JPS58101426A - X-ray exposing device - Google Patents

X-ray exposing device

Info

Publication number
JPS58101426A
JPS58101426A JP56199826A JP19982681A JPS58101426A JP S58101426 A JPS58101426 A JP S58101426A JP 56199826 A JP56199826 A JP 56199826A JP 19982681 A JP19982681 A JP 19982681A JP S58101426 A JPS58101426 A JP S58101426A
Authority
JP
Japan
Prior art keywords
pattern
ray
contracted
ray flux
reflected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56199826A
Other languages
Japanese (ja)
Other versions
JPH0359569B2 (en
Inventor
Junji Matsui
松井 純爾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56199826A priority Critical patent/JPS58101426A/en
Publication of JPS58101426A publication Critical patent/JPS58101426A/en
Publication of JPH0359569B2 publication Critical patent/JPH0359569B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To improve the transfer precision remarkably by a method wherein X- ray flux is contracted in one direction of pattern and the other direction perpendicular to the former making use of two monocrometers cut unsymmetrically on the same conditions of surface to reflecting grid face. CONSTITUTION:The X-ray flux permeating the absorbing pattern 31 formed on one face of X-ray mask 21 is contracted in one direction within quadric surface to a reflected X-ray flux 42 by the first monocrometer 51 while said X-ray flux in the other direction within quadric surface is also contracted to another reflected X-ray flux 71 by the second monocrometer 52 provided to make the optical axis reflect while further turning 90 degrees to be transferred to a photoresist 91. At this time, if the monocrometers 51, 52 are provided with the same shape, the dimensions in the directions in which pattern is perpendicularly intersected are contracted in the same ratio. Through these procedures, the transfer precision may be improved remarkably since the size of absorbing pattern on the X-ray mask may be multiplied by several or several scores times.

Description

【発明の詳細な説明】 本発WAはX−露光装置に関するものである。[Detailed description of the invention] The present WA relates to an X-exposure device.

従来、−わゆる軟x1mを転写光源とするxlI露党装
置に於いては、有限の大きさを有するxII焦点源(以
下Xm@と称する)と、これと一定の距離を置いて、平
面が、X線束と喬直になるように配置されたパターン転
写用X*ff、Xり(以下X線マスクと称する)と、該
X線マスクの近傍に腋X纏マスクとは埋平行に配置され
丸線光用しジストm布済みのり=バー(以稜りエハーと
称する)とから成る基本的な配置関係を有し、X@マス
タ上のパターン(以後徴収体パターンと称する)1皺ウ
エハー上のレジストに転写することを行りている・こt
)従来0Xll露光装置に於いて嬬、X纏マスク上の徴
収体パターンがそat\つ菖バーに転写されることから
、必然的に鋏x11 wスタ上の徴収体パターン(一般
に、該パターンはxllIvtlk収する金属から構成
される)そotot転写を賛意する寸法で形成する必要
がある・ 上記の必然性から、例えば、1#m以下の一寸法を有す
る・hわゆる超微細パターンを転写するためKは、歇収
体パターンもtた超微細的な寸法を持つて形成すること
が畳求されるが、このよう表超微細パターン管有する徴
収体1形成する技*Fi充分と#i云えない・ 本尭明O@的は、上記の困難柱管除去し、現状達成でき
る吸収体パターン形成技II(略〜1声111)管もっ
てしても、いわゆる超微細パターンを転写できるX1m
露光装置を提供するととにある。
Conventionally, in an xlI exposure device that uses a so-called soft x1m as a transfer light source, an xII focal source (hereinafter referred to as , a pattern transfer X*ff and X-ray (hereinafter referred to as an X-ray mask) arranged so as to be perpendicular to the X-ray flux, and an armpit X-band mask arranged in parallel with the It has a basic arrangement relationship consisting of a round wire beam resist m, pre-fabricated glue = bar (hereinafter referred to as the edge wafer), and a pattern on the X @ master (hereinafter referred to as the collector pattern) on the 1-wrinkle wafer. This is done by transferring to the resist of
) In the conventional 0x11 exposure device, since the collecting body pattern on the X mask is transferred to the iris bar, the collecting body pattern on the scissors x11w star (generally, the pattern is xllIvtlk (consisting of a metal that fits) It is necessary to form the pattern with dimensions that support the transfer. Due to the above-mentioned necessity, for example, it has a dimension of 1 #m or less. In order to transfer a so-called ultra-fine pattern. K is required to be formed with an ultra-fine dimension including the collecting body pattern, but it cannot be said that the technique for forming the collecting body 1 having such an ultra-fine pattern tube is sufficient.・Motoya Akira O @ target is X1m, which can transfer so-called ultra-fine patterns even if the above-mentioned difficult columnar tube is removed and the absorber pattern formation technique II (abbreviation ~ 1 voice 111) tube is used.
We provide exposure equipment.

