JPS58115312A - Detector for surface defect - Google Patents

Detector for surface defect

Info

Publication number
JPS58115312A
JPS58115312A JP21445681A JP21445681A JPS58115312A JP S58115312 A JPS58115312 A JP S58115312A JP 21445681 A JP21445681 A JP 21445681A JP 21445681 A JP21445681 A JP 21445681A JP S58115312 A JPS58115312 A JP S58115312A
Authority
JP
Japan
Prior art keywords
light
detected
dimensional position
slit light
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21445681A
Other languages
Japanese (ja)
Inventor
Masayuki Iwatsuka
岩塚 昌幸
Yoshimasa Fujiwara
祥雅 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP21445681A priority Critical patent/JPS58115312A/en
Publication of JPS58115312A publication Critical patent/JPS58115312A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To easily and precisely enter an optical cutting signal obtained by irradiating slit light to an object to be detected by detecting the optical cutting signal through a photodetector in which plural one-dimensional position sensors are arrayed in parallel to detect the surface status of the object. CONSTITUTION:Slit light L is irradiated to the object 4 to be detected from the 45 deg. inclined direction, the object 4 to be detected is moved in the direction of an arrow and optically cut light indicating the change of hight direction due to the slit light L is detected by one-dimensional position sensors arranged just above the object to be detected so as to be intersected with the slit light L at right angles. Optically cut light (l) obtained by irradiating the slit light L to the object 4 to be detected behaves as shown in the figure (a). When an observation part for the one-dimensional position sensor is defined as (a), the object 4 to be detected is continuously moved in the direction of an arrow and the optical cutting signal is analog-processed, so that the height in each peak point, an interval between peaks, width more than a level, width less than a level, etc. are obtained.

Description

【発明の詳細な説明】 本発明は、立体的な計測を行ない部分的々高さ寸法の不
良などを検出する表面欠陥検出装置に関するもので、そ
の目的とするところは、光切断信号を容易に且つ正確に
取り込むことができるようにすることにより、他の目的
とするところは、欠陥噴出を高速で行なうようKするこ
とにある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a surface defect detection device that performs three-dimensional measurement to detect defects in local height dimensions, and its purpose is to easily detect optical cutting signals. Another objective is to enable high-speed defect ejection by being able to capture accurately.

従来の表面欠陥検出装置は、第1図のように、レーザ光
などの光源(1)からの光を振動ミラー(2)、放物面
鏡(3)を介してフライシジスポット光を被検物14)
に照射し、上方斜め450から2次元ポジションセンサ
(6)により光切断光を逐次取り込み、処理回路(6)
で処理して表面状態を検査するようにしていた。このも
のにあっては、2次元ポジションセンサ(6)は第2図
に示すように、拡散した光をとらえた場合、検知面に分
布した光の中心(X印)を検知するため、光切断に用い
るときには、フライシジスポット光を用い、各点のデー
タを逐次取り込まねばならず、データを同時に取り込む
ことができないという欠点を有していた。
As shown in Figure 1, a conventional surface defect detection device detects fly spot light by passing light from a light source (1) such as a laser beam through a vibrating mirror (2) and a parabolic mirror (3). Thing 14)
The two-dimensional position sensor (6) sequentially captures the cut light from the upper diagonal 450, and the processing circuit (6)
The surface condition was inspected by treating the surface with In this case, as shown in Figure 2, when the two-dimensional position sensor (6) captures diffused light, it detects the center (X mark) of the light distributed on the detection surface, so it cuts the light. When used for this purpose, a fly-sighted spot light is used, and data at each point must be taken in sequentially, which has the disadvantage that data cannot be taken in at the same time.

本発明はかかる点に鑑みて々されたもので、以下実施例
により詳細に説明する。
The present invention has been devised in view of this point, and will be explained in detail below using Examples.

