JPS58106852A - 電力用半導体装置 - Google Patents

電力用半導体装置

Info

Publication number
JPS58106852A
JPS58106852A JP56205764A JP20576481A JPS58106852A JP S58106852 A JPS58106852 A JP S58106852A JP 56205764 A JP56205764 A JP 56205764A JP 20576481 A JP20576481 A JP 20576481A JP S58106852 A JPS58106852 A JP S58106852A
Authority
JP
Japan
Prior art keywords
pipe
cooling
semiconductor device
water supply
electrically insulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56205764A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137794B2 (enExample
Inventor
Yasuhide Takahashi
高橋　康英
Nobuyoshi Takahashi
信義 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56205764A priority Critical patent/JPS58106852A/ja
Publication of JPS58106852A publication Critical patent/JPS58106852A/ja
Publication of JPS6137794B2 publication Critical patent/JPS6137794B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56205764A 1981-12-18 1981-12-18 電力用半導体装置 Granted JPS58106852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56205764A JPS58106852A (ja) 1981-12-18 1981-12-18 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56205764A JPS58106852A (ja) 1981-12-18 1981-12-18 電力用半導体装置

Publications (2)

Publication Number Publication Date
JPS58106852A true JPS58106852A (ja) 1983-06-25
JPS6137794B2 JPS6137794B2 (enExample) 1986-08-26

Family

ID=16512275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56205764A Granted JPS58106852A (ja) 1981-12-18 1981-12-18 電力用半導体装置

Country Status (1)

Country Link
JP (1) JPS58106852A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870477A (en) * 1986-05-23 1989-09-26 Hitachi, Ltd. Integrated circuit chips cooling module having coolant leakage prevention device
JP2004087688A (ja) * 2002-08-26 2004-03-18 Toshiba Corp 電子機器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870477A (en) * 1986-05-23 1989-09-26 Hitachi, Ltd. Integrated circuit chips cooling module having coolant leakage prevention device
JP2004087688A (ja) * 2002-08-26 2004-03-18 Toshiba Corp 電子機器
US7142425B2 (en) 2002-08-26 2006-11-28 Kabushiki Kaisha Toshiba Liquid cooling system including a liquid absorption and a leak detection device

Also Published As

Publication number Publication date
JPS6137794B2 (enExample) 1986-08-26

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