本発明によれげ、XJIマスク上KN成する徴収体パタ
ーンのサイズは所望の転写パターンのサイズの数倍〜数
10倍であれば良い為、吸収体パターンを廖威する@に
%翼状達成できる形成技術で充分であり、かつ転写に利
用されるxII束の平行性が、極めて嵐好となる結果、
転写n度がIIjll#に上昇させることが可能となる
〇 以下率1al14について実施例を示す111面を用い
て説明する。
According to the present invention, the size of the absorber pattern formed on the XJI mask can be several times to several tens of times the size of the desired transfer pattern, so it is possible to achieve a wing-like shape in order to enhance the absorber pattern. As a result, the formation technique is sufficient and the parallelism of the xII bundle used for transfer is extremely favorable.
The below 〇 rate 1al14, which makes it possible to increase the transfer n degree to IIjll#, will be explained using page 111 showing an example.

菖1閣及び菖2m鉱本発明の原履會示す漸画図及び、そ
の部分拡大−である〇 両111mにおいて、入射111束1(必ずしも平行性
は良くなくて良い)がX*マスク2に@射されるとき、
皺xIIマスク2の一画上に形成された吸収体パターン
3に対応したコントラストを含んだ透過xm束4は、モ
ノクロメータ5によりて反射する・ 腋モノクロメータ5は、X@が入射する表面に対して反
射面6が、−だけ傾いた構造#C加工してあり、かつ、
透過X線束4とモノクロメータ50表両となす角の方が
、反射!m束7と皺amとなす餉より大きくなるように
配置されている。
Iris 1-kaku and Iris 2-meter mine A progressive diagram showing the original history of the present invention and a partial enlargement of the same. When it is shot,
The transmitted xm flux 4 containing the contrast corresponding to the absorber pattern 3 formed on one stroke of the wrinkle xII mask 2 is reflected by the monochromator 5. On the other hand, the reflective surface 6 is processed with structure #C inclined by -, and
The angle between the transmitted X-ray flux 4 and the monochromator 50 table is reflected! The m bundles 7 and the wrinkles are arranged so that they are larger than the wires.

透過Xm束4が、モノクロメータ50反射画6によりて
ブラッグ反射し、反射X#束7を生じる場合のブラッグ
角管−とすると、透過xII束4とモノタロメータ50
表面となす角#i#+g%反射X纏束7と該表面となす
角はト1とな9、つねに、# + g ) # −gと
なる条件で、皺モノク゛pメータを加工し、配置するこ
とが、肝畳である。
If the transmitted Xm bundle 4 is Bragg-reflected by the monochromator 50 reflection image 6 and the reflected X# bundle 7 is produced, the Bragg angle tube is the transmitted XII bundle 4 and the monochromator 50.
The angle between the surface and the angle #i #+g% reflection It is important to do so.

例えば、e””45°、aさ317°となるようにモノ
クロメータの材質及び、X−の波長を選択すれば、$1
211に示すように、県がWである吸収体パターン3の
コントラストが、反射X線束7に於ける;ントラストに
変換され、その@W’−W15のパターンとしてウェハ
ー8上Km布された7#トレジスト9に転写される。し
たがりて転写パターンが所望のサイズW′を持つえめK
lk、上記の転写条件での1収体パターン011−イズ
はw−sw’で良%Aことになる。例えd、yオドレジ
スト上KW’H1s wrのパターンを転写したい場合
#Cはs 14’ −S jm O吸収体パターンを形
成すれば東く、現状の徴収体パターン影威技lIをもり
てすれば、ζOII直Oナイズ011Ilt、体を加工
することは極めて容易である。
For example, if you select the material of the monochromator and the wavelength of
As shown in 211, the contrast of the absorber pattern 3 whose prefecture is W is converted to contrast in the reflected X-ray flux 7, and the contrast of the absorber pattern 3 whose prefecture is W is converted to the contrast of the absorber pattern 3, which is spread over the wafer 8 as a pattern of @W'-W15 for Km 7#. The photoresist 9 is transferred to the photoresist 9. Therefore, the size K in which the transferred pattern has the desired size W'
lk, the one-collection pattern 011-ize under the above transfer conditions is w-sw' and has a good %A. For example, if you want to transfer a pattern of KW'H1s wr on d, y odd resist, #C is s 14' -S jm If you form an O absorber pattern, you can do it using the current collector pattern shadow technique lI. It is extremely easy to process the body.