第8図において、+4)は被検物で、光源il+の光を
レンズ(7)により平行光線とし、反射!ラー:8)お
よびスリット(9)を介して被検物(4)にスリ1ソト
光りを一一 照射し、光切断信号を得る。叫は受光素子で、第4図の
ように複数個の1次元ポジションセンサ(11υ、(1
1t)・・・(lln)を並設して形成したもので、こ
の受光素子−によって上方斜め45・から検知して表面
状態を検査する。n個の1次元ポジションセンサ(lt
+) 、 (us)・・・(lln)を並設し九受光素
子叫で光切断光を受光したと趣、ポジションt!シ”j
(111)は端子からの距離χ1に反比例した電流りを
生じる。1gジショシセシサ(lit)・・・(ttn
)についても同様に電流l、・・・1.を生じる。これ
らの信号を電流−電圧変換回路+1!+で電圧に変換し
本−ルド回路α講に取り込み、処理回路−6)で信号処
理して表示する。ここで、これらの譬−夕はそれぞれ時
間的々ずれを生じることがなく、同時に帛−ルド回路(
1譜に取り込まれることKなる。被検物(4)の表面に
欠陥がない場合は光切断光に乱れがないため、第5図C
a)のように検出信号に乱れが々いが、表面に欠陥があ
る場合には、第5図(b)のように光切断光が乱れるた
め、n個の1ジションセン号(11+) 、 (l1g
)・・・(lln)のうち、一部の検出信号が変化する
。これにより表面状態を噴出し、欠陥を検出できる。
In Fig. 8, +4) is the object to be tested, and the light from the light source il+ is made into parallel light by the lens (7) and reflected! A beam of light is irradiated onto the object (4) through the mirror (8) and the slit (9) to obtain a light cutting signal. The sensor is a light receiving element, and as shown in Figure 4, it is composed of multiple one-dimensional position sensors (11υ, (1
1t)...(lln) are arranged in parallel, and the surface condition is inspected by detecting from an obliquely upward direction 45 with this light-receiving element. n one-dimensional position sensors (lt
+), (us)...(lln) were arranged in parallel, and the nine light-receiving elements received the light cutting light, position t! shi”j
(111) produces a current that is inversely proportional to the distance χ1 from the terminal. 1g (lit)... (ttn
), the current l, . . . 1 . occurs. These signals are converted into a current-voltage conversion circuit +1! + converts it to voltage, inputs it into the main field circuit α, processes the signal in processing circuit 6), and displays it. Here, these analogies do not have any time lag, and at the same time the interwoven circuit (
It will be incorporated into one score. If there is no defect on the surface of the test object (4), there will be no disturbance in the optical cutting light, so Fig. 5C
There is a lot of disturbance in the detection signal as shown in a), but if there is a defect on the surface, the optical cutting light will be disturbed as shown in Fig. 5(b). l1g
)...(lln), some detection signals change. This allows surface conditions to be revealed and defects to be detected.

第6図は本発明の他の実施例で、被検物I4)に第8図
と同様にしてスリット光りを斜め45・から照射し、被
検物(4)を矢印方向く移動し、真上からスリット光と
は直角になるように配置した第7図に示す1次元ポジシ
ョンセンサ(11)で被検物14)K当ったスリット光
りによる高さ方向の変化を示す光切断光を検出するもの
である。第1図において、Q4はピークホールド回路、
0@はピーク間隔検出回路、−は凸部巾検出回路、Q乃
はテーブル制御部、U榎は演算制御部であ夛、(I−F
i表示部である。
FIG. 6 shows another embodiment of the present invention, in which the test object I4) is irradiated with slit light from an oblique angle 45° in the same manner as in FIG. The one-dimensional position sensor (11) shown in Fig. 7, which is arranged from above at right angles to the slit light, detects the light cutting light that shows the change in the height direction due to the slit light hitting the object 14)K. It is something. In Figure 1, Q4 is a peak hold circuit,
0 @ is the peak interval detection circuit, - is the protrusion width detection circuit, Q is the table control unit, U is the calculation control unit, (I-F
This is the i display section.

