JPS58118739U - bonding block - Google Patents

bonding block

Info

Publication number
JPS58118739U
JPS58118739U JP1481782U JP1481782U JPS58118739U JP S58118739 U JPS58118739 U JP S58118739U JP 1481782 U JP1481782 U JP 1481782U JP 1481782 U JP1481782 U JP 1481782U JP S58118739 U JPS58118739 U JP S58118739U
Authority
JP
Japan
Prior art keywords
bonding block
utility
model registration
colored
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1481782U
Other languages
Japanese (ja)
Other versions
JPH0110928Y2 (en
Inventor
鳥羽　進
有賀　守
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP1481782U priority Critical patent/JPS58118739U/en
Publication of JPS58118739U publication Critical patent/JPS58118739U/en
Application granted granted Critical
Publication of JPH0110928Y2 publication Critical patent/JPH0110928Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の断面図、第２図は別の実施
例の断面図、第３図はその使用状態を示す断面図である
。 １・・・金属ブロック、２・・・アルミニウム層、３・
・・はんだ層、４・・・着色膜、１０・・・ボンディン
グブロック。FIG. 1 is a sectional view of one embodiment of the present invention, FIG. 2 is a sectional view of another embodiment, and FIG. 3 is a sectional view showing its usage. 1... Metal block, 2... Aluminum layer, 3...
...Solder layer, 4...Colored film, 10...Bonding block.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）一方の面に後の工程に支障を与えない着色が施さ
れたことを特徴とするボンディングブロック。(1) A bonding block characterized in that one side is colored so as not to interfere with subsequent processes. （２）実用新案登録請求の範囲第１項記載のブロックに
おいて、着色が後の工程の前あるいは工程中に除去可能
な着色膜によることを特徴とするボンディングブロック
。(2) Utility Model Registration A bonding block according to claim 1, characterized in that the coloring is a colored film that is removable before or during a subsequent process. （３）　　実用新案登録請求の範囲第１項記載のブロッ
クにおいて、着色がその面の後の工程で使用される部分
を除いて施されたことを特徴とするボンディングブロッ
ク。(3) A bonding block characterized in that the block described in claim 1 of the utility model registration is colored except for the portions of the surface that will be used in subsequent processes.
JP1481782U 1982-02-05 1982-02-05 bonding block Granted JPS58118739U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1481782U JPS58118739U (en) 1982-02-05 1982-02-05 bonding block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1481782U JPS58118739U (en) 1982-02-05 1982-02-05 bonding block

Publications (2)

Publication Number Publication Date
JPS58118739U true JPS58118739U (en) 1983-08-13
JPH0110928Y2 JPH0110928Y2 (en) 1989-03-29

Family

ID=30027271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1481782U Granted JPS58118739U (en) 1982-02-05 1982-02-05 bonding block

Country Status (1)

Country Link
JP (1) JPS58118739U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272545A (en) * 1986-05-21 1987-11-26 Hitachi Ltd Hybrid ic
JPS6429885U (en) * 1987-08-13 1989-02-22

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4420211Y1 (en) * 1967-02-17 1969-08-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4420211Y1 (en) * 1967-02-17 1969-08-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272545A (en) * 1986-05-21 1987-11-26 Hitachi Ltd Hybrid ic
JPS6429885U (en) * 1987-08-13 1989-02-22

Also Published As

Publication number Publication date
JPH0110928Y2 (en) 1989-03-29

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