上記O第1II及び1M21!JK示した実施例では、
紙面に平行表寸法を一歩して転写することを示したが、
紙面Kmr11に方向については寸法O口止は行われな
い。11113図に、この方向の寸法も縮ホ、即ち・X
IIマスク上の徴収体パターン管二次元釣に11本して
フォトレジストに転写するX線露光装置の基本的な構成
を示す斜IIl閣である。X纏マスクnの一画上に形成
され九a収体パターン31を透過した透過X−束は、第
一のモノクーメータ51で、二次元面内の一方向だけ縮
少されて反射Xall信と′&り、そ0’It@が、さ
ら#ceo0u転t、tmtらに射するように設置され
九第二のモノクロメータ52によりて、二次元画内の他
〇一方向tIil−されて反射x1s束71となりた上
で、クエへ−81の上に塗布され九7#トレジスト91
の上に転写される。
Said O No. 1 II and 1M21! JK In the example shown,
Although we have shown that parallel dimensions can be transferred onto paper in one step,
Regarding the direction on the paper surface Kmr11, the dimension O is not closed. In Figure 11113, the dimension in this direction is also reduced, that is, ・X
This figure shows the basic structure of an X-ray exposure device that transfers 11 two-dimensional patterns on a photoresist onto a photoresist. The transmitted X-flux formed on one stroke of the X-banded mask n and transmitted through the nine-a collecting pattern 31 is reduced by the first monocoumeter 51 in only one direction within the two-dimensional plane, and is converted into a reflected Xall signal. &ri, so0'It@ is set so as to be reflected on #ceo0u, tmt, etc., and is reflected by the second monochromator 52 in one direction other than in the two-dimensional image x1s After forming a bundle 71, apply it on top of Quehe-81 and apply 97# Tresist 91.
transferred onto the .

菖−のモノクロメータ51と第二の毫ノクロメータ纏と
が同一形状のtのであれば、二次元的1に徴収体パター
ンの直交する二方向の寸法は、同じ割合で縮小されるこ
とKlkる0例えば、先に記した条件で、嬉−及び第二
のモノクロメータを構成設置すれば〜54 m X %
 p m O吸収体パターンは、フォトレジスト上では
1声醜X1j+論と&)、lsmXlam()パターン
転写を行うため#Cは、SμmXrss脂の徴収体パタ
ーンを、**すれば農いことに15、xlI露光露光用
タスク作が極めて容易になる。
If the iris monochromator 51 and the second iris monochromator have the same shape, the dimensions in two orthogonal directions of the two-dimensional collection pattern will be reduced at the same rate. For example, if the first and second monochromators are configured and installed under the conditions described above, ~54 m x %
The p m O absorber pattern is 1 voice ugly X1j+ theory and &) on the photoresist, and lsm , xlI exposure The task for exposure becomes extremely easy.

このようK、本発明のX線露光装置は表面が、反射格子
′rIiK対して同一条件で非対称にカッドされた二個
のモノクロメータを用い、第一〇モノクーメータKjり
てパターンの一方向をS+し、さもKIIg二のモノク
ロメータによりて、前記方向に直交する他の方向管縮会
する結果、吸収体の持つ二次元パターンを全体的に@ホ
することがで自る利点管提供するか、その他に、xIs
iスク上casts体パターンの加工精度も壕九縮歩さ
れるという第二〇利点をもつ。即ち、例えば±0.25
m0加工11II度をもりえ平均5声m E) A /
−ンは、811図及びIg!4!ll0II!―に用い
良書では、1μm±004swat)パターンと1にう
て転写される。現状oxlIIjI光技術では、±0.
04βrnO加工精度をもった加工体パターンを形成す
ることは不可能に近い〇さもに、第三の利点として、フ
ォトレジスト#clK射されるところの、モノクロメー
タから0反射X纏東7又は71は、本質的和平行性が高
いため、転写パターンのボクが少(なゐ・ 上記の実1例では、ブラッグ反射角がm=4hOで入射
X11束と反射X11束がほぼ直交しているが、これは
必ずし1必l!条件でないこと#i勿論でありて、二次
元的ta収鉢体パターン一方向がJI治される間係を満
足するならば、ブラッグ反射角−1及び格子画ohmか
らの頷き一社任意の角度で良いO
In this way, the X-ray exposure apparatus of the present invention uses two monochromators whose surfaces are quadratured asymmetrically with respect to the reflection grating 'rIiK under the same conditions. However, as a result of condensation in other directions perpendicular to the above-mentioned direction using the KIIg2 monochromator, the two-dimensional pattern of the absorber can be completely visualized, providing an advantage. In addition, xIs
The 20th advantage is that the processing accuracy of the cast body pattern on the i-sk is also significantly reduced. That is, for example ±0.25
m0 processing 11II degree Morie average 5 voices m E) A /
-N is 811 diagram and Ig! 4! ll0II! - In a good book, it is transferred with a pattern of 1 μm ± 004 swat). Currently, with OXlIIjI optical technology, ±0.
It is almost impossible to form a workpiece pattern with 04βrnO processing accuracy.In addition, as a third advantage, the 0 reflection from the monochromator where the photoresist #clK is emitted is , since the intrinsic sum-parallelism is high, there are few blurs in the transferred pattern. This is not necessarily a condition #i Of course, if one direction of the two-dimensional TA container body pattern satisfies the relationship between JI cured, then the Bragg reflection angle -1 and the grid pattern ohm A nod from O is fine at any angle.