スリット光りを被検物(4)に照射することにより得ら
れる光切断光l#i第8図(+1)のようにをり、1次
元ポジションセンサ(11)の観測部をaとし、被検物
(4)の移動方向を矢印方向として被検物+4)を連続
的に移動させ、光切断信号をアナログ処理することによ
り第S図<b)のように、各ピーク点の高さ、ピークの
間隔、あるレベル以上の巾、あるレベル以下の巾等が得
られる。立体的な形状の検査の場合、各点の絶対的な寸
法計測よりも形状の連続性や特徴的な点の寸法、間隔が
問題と々る場合が多い。また、定位置の寸法を検査する
場合でも、被検物(4)を止めずに移動させるテーブル
にニジコータなどのテーブル制御部αηを設けてそこか
ら定位置の信号を出力し、そのタイミンクで1次元ポジ
ションセンtj (11)からの位置信号をサンプルす
ることにより寸法が測定できる。
The light-cutting light l#i obtained by irradiating the slit light onto the test object (4) is as shown in Fig. 8 (+1), and the observation part of the one-dimensional position sensor (11) is a, and the test object By continuously moving the object +4) with the moving direction of the object (4) in the direction of the arrow, and performing analog processing on the optical cutting signal, the height of each peak point and the peak , the width above a certain level, the width below a certain level, etc. can be obtained. When inspecting a three-dimensional shape, the continuity of the shape, the dimensions of characteristic points, and the spacing are often more problematic than the absolute dimension measurement of each point. In addition, even when inspecting the dimensions of a fixed position, a table control unit αη such as a Nijicoater is provided on the table that moves the object (4) without stopping, and a signal of the fixed position is output from there. Dimensions can be measured by sampling the position signal from the dimensional position center tj (11).

