JPS579699B2 - - Google Patents

Info

Publication number
JPS579699B2
JPS579699B2 JP15754276A JP15754276A JPS579699B2 JP S579699 B2 JPS579699 B2 JP S579699B2 JP 15754276 A JP15754276 A JP 15754276A JP 15754276 A JP15754276 A JP 15754276A JP S579699 B2 JPS579699 B2 JP S579699B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15754276A
Other languages
Japanese (ja)
Other versions
JPS5382265A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15754276A priority Critical patent/JPS5382265A/ja
Publication of JPS5382265A publication Critical patent/JPS5382265A/ja
Publication of JPS579699B2 publication Critical patent/JPS579699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP15754276A 1976-12-28 1976-12-28 Tension control method Granted JPS5382265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15754276A JPS5382265A (en) 1976-12-28 1976-12-28 Tension control method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15754276A JPS5382265A (en) 1976-12-28 1976-12-28 Tension control method

Publications (2)

Publication Number Publication Date
JPS5382265A JPS5382265A (en) 1978-07-20
JPS579699B2 true JPS579699B2 (OSRAM) 1982-02-23

Family

ID=15651946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15754276A Granted JPS5382265A (en) 1976-12-28 1976-12-28 Tension control method

Country Status (1)

Country Link
JP (1) JPS5382265A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6463494A (en) * 1987-07-11 1989-03-09 Schuetz Werke Gmbh Co Kg Forked boom fixture for surf-board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668387A (en) * 1985-09-23 1987-05-26 Envirex Inc. Deep submergence rotating biological contactor apparatus
JPH088271B2 (ja) * 1988-11-01 1996-01-29 株式会社新川 ワイヤボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6463494A (en) * 1987-07-11 1989-03-09 Schuetz Werke Gmbh Co Kg Forked boom fixture for surf-board

Also Published As

Publication number Publication date
JPS5382265A (en) 1978-07-20

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