【図面の簡単な説明】[Brief explanation of the drawing]

第ill、第2図、及び第3閣は本発明O鳳l會駅明す
るための図で、図において、1は入射X鐘束、2及び2
1はX!Iマスク、3及び31 #iml *体パター
ン、4及び/ll/は透過X−束、5.51及ヒ52ハ
モノクロメータ、6tj反射格子函、7及び71は反射
X*束、8及び81Fiウエハー、9及び91tljフ
オトレジスト。 オ 1 囚 才2目 −g オ 3 胆 引
Figure 2, Figure 2, and Figure 3 are diagrams for explaining the present invention.
1 is X! I mask, 3 and 31 #iml *Body pattern, 4 and /ll/ are transmitted X-flux, 5.51 and H52 hamonochromator, 6tj reflection grating box, 7 and 71 are reflected X*flux, 8 and 81Fi Wafer, 9 and 91tlj photoresist. O 1 Prisoner 2nd eye-g O 3 Ibiki

Claims (1)

【特許請求の範囲】[Claims] 表面が、反射格子mに対して非対称にカットされえ、籐
−のモノタロメータによりて、二次元パターンの一方向
がS小され−kWk、Plじ〈非対称にカットされた露
二のモノクロメータによりて、前記方向と直交する方向
が縮小されるように、二個のモノクロメ〜りが、X線マ
スクと転写レジストとの関に設置されたことを特徴とす
るxiiu+i光鋏置O
The surface can be cut asymmetrically with respect to the reflection grating m, and one direction of the two-dimensional pattern is reduced by S -kWk, Pl by a rattan monochromator (by a rattan monochromator cut asymmetrically). , an xiiiu+i optical scissor arrangement O characterized in that two monochromators are installed between the X-ray mask and the transfer resist so that the direction perpendicular to the above direction is reduced.
JP56199826A 1981-12-11 1981-12-11 X-ray exposing device Granted JPS58101426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56199826A JPS58101426A (en) 1981-12-11 1981-12-11 X-ray exposing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56199826A JPS58101426A (en) 1981-12-11 1981-12-11 X-ray exposing device

Publications (2)

Publication Number Publication Date
JPS58101426A true JPS58101426A (en) 1983-06-16
JPH0359569B2 JPH0359569B2 (en) 1991-09-11

Family

ID=16414280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56199826A Granted JPS58101426A (en) 1981-12-11 1981-12-11 X-ray exposing device

Country Status (1)

Country Link
JP (1) JPS58101426A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629632A (en) * 1985-07-06 1987-01-17 Agency Of Ind Science & Technol Projecting and exposing device
JPS62208631A (en) * 1986-03-07 1987-09-12 Sanyo Electric Co Ltd Reduction type x-ray lithography equipment
JPH02153520A (en) * 1988-12-05 1990-06-13 Mitsubishi Electric Corp Exposure device
US5153898A (en) * 1986-07-11 1992-10-06 Canon Kabushiki Kaisha X-ray reduction projection exposure system of reflection type

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629632A (en) * 1985-07-06 1987-01-17 Agency Of Ind Science & Technol Projecting and exposing device
JPS62208631A (en) * 1986-03-07 1987-09-12 Sanyo Electric Co Ltd Reduction type x-ray lithography equipment
US5153898A (en) * 1986-07-11 1992-10-06 Canon Kabushiki Kaisha X-ray reduction projection exposure system of reflection type
EP0947882A2 (en) * 1986-07-11 1999-10-06 Canon Kabushiki Kaisha X-ray reduction projection exposure system of reflection type
EP0947882A3 (en) * 1986-07-11 1999-10-13 Canon Kabushiki Kaisha X-ray reduction projection exposure system of reflection type
JPH02153520A (en) * 1988-12-05 1990-06-13 Mitsubishi Electric Corp Exposure device

Also Published As

Publication number Publication date
JPH0359569B2 (en) 1991-09-11

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