JPS58110027A - Chip type condenser - Google Patents
Chip type condenserInfo
- Publication number
- JPS58110027A JPS58110027A JP20878681A JP20878681A JPS58110027A JP S58110027 A JPS58110027 A JP S58110027A JP 20878681 A JP20878681 A JP 20878681A JP 20878681 A JP20878681 A JP 20878681A JP S58110027 A JPS58110027 A JP S58110027A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- capacitor
- main body
- metal terminal
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はチップ型コンデンサに関し、特にチップ戯園体
亀購コンテンサの栴造の改所に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip type capacitor, and more particularly to a chip capacitor manufactured by SEIZO.
一般に、チップ型固体電騎コンデンサは、例えは第１図
に示すように、弁作用を有するタンタル金属粉床を加圧
ａ型し、焼結してなるコンテンサー素子１に予めタンタ
ル機を陽極リード２として、植立し、仁の陽極リード２
の突出部分に第１の板状金属端子３を溶接するとともに
、第２の板状金属端子４をコンデンサ索子１の周面にｎ
電体醸化皮膜層５および半導体層６を介して形成された
陰極電極引出し層７に接続し、コンデンサ索子１の全局
面を外装樹脂材８にて被覆し、然る後、第２図および第
３図に示すように板状金Ｊ１１＋４子３，４を折り曲は
箇所３ａ、３ｂ、４ａ、４ｂにて折り曲は加工では第２
図に示すようにます板状金属端子３，４のコンデンサ本
体（以下本体と略称）９から突出した根本部のζシ曲は
箇ｉ３ａ、４ａを本体９の左右の側面９ａに沿って折り
白は加工し、続いて先端部の折り曲は箇所３ｂ 、４ｂ
を本体９の底面９ｂに沿って折シ曲は加工している。こ
のため、第３図に示すように板状金属端子３．４の折シ
曲げ箇所３ａ、、３ｂおよび４ａ、４ｂの１餉の角度は
折シ曲は加工後に生じるスプリングバックによりて第２
図に示した折９曲は加工時の１餉の角度よ、シも大きく
なシ、板状金ＩＩ４端子３，４が本体９のｉｍｔ＋向９
ａおよび底面９ｂと平行密接状態を保持できなくなり、
１ｌＩＩｌ而９ａおよび底面９ｂから離れてしまってい
た。In general, a chip type solid electromagnetic capacitor is made by pressurizing a bed of tantalum metal powder having a valve action and sintering it into a shape A, for example, as shown in FIG. 2, planted, and the anode lead 2
A first plate-shaped metal terminal 3 is welded to the protruding portion of the capacitor cord 1, and a second plate-shaped metal terminal 4 is welded to the circumferential surface of the capacitor cord 1.
It is connected to the cathode electrode lead-out layer 7 formed through the electroconductive film layer 5 and the semiconductor layer 6, and the entire surface of the capacitor cord 1 is covered with an exterior resin material 8, and then, as shown in FIG. As shown in Fig. 3, the sheet metal J11+4 pieces 3 and 4 are bent at points 3a, 3b, 4a, and 4b.
As shown in the figure, the root parts of the plate-shaped metal terminals 3 and 4 protruding from the capacitor body (hereinafter referred to as the body) are curved by folding the edges 3a and 4a along the left and right sides 9a of the body 9. is processed, and then the tip is bent at points 3b and 4b.
A bend is formed along the bottom surface 9b of the main body 9. For this reason, as shown in Fig. 3, the angle of each bend at the bending points 3a, 3b and 4a, 4b of the plate metal terminal 3.4 is changed to a second angle due to the springback that occurs after processing.
The 9 folds shown in the figure are the angles of 1 fold during machining, and the angle is also large.
It is no longer possible to maintain a parallel and close state with a and the bottom surface 9b,
1lIIlIt was separated from 9a and the bottom surface 9b.
この大め次のような欠点をＭしていた。This major drawback was M.