叙上のように本発明は、被検物にスリ・シト光を照射し
て得られる光切断信号を複数個の1次元ポジションセン
サを並設して形成した受光素子により検知して表面状態
を検査する如くしたから、光切断信号を容易に且つ正確
に取り込むことができて被検物表面の欠陥を容易に検査
でき、又、被検物にスリット光を照射し前記被検物を移
動させて優られる光切断信号を1次元1ジシヨンセンサ
により検知して表面状態を検査するようにしたから、表
面の欠陥噴出を高速でできるという効果を奏するもので
ある。
As described above, the present invention detects a light cutting signal obtained by irradiating a specimen with a pick-and-slide light using a light receiving element formed by arranging a plurality of one-dimensional position sensors in parallel, and detects the surface condition. Since the inspection is carried out in a similar manner, it is possible to easily and accurately capture the optical cutting signal, and to easily inspect defects on the surface of the object to be inspected, and also to move the object by irradiating the object with a slit light. Since the surface condition is inspected by detecting the optical cutting signal which is generated by a one-dimensional one-motion sensor, it is possible to detect defects on the surface at high speed.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の表面欠陥噴出装置の構成図、第2図は2
次元ポジションセンサの説明図、第8図は本発明の一実
施例の構成図、第4図は同上のブロック回路図、第5図
(@) 、 (−は同上の動作説明図、sS図は本発明
の他の実施例の要部構成図、第7図は同上のブロック回
路図、第8図(a) 、 (b)は同上の動作説明図で
ある。 (4)・・・被検物、(9)・・・スリット、(至)・
・・受光素子、(11)、 (11+) 、 (11m
)=(lln) = 1次元車ジショーJセンサ。 代理人 弁理士  石 1)長 七 第1問 第4図 第5図 (a )     (b) 第6図 第7図 ] (o)     is8″ 手 続 補 正 書(自発) 昭和57年8 月23日 特許庁長官殿 1、事件の表示 昭和56年特許ii[第214456号:6発 明の名
称 形状欠陥検出装置 (名称変更) (、補正をする者 事件との関係      特許出願人 住  所  大阪府門真市大字門真1048番地名 称
 (583)松下電工株式会社 代表者小 林  郁 1、代理人 郵便番号  530 電話大阪(06) 345−7777 (代表)15、
補正命令の日付 別紙の通り 訂正明細書 願書番号  特願昭56−214456号1、 発明の
名称 形状欠陥検出装置 2、特許請求の箱間 11ノ  被検物にスリット光を照射して得られる光切
vIT信号を複数個の1次元ポジションセンサを並設し
て形成した受光素子により検知して表面状態を検査する
如くして収ることを特徴とする1広欠陥検出装置。 1り  被検物にスリット光を照射し前記被検物を移動
させて得られる光切断信号を1次元ポジションセンサに
より検知して表面状態を検知する如くして成ることを特
徴とする形状欠陥検出装置。 3、発明の詳細な説明 本発明は、立体的な計測4行ない部分的な高さ寸法の不
良などを検出する形状欠陥検出装置に関するもので、そ
の目的とするところは、光切断信号を容易に且つ正確に
取り込むことができるようKt、にとにあり、他の目的
とするところは、欠陥検出を高遍で行なうようKするこ
とにある。 光切断法による高さ計測を行なうのに、対象物に平面光
を斜め45°から投射し、真tから平面光とは直角にな
るように配置されたうインセンサで対象−に当たった平
面光による高さ方向の変化をえるまでは対象を動かすこ
とができず、しかも対象の光切断パターンの変化点を検
出する場合などr!測定間隔を充分小さくする必要があ
り、後処理の複雑さなどからも検出の高速化が行ないく
くいという欠点が千った。 第1図、112図か上述の光切断法による検出する場合
の@28明にかかる実施例の概略構成及び回路ブロック
を示しておシ、111図において被検物(4)Kスリッ
ト光りを斜め45°から照射し、被検物(船を矢印方向
に移動し、真上からスリット光とは直角になるように配
置した@2@に示す1次元ボジシ3シセンサ111)で
被検物14)K当ったスリット光りによる高さ方向の変
化を示す光切断光を検出するのである。第2mにおいて
、α4はピーク本−ルド回路、a@はピーク間隔検出回
路、a@は凸部巾検出回路、llhはテーブル制m部、
α鴫は演算制御部であり、翰は表示部である。 スリット光りを被検物141に照射する仁とくよシ得ら
れる光切断光trxss図(alのようにな夛、1次元
ポジションセンサIllの観fsSaを1とし、被検物
(4)の移動方向を矢印方向として被検物(41を連続
的に移動させ、光切断信号をアナ0ジ処理することによ
り第3図(blのように、各ピーク点の高さ、ピークの
間隔、あるレベル以上の中、あるレベル以下の巾等が得
られ40立体的な形状の検査の場合、各点の絶対的な寸
法計測よシも形状の連続性や特徴的な点の寸法、間隔が
問題となる場合が多い。また、定位置の寸法を検査する
場合でも、被検物14)を止めずに移動S−するテーブ
ルにエンコータなどのテーブル制御S鱈を設けてそこか
ら定位置の信号を出力し、そのタイミングで1次元4ジ
シ3ンセンサ)11)からの位置信号をサンプルするこ
とにより寸法が測定できる。 11411rill1発明に対応する従来の形状欠陥検
出装置を示しておシ、かかる従来例装置はレーザ光など
の光源+11からの光を振動′ミラー12)、放物面鏡
1B)を介してフタインタスポット光を被験物(41に
照射し、土方斜め45°から2次元ポジションtンサ■
により光切断光を逐次取り込み、処理回路(組でJ6濡
して表面状態を検査するようにしていた。 このものにあっては、2次元ボ5シ3ンセンサ161は
1g5図に示すように、拡散した光をとらえた場合、検
知面に分布した光の中心(X印)を検知するため、光切
断に用いるときには、フラインタスポット光を用い、各
点のデータを逐次取り込まねばならず、データを同時に
取り込むことかでII7にいという欠点を有していた。 Il1発明r!かかる点に鑑みてなされたもので、以下
実施例により詳細に説明する。 1g6図において、(41は被検物で、光源(11の光
をレンズ(マIKより平行光線とし、反射ミラー1組お
よびスリット(9)を介して被検物(4)にスリット光
りを照射し、光切断信号を得る。1MIIは受光素子て
、第71i!ilのように複数個の1次元ポジションセ
ンサす(Ill)、(lim)・・・(lln)を並設
して形成したもので、この受光素子(至)によって上方
斜め45@かも検知して表面状層を検査する。n個の1
次元ポジションセンサ(l1l) 、(l1m) −(
l1m)を並設した受光素子鳴で光切断光を受光したと
き、ポジションセンサ(1111は端子からの距離XI
K反比例した電流1st生じる。ポジションセンサ(I
Im)川(lln)についても1i1sK電流Im・・
・In を生じる。これらの信号を電流−電圧変換回路
+111で電圧に変換し率−ルド回路(IIに取多込み
、N&j1回路(・1で信号処理して表示する。ここで
、これらのデータはそれぞれ時間的なずれを生じること
がなく、同時にホールド回路QIK取)込まれることに
なる。被検物14)の表面に欠陥がない場合は光切断光
に乱れがないため、第8Fgialのように検出信号K
すれがないが、表面に欠陥がある場合には、悩畠図(−
のように光切断光が乱れるため、n個のポジションセン
サ(111) 。 (Ill)・・・(lln)のうち、一部の検出信号が
変化する。これにより表面状態を検出し、欠陥を検出で
きる0 畝上のように本発明は、被検物にスリット光を照射して
得られる光切断信号を複数個の1次元ポジションセンサ
を並設して形成した受光素子によ)検知して表面状態を
検査する如くしたから、光切断信号を容易に且つ正確に
取シ込むことができて被検−表面の欠陥を容易に検査で
き、又、被検−にスリラド光を照射し前記被検物を移動
させて得られる光切断信号を1次元卓ジシ3シセンサに
よ〉検知して表面状態を検査するようにしたから、表面
の欠陥検出を高速でできるという効果を奏するものであ
る。 4、図面の簡単な説明 111図は本発明の一実施例の要aa@成図、第2図は
同上のブロック回路図、第3図fat 、 (b)は−
上の動作説明図、第4図Fi111発明に対応する従来
の形状欠陥検出装置のII成因、第5図は2次元ボジシ
3ンtンサの説#4図、116図は未発明の他の実施例
の構成図、第7図は同上のブロック回路図、第8図(m
l、(騙は同上の動作説明図である0(41・・・被検
物、191−・・スリット、−・・・受光素子、を川、
 (1ls)、(ll5) ”・(lln) = 1次
