JPS5797427A - Measuring and evaluating device for solderability - Google Patents

Measuring and evaluating device for solderability

Info

Publication number
JPS5797427A
JPS5797427A JP17317880A JP17317880A JPS5797427A JP S5797427 A JPS5797427 A JP S5797427A JP 17317880 A JP17317880 A JP 17317880A JP 17317880 A JP17317880 A JP 17317880A JP S5797427 A JPS5797427 A JP S5797427A
Authority
JP
Japan
Prior art keywords
circuit
detecting
sample
wet
wettability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17317880A
Other languages
Japanese (ja)
Other versions
JPH0128335B2 (en
Inventor
Toshihiro Shima
Yoichiro Maehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP17317880A priority Critical patent/JPS5797427A/en
Publication of JPS5797427A publication Critical patent/JPS5797427A/en
Publication of JPH0128335B2 publication Critical patent/JPH0128335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02—Investigating surface tension of liquids
    • G01N2013/0225—Investigating surface tension of liquids of liquid metals or solder

Abstract

PURPOSE:To discriminate and evaluate the wettability of soldering accurately and precisely by detecting and measuring surface tension by dipping a member to be measured in solder, and by detecting and calculating the wet-area ratio of the sample through an optical microscope and a sensor. CONSTITUTION:A detector 11 detects the fine displacement of a body to be measured due to surface tension through a differential transformer and its output is inputted to an amplifying circuit 17, an ADC18, a comparing circuit 19, a storage circuit 20, and a comparison arithmetic circuit 34 to calculate output information on a wet mode, thereby performing the display 36 of it. An image of the soldered part of a sample 14 is formed on a photosensor 27 through an optical microscope 26. The output of a detecting circuit 29 is inputted to a starting circuit 25 to drive the sample 14 through a pulse oscillator 23, a driving circuit 22 and a pulse motor 21. If the detecting circuit 29 detects a defective, a synchronizing pulse circuit 37 opens a gate circuit 31 and the display 36 of a wet-area ratio is performed through a binary-coding circuit 30, a counting circuit 32 and the arithmetic circuit 34. Thus, wettability is discriminated and evaluated accurately and precisely.
JP17317880A 1980-12-10 1980-12-10 Measuring and evaluating device for solderability Granted JPS5797427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17317880A JPS5797427A (en) 1980-12-10 1980-12-10 Measuring and evaluating device for solderability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17317880A JPS5797427A (en) 1980-12-10 1980-12-10 Measuring and evaluating device for solderability

Publications (2)

Publication Number Publication Date
JPS5797427A true JPS5797427A (en) 1982-06-17
JPH0128335B2 JPH0128335B2 (en) 1989-06-02

Family

ID=15955530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17317880A Granted JPS5797427A (en) 1980-12-10 1980-12-10 Measuring and evaluating device for solderability

Country Status (1)

Country Link
JP (1) JPS5797427A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4467638A (en) * 1983-05-13 1984-08-28 Rca Corporation Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system
US5001923A (en) * 1989-01-13 1991-03-26 Schmitt Thomas Karlheinz G Process to measure the wetting forces between a liquid and a solid body
US5563338A (en) * 1994-06-09 1996-10-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and device for measuring wettability under controlled atmosphere
JP6194462B1 (en) * 2017-02-06 2017-09-13 株式会社プロセス・ラボ・ミクロン Metal mask and solder paste compatibility diagnostic system and compatibility diagnostic method
CN110672812A (en) * 2019-09-17 2020-01-10 贵州航天电子科技有限公司 Method for testing weldability of microwave QFN device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582039A (en) * 1978-11-20 1980-06-20 Toshiba Corp Evaluation method of soldering and its unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582039A (en) * 1978-11-20 1980-06-20 Toshiba Corp Evaluation method of soldering and its unit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4467638A (en) * 1983-05-13 1984-08-28 Rca Corporation Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system
US5001923A (en) * 1989-01-13 1991-03-26 Schmitt Thomas Karlheinz G Process to measure the wetting forces between a liquid and a solid body
US5563338A (en) * 1994-06-09 1996-10-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and device for measuring wettability under controlled atmosphere
JP6194462B1 (en) * 2017-02-06 2017-09-13 株式会社プロセス・ラボ・ミクロン Metal mask and solder paste compatibility diagnostic system and compatibility diagnostic method
CN110672812A (en) * 2019-09-17 2020-01-10 贵州航天电子科技有限公司 Method for testing weldability of microwave QFN device

Also Published As

Publication number Publication date
JPH0128335B2 (en) 1989-06-02

Similar Documents

Publication Publication Date Title
US4444644A (en) PH Electrode
CA2251861A1 (en) Apparatus and method for determining a parameter of a particle in a fluid
JPS6465460A (en) Space filter type speed measuring instrument
US4266874A (en) Apparatus and method for measuring the size of fibers
JPS5797427A (en) Measuring and evaluating device for solderability
KR830009475A (en) Coordinate Measuring Device
JPH0228541A (en) Optical concentration detector
JPS5582039A (en) Evaluation method of soldering and its unit
FR2444270A1 (en) APPARATUS FOR POROSITY MEASUREMENTS
JPS56137143A (en) Measuring device for electrophoresis
DK0476923T3 (en) Measurement of blood coagulation time
JPS60224042A (en) Turbidity measuring device for lubricant
JPS57166505A (en) Method for measuring distortion of material plate for laminated glass
US4077723A (en) Method of measuring thickness
JPS57119205A (en) Measurement of sectional shape of plate-shaped body
JPH04123316U (en) Oil deterioration measuring device
JPS55113338A (en) Wire cut detection in semiconductor wire bonding device
JPS587550A (en) Self-measuring device for clouding point
SE8107026L (en) ELECTRONIC METHOD DEVICE
JPS61165636A (en) Apparatus for measuring sedimentation velocity
JPS5581325A (en) Distance measuring device of camera
JPS56116637A (en) Detector for semiconductor device
JPS5722528A (en) Measuring method for optical fiber transmission band
SU904930A1 (en) Method of checking solderability of metallized holes of printed circuit boards
JPS57106804A (en) Measuring device for thickness of film