（イ１ コンデンサの為さ寸法および技手方向の寸法か
大きくなってしまい、印刷配線板への実装時の体積効率
が恐い。(1) Because the capacitor's dimensions and the dimensions in the operator's direction are large, the volumetric efficiency when mounting it on a printed wiring board is a concern.
（ロ）コンデンサのｆ、ｌｊ桐配線板への実装時の座シ
が悪い。(b) The capacitor f and lj are poorly seated when mounted on the paulownia wiring board.
Ｆ−Ｍ 印刷配線板への半田付は実装前の接着剤によ
る仮留め工学を行なう場合、コンデンサの底底面に接着
剤を厚く塗布しなくてはならない。FM When soldering to a printed wiring board using adhesive before mounting, it is necessary to apply a thick layer of adhesive to the bottom of the capacitor.
本発明の目的はかかる従来欠点を除去したチップ型コン
デンサを提供するものでおる。An object of the present invention is to provide a chip type capacitor which eliminates such conventional drawbacks.
不発明によれ＃：ｔ′１Ｍ脂外装されたコンデンサ本体
と、該本体より導出され、かつ本俸外面に沿って複数の
一所を折り曲は加工して杉成された板状金属端子を南す
るナツプ型コンデンサにおいて、前記板状金属端子が沿
った本体外面の少なくとも一面にテーパ状の切欠き部を
形成し次ことを臀徴とするチップ禿コンデンサが得られ
る。According to the invention, a capacitor body is coated with t'1M fat, and plate-shaped metal terminals are formed from cedar by bending a plurality of places along the outer surface of the capacitor body and extending from the body. In the nap-type capacitor, a tapered notch is formed on at least one surface of the outer surface of the main body along which the plate-shaped metal terminal runs, and a chip capacitor is obtained in which a tapered notch is formed on at least one surface of the outer surface of the main body along which the plate-shaped metal terminal runs.
以下、本発明の拠施ψりを第４図〜第８図を相いて説明
する。Hereinafter, the implementation of the present invention will be explained with reference to FIGS. 4 to 8.
第４図は本発明の第１の実施例によるチップ屋コンデン
サの板状金属端子３．４を折り曲は加工する前の状態を
示す正面図であり、本体９の底面９ｂの両端部には底面
９ｂに対しＡの角度をもつテーパ状Ｏ切欠きｓ９Ｃが杉
成されている。この切欠き部９Ｃの角度人は、第３図に
示す板状金属端子３，４の折シ曲げ箇所３ａと３ｂまた
は４ａと４ｂのスプリングバックの角度の合計にはは等
しく、かつ方向反対に形成されている。FIG. 4 is a front view showing the state before bending and processing the plate metal terminal 3.4 of the chip shop capacitor according to the first embodiment of the present invention. A tapered O notch s9C having an angle of A with respect to the bottom surface 9b is formed. The angle of this notch 9C is equal to the sum of the springback angles of the bent portions 3a and 3b or 4a and 4b of the plate metal terminals 3 and 4 shown in FIG. 3, and is opposite in direction. It is formed.
第５１は上述したとどく本体９の底面両端部にテーバ状
の切欠き部９Ｃ１−Ｖ成したチップ型コンデンサの板状
金属端子３，４の街シ曲はカロエ時の状態を示すもので
あり、ます板状金属端子３，４を本体９の一面９ａにＷ
ｓっで？ｒｂ曲は−を九３ａ。No. 51 shows the curve of the plate metal terminals 3 and 4 of the chip type capacitor, which has tapered notches 9C1-V formed at both ends of the bottom surface of the above-mentioned main body 9, as shown in the state at the time of curvature. The square plate metal terminals 3 and 4 are attached to one side 9a of the main body 9.
S? For rb songs, - is 93a.
４ａにて折り曲げ加工し、枕いて本体９の紙部９ｂの両
端部に形成されているテーパ状の切欠１ｓ９ＣＤ面に沿
って折シ曲は一所３ｂ、４ｂにて折り曲は加工を行なう
。The paper part 9b of the main body 9 is bent at 4a, and along the tapered notch 1s9CD surface formed at both ends of the paper part 9b of the main body 9, the paper part 9b is bent at one place, 3b and 4b.