元卓ジシgンtン図而中第1〜第8図を別紙の過9訂正
するO第1図 第3図 第4図
Figure 1 is a configuration diagram of a conventional surface defect ejection device, and Figure 2 is a 2
An explanatory diagram of the dimensional position sensor, Fig. 8 is a configuration diagram of an embodiment of the present invention, Fig. 4 is a block circuit diagram of the same as above, Fig. 5 (@), (- is an explanatory diagram of the same as above, sS diagram is A main part configuration diagram of another embodiment of the present invention, FIG. 7 is a block circuit diagram same as above, and FIGS. 8(a) and (b) are operation explanatory diagrams same as above. (4)... Test subject Thing, (9)...slit, (to)
... Light receiving element, (11), (11+), (11m
) = (lln) = 1-dimensional vehicle Jisho J sensor. Agent Patent Attorney Ishi 1) Chief 7th Question 1 Figure 4 Figure 5 (a) (b) Figure 6 Figure 7] (o) IS8″ Procedural Amendment (Spontaneous) August 23, 1982 Mr. Commissioner of the Japan Patent Office 1, Indication of the case 1982 Patent II [No. 214456: 6 Name of the invention Shape defect detection device (name change) (Relationship with the person making the amendment Patent applicant address Osaka prefecture) 1048 Kadoma, Kadoma City Name (583) Matsushita Electric Works Co., Ltd. Representative Iku Kobayashi 1, Agent postal code 530 Telephone Osaka (06) 345-7777 (Representative) 15,
Date of amendment order as attached. Application number for corrected specification: Japanese Patent Application No. 56-214456 1. Title of invention: Shape defect detection device 2. Box 11 of claim: Light obtained by irradiating the object to be inspected with slit light. 1. A wide defect detection device characterized in that a cut vIT signal is detected by a light receiving element formed by arranging a plurality of one-dimensional position sensors in parallel to inspect a surface condition. 1. Shape defect detection characterized in that a one-dimensional position sensor detects a light cutting signal obtained by irradiating a slit light onto a test object and moving the test object to detect a surface condition. Device. 3. Detailed Description of the Invention The present invention relates to a shape defect detection device that detects defects in partial height dimensions by performing four three-dimensional measurements, and its purpose is to easily detect optical cutting signals. In addition, the Kt value is set so that defect detection can be carried out with high accuracy. To measure height using the light section method, a plane light is projected onto the object from an angle of 45 degrees, and the plane light hits the object through a sensor placed at right angles to the plane light from the true angle. The object cannot be moved until a change in the height direction is detected due to r! The disadvantage is that the measurement interval needs to be sufficiently short, and the complexity of post-processing makes it difficult to achieve high-speed detection. Figures 1 and 112 show the schematic configuration and circuit blocks of the embodiment according to @28 light in the case of detection by the above-mentioned optical cutting method. Irradiate from 45 degrees, and use the test object (1-dimensional position 3 sensor 111 shown in @2@, moving the ship in the direction of the arrow and placing it at right angles to the slit light from directly above) to test object 14). It detects the light cutting light that shows the change in height direction due to the slit light hitting K. In the second m, α4 is a peak main field circuit, a@ is a peak interval detection circuit, a@ is a protrusion width detection circuit, llh is a table-based m section,
The α-shape is the arithmetic control section, and the pen is the display section. The light-cutting light trxss diagram obtained by irradiating the slit light onto the test object 141 (as shown in al). By continuously moving the test object (41) in the direction of the arrow and performing analog processing on the optical cutting signal, the height of each peak point, the interval between peaks, and the In the case of inspecting a three-dimensional shape with a width below a certain level, the continuity of the shape and the dimensions and spacing of characteristic points are more important than the absolute measurement of each point. In addition, even when inspecting the dimensions of a fixed position, a table control unit such as an encoder is provided on a table that moves the object 14) without stopping, and a fixed position signal is output from there. The dimensions can be measured by sampling the position signal from the one-dimensional four-dimensional sensor (11) at that timing. 