JPS58119638A - Exposure device - Google Patents

Abstract

PURPOSE:To contrive to reduce discrepancy of positioning according to the expansion and contraction mode in regard to the exposure device of a semiconductor wafer by a emthod wherein thermostatic chambers for the wafer and for a mask are furnished. CONSTITUTION:A carrier 1-2 for supply and accommodation of the wafer is accommodated in the thermostatic oven 1-1, and is connected to an wafer conveying unit by a conveying port 2-2 on the side of the thermostatic oven. Air is heated by a heater 2-6 to be circulated in the oven by a fan heater 2-7, and is exhausted from an exhaust hole 2-5. The temperatures of the thermostatic chamber 1-1, 1-3 for the wafer and the mask are set at the temperature the same with the temperature of an wafer attracting face at exposure time. By letting alone the wafer and the mask in the respective thermostatic ovens at least before 10min of use, because the temperatures of the wafer and the mask become to the temperature the same with the temperature of the wafer attracting face, discrepancy of positioning according to the expansion and contraction mode to be generated by thermal expansion is reduced.

Description

[Detailed description of the invention] The present invention relates to an exposure apparatus for semiconductor wafers.

With the highly integrated fF of semiconductor integrated circuits, *Remarkable progress has been made in microfabrication technology, and at present, photo + 3 x 2 fee] [exposure methods include contact method, proximity method, 70 injection method, and reticle method. The step and IJ beat method used by the master is included in the registered seal.

One of the disadvantages of Photo II technology due to minute alignment is one position misalignment, which is particularly noticeable in contact type and proximity type.

Misalignment is usually resolved by breaking it down into translation mode, rotation mode, and expansion/contraction mode. Of these, 1 is in translation and rotation mode.
Although it is possible to tilt sideways during positioning, it is difficult to control the expansion/contraction mode.

The cause of this misalignment that affects the expansion/contraction mode is the mask and wave caused by the temperature difference in the deer process.
Expansion and contraction due to thermal expansion is most likely to cause mold sand to collapse.

In the conventional thin light process, the mask & mask placed in the mask Fj room are stored, and then the wafer is bre-baked.

The sample 1a is carried out by allowing the sample to cool or forcibly cooling it to room temperature and then setting it in the exposure apparatus.

By the way, the following has become clear from the 81 temperature history m* of the mask and wafer during alignment work using a contact exposure device. The temperature of the mask suction surface and the wafer suction surface at the time of *jt increases by 2 to 5 degrees Celsius as the temperature rises by 1 per exposure in the heating equipment. For this reason, the mask and the wafer 7・-U mask suction surface and the wafer ・−
Thermal expansion occurs due to the temperature difference with the adsorption surface. The expansion and contraction associated with this thermal expansion causes misalignment in the expansion and contraction mode, which significantly reduces the sheet alignment.

In order to reduce the expansion/contraction mode associated with this m1fff type, a method of using a piece of synthetic quartz mask, which has a smaller number of thermal expansion scratches than glass, has been used, but it is more expensive than synthetic quartz and is cost-effective. I can't say Ff is an expensive method.

The present invention has been accomplished above and beyond the above, and it is an object of the present invention to provide an exposure apparatus with a constant temperature bath for wafers and masks, thereby eliminating misalignment in the expansion/contraction mode.

The present invention will be described in detail below based on Practical Example-I.

Figure 1 shows a constant temperature bath for masks and a wafer inside the ft-equipment.
・-It is characterized by being equipped with a constant temperature. Contact Hojo II? Use the device. 1-1ij is a sectional view of the wafer A constant temperature chamber, in which the Kt-J wafer supply and storage carrier 1-2 is stored in the constant temperature chamber, and the carrier 1-2 is connected to the transfer port next to the sheath constant temperature chamber and connected to the wafer transfer unit. are doing. 1
-5Fj Mask Kokou tS.

1-4i1r manuk stand, 1-51j satin? Apparatus main body 7 Figure 2B, 1-1, 1-5, 1-/%- and.

The rIi diagram shows the structure of the mask constant temperature bath.

Opening/closing door at 2-1, 2-2 way I/-transport port.

There is insulation material in 2-6. Was it inhaled from intake hole 2-4? The cap is also heated by the heater 2-6, and the fan heater 2-7
It circulates in the tank and is discharged from #I pores 2-5. In addition, the temperature of the constant temperature bath for the 2-2rr mask is not required.
i of the Waeno adsorption surface in wlPK! Jakuto (b) -ni#? I'll keep it.

Leave both the mask and the mask used for the light treatment in a constant temperature bath for 10 minutes before use.

As a result, the temperature of the wave and the mask during exposure is equal to the temperature of the wave and adsorption surface, which reduces misalignment in the expansion/contraction mode due to thermal tensioning and improves one-align stacking. By doing.

High yield can be obtained.

Since the internal temperature of the collapse equipment W is unstable at the start of operation, it is desirable to operate it day and night to ensure stable boiling water.

As shown in the following two series (1) As a result of the present invention, it is possible to improve the alignment accuracy by a very simple method.

zbThe present invention σ, a contact square exposure device.

'4! ! 1 and 9 are the proxy method, project method, and step-and-1.
It can also be applied uniformly to one-heat type IMPS systems.

[Brief explanation of the drawing]

It is a contact-type equipment that is characterized by being equipped with 11 strings of bamboo and a thermostat for masks. The cross section of the second I so 1σ, wave and mask constant temperature bath is l −1′. 1-1...One weight constant temperature bath 1-2...Way...-Supply and storage gear 11 pieces 1-
6... Mask constant temperature bath 1-4... Mask stand 1-5... Storage light rA' main body 2-1... Opening/closing door 2-2... Way...-Transfer port 2- 6...Insulating material 2-4...Intake hole 2-5...Bleed hole 2-6...Heating heater 2-7...Fan heater and above Applicant: Co., Ltd. Agent Masu Physician Azusa Mogami

Claims (1)

[Claims] μ light ff: In the wafer suction surface of the wafer ridge, a constant temperature chamber set on the same hot stone as the wafer suction surface, and a wafer supply and storage gear 11 are installed.
-e, mounting surface same as -m# set for permanent wafer,
1 ton of exposure equipment that detects the azeotropy of the ° tank.