このようにして折り曲は加工が完了した板状金属端子３
，４は折シ曲けｆｉＦｊＴ３ａ、３ｂおよび４ａ、４ｂ
にスプリングバックか赳ζす、第６図に示すように折り
曲け＠Ｐ９ｒ３ ａ 、 ３ ｂおよび４ａ。In this way, the bending process is completed for the plate metal terminal 3.
, 4 are bent fiFjT3a, 3b and 4a, 4b
When springback is applied, bend @P9r3a, 3b and 4a as shown in Figure 6.
４ｂの内角は第５図に示した折り曲は加工時の内角より
も大きくなる。しかし、第４図に示したように本体９に
は、折り曲は一所３ａと３ｂまたは４ａと４ｂのスプリ
ングバック角度の合計にはは尋しい角度Ａのテーバ状の
切欠き部９Ｃが形成されているので第５−に示したよう
に折り曲げ箇所３ｂ、４ｂは従来構造の板状金属端子よ
シも第４図に示す角度Ａだけ多く曲けられている。その
ために第６図に示したように竹り曲は加工後には、板状
金属端子３，４の実装置ＩＤ３ ’ ｔ ４ ’が、本
体９の底面９ｂとはは平行状態になり、かつ本体９の底
面９ｂの姑長面には＃ｌ接するように形成されるＯ
次に本発明の第２の実施例を第７図および第８図を用い
て説明する。The interior angle of 4b is larger than the interior angle during processing when the bending shown in FIG. 5 is performed. However, as shown in FIG. 4, the bending forms a tapered notch 9C at an angle A that is too large for the sum of the springback angles of 3a and 3b or 4a and 4b. Therefore, as shown in Fig. 5-, the bent portions 3b and 4b are bent more by an angle A shown in Fig. 4 than the plate-shaped metal terminal of the conventional structure. Therefore, as shown in FIG. 6, after the bamboo bending is processed, the actual device ID 3't4' of the plate metal terminals 3 and 4 is parallel to the bottom surface 9b of the main body 9, and A second embodiment of the present invention will be described with reference to FIGS. 7 and 8.
第７図は本発明の第２の実に例Ｖこよるチップ型コンデ
ンサの板状金属端子の折シ曲は加工ｉ１」の状態を示す
図でおハ第１の実施例第４図とＩＷ１様に成灘した本体
９の両側面９ａの下端部に角度Ｂのテーバ状の切欠き部
９畠が形成されている。このテーパ状の切多欠き部９ｄ
の角丸Ｂは第８−に示す板状金属端子３．４の折シ曲は
箇所３ｍ、４ａのスプリングバック角度とｔｘｔｔ勢し
い角ｋに形成されている・
とのように本体９を成型したチップ型コンデンサの板状
金属端子３．４を第１の実施例と同様に順次折〕曲は加
工した後の状態を第８図に示す。Figure 7 is a diagram showing the bending process of the plate metal terminal of a chip-type capacitor according to the second example V of the present invention. A tapered notch 9 having an angle B is formed at the lower end of both side surfaces 9a of the main body 9. This tapered notch 9d
The rounded corner B of the plate metal terminal 3.4 shown in No. 8- is formed at a point 3m, a springback angle of 4a, and a strong corner K of txtt. FIG. 8 shows the state after the plate-shaped metal terminals 3.4 of the chip-type capacitor were sequentially bent in the same manner as in the first embodiment.