11411rill1 A conventional shape defect detection device corresponding to the invention is shown. This conventional device converts light from a light source such as a laser beam into a lid interspot through a vibrating mirror 12) and a parabolic mirror 1B). Irradiate light onto the test object (41) and position it in a two-dimensional position from a 45° angle to Hijikata.
The cutting light was sequentially taken in by the processing circuit (J6) and the surface condition was inspected. When capturing diffused light, the center (X mark) of the light distributed on the detection surface is detected, so when using it for light cutting, a flinter spot light must be used and data at each point must be captured sequentially. It had a drawback that II7 was affected by the simultaneous incorporation of both.I11 Invention r! This invention was made in view of this point, and will be explained in detail in Examples below.In Fig. 1g6, (41 is the specimen) Then, the light from the light source (11) is made into parallel light from the lens (Ma IK), and the slit light is irradiated onto the test object (4) through a set of reflection mirrors and the slit (9) to obtain a light cutting signal. The light receiving element is formed by arranging a plurality of one-dimensional position sensors (Ill), (lim)...(lln) in parallel as shown in No. 71i! Detect the diagonal 45@ and inspect the superficial layer.n 1
Dimensional position sensor (l1l), (l1m) -(
When the light-cutting light is received by the light-receiving elements arranged in parallel, the position sensor (1111 is the distance XI from the terminal.
A current 1st inversely proportional to K is generated. Position sensor (I
Im) Also for the river (lln), 1i1sK current Im...
・Produces In. These signals are converted to voltage by a current-voltage conversion circuit +111, taken into a rate circuit (II), and processed and displayed by an N & j1 circuit (1).Here, each of these data is The hold circuit QIK is captured at the same time without any deviation.If there is no defect on the surface of the object 14), there is no disturbance in the light cutting light, so the detection signal K
If there are no scratches but there are defects on the surface, use the
n position sensors (111). Some of the detection signals among (Ill)...(lln) change. This allows the surface condition to be detected and defects to be detected.0 Like the ridges, the present invention uses a plurality of one-dimensional position sensors arranged in parallel to transmit the light cutting signal obtained by irradiating the object with slit light. Since the surface condition is inspected by detecting the surface condition using the formed light receiving element, the light cutting signal can be easily and accurately inputted, and defects on the surface of the object to be inspected can be easily inspected. The surface condition is inspected by irradiating the inspection object with Thrirad light and moving the object to detect the optical cutting signal, which is then detected by a one-dimensional tabletop sensor, which enables high-speed detection of defects on the surface. This has the effect that it can be done with 4. Brief explanation of the drawings 111 is a schematic diagram of an embodiment of the present invention, FIG. 2 is a block circuit diagram of the same as above, FIG. 3 is a fat diagram, and (b) is a -
The above operation explanatory diagram, Fig. 4 shows the II origin of the conventional shape defect detection device corresponding to the Fi111 invention, Fig. 5 shows the theory #4 of the two-dimensional position sensor, and Fig. 116 shows another uninvented implementation. The configuration diagram of the example, Figure 7 is the block circuit diagram of the same as above, and Figure 8 (m
l, (The figure is the same operation explanatory diagram as above.
(1ls), (ll5) ”・(lln) = One-dimensional desk diagram Figure 1 to Figure 8 are corrected in the attached sheet. Figure 1 Figure 3 Figure 4

