JPS58109268A - Restoring device for grindstone - Google Patents

Abstract

PURPOSE:To obtain a highly precise restoration of a processing grindstone capable of precise processing such as wafer-cutting or the like by providing a rotary disk type restoring grindstone on the end of an oscillating bar to be freely rotated and slided by eccentric pins. CONSTITUTION:Rotary disks 4 and 5 with eccentric pins 2 and 3 are attached to a machine frame 15 to be synchronously rotated by a motor 6 via worm 1. An oscillating bar 7 is used in its one end for a revolving crank by the eccentric pin 2, while in the other end, used for an oscillating crank to be freely rotated and slided by the pivotting of the pin 3 for mounting a restoring grindstone 8. When disks 4 and 5 are revolved by the motor 6, the bar 7 is moved in parallel, and the grindstone 8 attached thereto draws a circle. The periphery of the grindstone 8 draws a vertically symmetric pair of circular-arc envelop curves. A grindstone 13 to be restored is set with its top part contacting to this pair of envelop curves for obtaining an expected restoring process.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a shaping device for shaping a grindstone with high precision.

Conventionally, when shaping a diamond or CBN (cubic boron nitride) type whetstone, the whetstone to be shaped was set parallel to the axis of the QC (green carborundum) or WA (white arundum) whetstone, and both whetstones were rotated. A method of processing is adopted. A method using electric discharge machining has also been used, but this machining equipment is complicated and expensive, and it requires skill to handle.

The former method also requires precision processing equipment and is complicated to handle. In particular, if the cross-sectional shape of a grindstone for thin cutting or grooving is asymmetrical, bending stress will be generated in the grindstone during processing, resulting in deterioration of shaping accuracy. As is clear from experience, when this asymmetry becomes significant, the above-mentioned bending stress increases and the finished machined surface of the workpiece becomes wavy. Further, it is difficult to shape a thin-blade cutting grindstone or the like for cutting silicon wafer materials using a conventional shaping device as is.

The purpose of the present invention is to eliminate the various drawbacks of the prior art described above,
To provide a grindstone shaping device that has high shaping precision and a simple structure for a grindstone for cutting silicon wafers.

The gist of this invention is as follows. In other words, a whetstone with hard abrasive grains such as diamond needs to be shaped with a whetstone with softer abrasive grains such as a GC whetstone, but if the axes of both whetstones are parallel, the GC whetstone will wear out unilaterally. Cannot be formatted effectively. Also, even if the GC grindstone is sent in the axial direction, the G
Since the wear of the C grindstone is extremely rapid, the amount of trimming of the corner portion of the diamond grindstone increases, and as explained above, the diamond grindstone cannot be trimmed effectively. Therefore, if the GC grinding wheel shaft is installed perpendicular to the diamond grinding wheel shaft, and the GC grinding wheel is fed straight or curved in the direction of the diamond grinding wheel axis or in a plane including this axis, and the diamond grinding wheel is shaped while rotating, it is possible to The present invention utilizes the phenomenon that only the grinding wheel is shaped intensively and the shaping point moves, so that the entire end face of the grindstone is shaped precisely.

The invention will now be described with reference to the illustrated embodiments.

Referring to FIG. 1, rotating disks 4 and 5 provided with eccentric pins 2 and 3, respectively, are configured to be synchronously rotated by a motor 6 via a worm 1, and are mounted on a machine frame 15.

A swing bar 7 is provided, and one end thereof is connected to an eccentric pin 2.
A rotating crank is formed by rotatably supporting the eccentric pin 3, and an eccentric pin 3 is rotatably and slidably supported by a long notch extending through the swing bar 7 in the longitudinal direction, thereby forming a swing crank. A shaping grindstone 8 is attached to the end and rotated by a motor 10 via a belt 9, and the eccentricity of both eccentric pins 2 and 3 is adjusted by a turning section. Now, when both the rotary disks 4 and 5 are rotated by the motor 6, if the eccentricity of the eccentric pins 2 and 30 is equal, the swing bar 7 moves in parallel, and the shaping grindstone 8 attached to it moves in parallel. Draw a circular locus. When the limit switches 11 and 12 attached to the machine frame 15 as shown in the figure come into contact with each other, the rotating discs 4 and 50
Since the rotation is reversed, the grindstone 8 repeatedly traces an arcuate axis. Therefore, the outer periphery of the shaping grindstone 8, which reciprocates in an arcuate locus while rotating, forms two arcuate envelopes symmetrically -F. Therefore, if the grindstone to be shaped is set so that its tip comes into contact with this double-wrapping wire, the desired shaping process can be performed.

In other words, as shown in FIG.
Set the annular shaped whetstone held by , so that the shaped surface is finished in a vertically symmetrical arc shape. Although the case where the outer periphery of the grindstone 13 to be shaped is shaped is shown in the figure, the same setting may be used when shaping the inner periphery thereof. and,
The shape of this arc can be arbitrarily adjusted by changing the amount of eccentricity of the eccentric pins 2 and 3.

Furthermore, the eccentricity of the eccentric pin 2 is set to 2 of the eccentricity of the eccentric pin 3.
When doubled, the shaping grindstone 8 reciprocates up and down as shown in FIG. 2 (α), and is fed linearly parallel to the rotation axis X. Also,
When the eccentricity of the eccentric pin 2 is made 2 to 1 times and less than 1 times the eccentricity of the eccentric pin 3, Fig. 2 (h) and (
It was confirmed from the test results that the long axis and short axis symmetrically draw an elliptical locus parallel to the rotation axis X as shown in C). It was found that this phenomenon is also supported by theoretical calculation results. That is, by adjusting the amount of eccentricity of the eccentric pin, the longitudinal section of the processing surface of the rotating grindstone 8 to be shaped can be made into a straight line parallel to the rotation axis of the grindstone, or a vertically symmetrical arc or ellipse. .

As can be seen from the above description, according to the present invention, it is possible to achieve high precision shaping of a processing grindstone that enables precision processing such as cutting wafers, thereby reducing material yield by cutting GGG (gallium gadolinium garnet) or silicon. The practical effect is that it can be improved.

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram of the present invention, and FIG. 2 is an explanatory diagram illustrating the locus drawn by the shaping grindstone. 1: Worm 2, 3: Eccentric pin 4.5: Rotating disk 6, 10: Motor 7: Swing bar
8: Shaping whetstone

Claims (1)

[Claims] The rotary disks 4 and 5 are each provided with eccentric pins 2 and 3 and mounted on the machine frame 15 so as to rotate synchronously, and are rotatably supported by the eccentric pins 2 and freely rotated and slidable by the eccentric pin 3. A swing bar 7 is provided so as to be pivotally supported by the swing bar, and a rotating disc-shaped shaping grindstone 8 is attached to the end of the swing bar, and the amount of eccentricity of both eccentric pins can be adjusted. By attaching the cut switches 11 and 12 to the machine frame 15, the shaping processing surface of the annular grindstone 13 rotating around the rotation axis X perpendicular to the rotation axis of the shaping grindstone 80 is installed. A grindstone shaping device characterized in that the grindstone 8 is configured to be fed symmetrically in a straight line, an arc, or an ellipse parallel to the rotation axis X while in contact with the grindstone 8.