折〕曲げ加工が完了した板状金１ｊＩ４端子３，４紘、
折シ曲げ箇所３ａ 、４ａにスプリングバックが起り、
板状金属端子３，４の側面３ｄ 、４ｄは、本体９の側
面９ｍとはｔ象平行になシ、かつ本体９の＠面ＱａＯ地
長期にはは接するように形成される。[Bending] Sheet metal 1j I4 terminals 3 and 4 after bending process was completed,
Springback occurs at the bending points 3a and 4a,
The side surfaces 3d and 4d of the plate-shaped metal terminals 3 and 4 are formed to be parallel to the side surface 9m of the main body 9 in a t-quadrant, and to be in contact with the @ plane QaO ground plane of the main body 9.
なお本発明の第１．第２の実施例に使用した板状金属端
子３．４は形状１寸法および材質共に同一のものである
。Note that the first aspect of the present invention. The plate metal terminal 3.4 used in the second embodiment has the same shape, dimensions, and material.
以上のように、本発明はコンデンサの側面から突出した
板状金属端子を、コンデンサ本体の底面もしくは底面と
餉薗には＃よ平行状態を保持させて折少曲けることがで
きるので
（１）コンテンサＯ鵬さ寸法、長手方向の寸法が小さく
なシ印刷配線板−＼の実装時の体積効率。As described above, in the present invention, the plate-shaped metal terminal protruding from the side surface of the capacitor can be bent slightly while maintaining the parallel state between the bottom surface of the capacitor body or the bottom surface and the bottom surface (1). Volumetric efficiency when mounting printed wiring boards with small condenser dimensions and longitudinal dimensions.
面積効率が良くなる。Area efficiency improves.
（齢） コンデンサの基板へ実装する除の座りが良く
なる。(Age) The mounting of the capacitor on the board becomes better.
（ＩＩ） 基板実装時にコンデンサを仮餉めするため
の接着剤の血布犀を博くすることができる。(II) It is possible to reduce the amount of adhesive used to temporarily bond the capacitor when mounting the capacitor on the board.
などの効果があり、その工業的価値は多大である。It has the following effects, and its industrial value is enormous.
８１図は従来のチップ型；ンデンサの縦断面図、第２−
および第３図は従来のチップ型コンデンサの板状金属端
子の折り曲は加工時および折９曲げカロエ債の正面図。
第４図は本発明の第１の実施例によるチップ型コンデン
サの板状金属端子折り曲は削の正面図。
第５図、および第６−は本発明の第１の実施例によるチ
ップ型コンデンサの板状金属端子の折り曲げ加工時およ
び折り白は加工仮の正面図。
第７図は本発明の第２実施例によるチップ型コンデンサ
の板状金属端子折９曲は削の正面図。
第８図拡本発明の第２実施例によるチップ型コンデンサ
の板状金属端子折り曲は仮の正面図。
１・・・・・・；ンデンサ素子、２・・・・・・陽極リ
ード、３．４・・・・・・第１．第２の板状金Ｍに子、
３ａ、３ｂ＋４８１４ｂ・・・・・・第１．第２の板状
金属端子の折り曲げ箇所、３Ｃ，４Ｃ・・・・・・第１
．第２の板状金属端子の実装面、３ｄ、４ｄ・・・・・
・第１．第２の板状金属端子の側面、５・・・・・・ｈ
電体酸化皮膜〜、６・・・・・・半導体層、７・・・・
・・陰極電極引き出し鳥、８・・・・・・外装樹脂材、
９・・・・・・（チップ型コンデンサ）本体、トド・・
・・本体の１Ｉ１１面、９ｂ・・・・・・本体の＆ｍ５
９Ｃ・・・・・・（本体底面部の）テーバ状切欠き部、
９ｄ・・・・・・（本体骨部の）テーパ状の切欠き部、
Ａ・・・・・・（本体底部の）切欠き部の角度、Ｂ・・
・・・・（本体側部の）切欠き部の角度。
第１図Figure 81 is a conventional chip type capacitor;
FIG. 3 is a front view of a conventional chip-type capacitor's plate-shaped metal terminal when it is bent during processing and a folded 9-fold Caloe bond. FIG. 4 is a front view of a bent and cut plate metal terminal of a chip type capacitor according to the first embodiment of the present invention. 5 and 6- are front views of the plate-shaped metal terminal of the chip-type capacitor according to the first embodiment of the present invention during the bending process, and the folded white area is a tentative view of the process. FIG. 7 is a front view of a plate-shaped metal terminal of a chip-type capacitor according to a second embodiment of the present invention. FIG. 8 is an enlarged tentative front view of a folded plate metal terminal of a chip type capacitor according to a second embodiment of the present invention. 1...; Capacitor element, 2... Anode lead, 3.4... 1st. On the second sheet metal M,
3a, 3b+4814b...1st. Bending points of the second plate metal terminal, 3C, 4C... 1st
．． Mounting surface of second plate metal terminal, 3d, 4d...