Claims (2)

【特許請求の範囲】[Claims] (1)被検物にスリット光を照射して得られる光切断信
号を複数個の1次元ポジションセンサを並設して形成し
た受光素子により検知して表向状態t−検査する如くし
て成ることを特徴とする表面欠陥検出装置っ
(1) A light cutting signal obtained by irradiating the object with slit light is detected by a light receiving element formed by arranging a plurality of one-dimensional position sensors in parallel, and the surface state t-inspection is performed. A surface defect detection device characterized by
(2)被検物にスリ1ソト光を照射し前記被喰物を移動
させて得られる光切断信号を1次元ポジションセンナに
より検知して表面状態を検知する如くして成ることを特
徴とする表面欠陥検出装置。
(2) A one-dimensional position sensor detects a light cutting signal obtained by irradiating the object to be inspected with one-strip light and moving the object to detect the surface condition. Surface defect detection device.
JP21445681A 1981-12-29 1981-12-29 Detector for surface defect Pending JPS58115312A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21445681A JPS58115312A (en) 1981-12-29 1981-12-29 Detector for surface defect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21445681A JPS58115312A (en) 1981-12-29 1981-12-29 Detector for surface defect

Publications (1)

Publication Number Publication Date
JPS58115312A true JPS58115312A (en) 1983-07-09

Family

ID=16656046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21445681A Pending JPS58115312A (en) 1981-12-29 1981-12-29 Detector for surface defect

Country Status (1)

Country Link
JP (1) JPS58115312A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59231404A (en) * 1983-06-15 1984-12-26 Kokusai Kogyo Kk Method and device for automatic measurement of state of road surface
JPS6057469A (en) * 1983-06-02 1985-04-03 ゼネラル・エレクトリツク・カンパニイ Integral illumination and camera
JPS60165506A (en) * 1984-02-08 1985-08-28 Meinan Mach Works Inc Optical detecting method
JPS60188362U (en) * 1984-05-23 1985-12-13 島田化成株式会社 Welding inspection equipment
JPS61206810U (en) * 1985-06-17 1986-12-27
JPS6390706A (en) * 1986-10-03 1988-04-21 N T T Gijutsu Iten Kk Shape measuring instrument for body
JPS63229311A (en) * 1987-03-19 1988-09-26 Fujitsu Ltd Detection of cross-sectional shape
JPS6483104A (en) * 1987-09-25 1989-03-28 Ntt Technology Transfer Object shape measuring device
JPH02156107A (en) * 1988-12-08 1990-06-15 Kunio Yamashita Visual inspection device for soldered part of printed circuit board
JPH04122809A (en) * 1990-09-14 1992-04-23 Matsushita Electric Works Ltd Shape recognition device
JPH0735522A (en) * 1993-07-23 1995-02-07 Nippon Doro Kodan Method of measuring profile of cross-section of paved road surface with the use of laser

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5428651A (en) * 1977-08-08 1979-03-03 Hitachi Ltd Appearance inspecting apparatus of objects
JPS54114264A (en) * 1978-02-27 1979-09-06 Nippon Steel Corp Screw inspection method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5428651A (en) * 1977-08-08 1979-03-03 Hitachi Ltd Appearance inspecting apparatus of objects
JPS54114264A (en) * 1978-02-27 1979-09-06 Nippon Steel Corp Screw inspection method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057469A (en) * 1983-06-02 1985-04-03 ゼネラル・エレクトリツク・カンパニイ Integral illumination and camera
JPS59231404A (en) * 1983-06-15 1984-12-26 Kokusai Kogyo Kk Method and device for automatic measurement of state of road surface
JPS60165506A (en) * 1984-02-08 1985-08-28 Meinan Mach Works Inc Optical detecting method
JPS60188362U (en) * 1984-05-23 1985-12-13 島田化成株式会社 Welding inspection equipment
JPS61206810U (en) * 1985-06-17 1986-12-27
JPH0432567Y2 (en) * 1985-06-17 1992-08-05
JPS6390706A (en) * 1986-10-03 1988-04-21 N T T Gijutsu Iten Kk Shape measuring instrument for body
JPS63229311A (en) * 1987-03-19 1988-09-26 Fujitsu Ltd Detection of cross-sectional shape
JPS6483104A (en) * 1987-09-25 1989-03-28 Ntt Technology Transfer Object shape measuring device
JPH02156107A (en) * 1988-12-08 1990-06-15 Kunio Yamashita Visual inspection device for soldered part of printed circuit board
JPH04122809A (en) * 1990-09-14 1992-04-23 Matsushita Electric Works Ltd Shape recognition device
JPH0735522A (en) * 1993-07-23 1995-02-07 Nippon Doro Kodan Method of measuring profile of cross-section of paved road surface with the use of laser

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