicate glass as an adhesive, the sample was fired at 650° C. in a phoneme to create sample C.

The adhesive strength of these three samples A, B, and C in the tensile test was the highest in sample No. In addition, when a thermal cycle test was conducted in the same manner as described above, sample B was obtained.

In C, a peeling phenomenon occurred at the interface between the copper plate and the adhesive, but
The rate of decrease in tensile strength after the thermal cycle test was that of sample A.

Both B and C were 30%.

Thus, according to the method of the present invention, when adhering an inorganic material base material and a metal base material, it is possible to perform adhesion with high adhesive strength and excellent heat shock resistance.

BRIEF DESCRIPTION OF THE DRAWINGS The figure is a cross-sectional view of a bonded portion when an inorganic material base material and a metal base material are bonded together by the bonding method according to the present invention. 1...Metal base material, 4...Inorganic material base material Masami Akimoto, patent attorney

Claims (1)

[Claims] An inorganic material base material such as selansk or glass, and platinum. In a method of bonding metal base materials such as copper, 20% of inorganic material base material powder, which is a double-wave adhesive member, is applied to the bonded portion of both base materials.
~80wt5 and metal base powder button ~20wB! An adhesion method that involves applying a paste containing it and then heating it to 41wK.