・First. Side surface of second plate-shaped metal terminal, 5...h
Electrical oxide film ~, 6... Semiconductor layer, 7...
... Cathode electrode pull-out bird, 8 ... ... Exterior resin material,
9... (chip type capacitor) main body, Todo...
...1I11 side of the main body, 9b...&m5 of the main body
9C... Tapered notch (on the bottom of the main body),
9d...Tapered notch (of main body bone),
A... Angle of the notch (on the bottom of the main body), B...
...The angle of the notch (on the side of the main body). Figure 1
Claims (1)
かつ本体外面に沿って複数の箇所を折シ曲は加工して形
成された板状金属端子を冶するチップ型コンデンサにお
いて、前記板状金属端子が沿った本俸外向の少くとも一
面にテーノく状の切シ欠き部を形成したことを％黴とす
るチップ型コンデンサ。Derived from the fat-clad capacitor body and the sales body,
In a chip-type capacitor that has a plate-shaped metal terminal formed by bending and bending a plurality of points along the outer surface of the main body, at least one surface of the plate-shaped metal terminal facing outward along the main body has a tenon shape. A chip-type capacitor that is characterized by the formation of a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20878681A JPS58110027A (en) | 1981-12-23 | 1981-12-23 | Chip type condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20878681A JPS58110027A (en) | 1981-12-23 | 1981-12-23 | Chip type condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58110027A true JPS58110027A (en) | 1983-06-30 |
| JPS6226167B2 JPS6226167B2 (en) | 1987-06-08 |
Family
ID=16562078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20878681A Granted JPS58110027A (en) | 1981-12-23 | 1981-12-23 | Chip type condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58110027A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4488204A (en) * | 1983-11-01 | 1984-12-11 | Union Carbide Corporation | Device for use in making encapsulated chip capacitor assemblies |
| JPS6171618A (en) * | 1984-09-14 | 1986-04-12 | 日立エーアイシー株式会社 | Apparatus for producing chip type condenser |
| JPH0192120U (en) * | 1987-12-09 | 1989-06-16 | ||
| JPH034505A (en) * | 1989-06-01 | 1991-01-10 | Matsushita Electric Ind Co Ltd | High frequency transformer |
| JP2002313669A (en) * | 2001-04-16 | 2002-10-25 | Matsushita Electric Ind Co Ltd | Electronic component |
-
1981
- 1981-12-23 JP JP20878681A patent/JPS58110027A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4488204A (en) * | 1983-11-01 | 1984-12-11 | Union Carbide Corporation | Device for use in making encapsulated chip capacitor assemblies |
| JPS6171618A (en) * | 1984-09-14 | 1986-04-12 | 日立エーアイシー株式会社 | Apparatus for producing chip type condenser |
| JPH0192120U (en) * | 1987-12-09 | 1989-06-16 | ||
| JPH034505A (en) * | 1989-06-01 | 1991-01-10 | Matsushita Electric Ind Co Ltd | High frequency transformer |
| JP2002313669A (en) * | 2001-04-16 | 2002-10-25 | Matsushita Electric Ind Co Ltd | Electronic component |
| JP4736225B2 (en) * | 2001-04-16 | 2011-07-27 | パナソニック株式会社 | Capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6226167B2 (en) | 1987-06-08 |
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