JPS5382265A - Tension control method - Google Patents

Tension control method

Info

Publication number
JPS5382265A
JPS5382265A JP15754276A JP15754276A JPS5382265A JP S5382265 A JPS5382265 A JP S5382265A JP 15754276 A JP15754276 A JP 15754276A JP 15754276 A JP15754276 A JP 15754276A JP S5382265 A JPS5382265 A JP S5382265A
Authority
JP
Japan
Prior art keywords
control method
tension control
wire
motor
rigitl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15754276A
Other languages
Japanese (ja)
Other versions
JPS579699B2 (en
Inventor
Koji Iizuka
Isao Tanaka
Tatsuo Saito
Masayasu Nagashima
Kazuo Asano
Akio Tazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15754276A priority Critical patent/JPS5382265A/en
Publication of JPS5382265A publication Critical patent/JPS5382265A/en
Publication of JPS579699B2 publication Critical patent/JPS579699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To unify the wiring condition of a wire by mounting a lightweight and rigitl lever havinga wire hooking part to the shaft of a motor of extremely small moment of inertia and detecting its postiion with a sensor thereby controlling the revolving torque of the control motor.
COPYRIGHT: (C)1978,JPO&Japio
JP15754276A 1976-12-28 1976-12-28 Tension control method Granted JPS5382265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15754276A JPS5382265A (en) 1976-12-28 1976-12-28 Tension control method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15754276A JPS5382265A (en) 1976-12-28 1976-12-28 Tension control method

Publications (2)

Publication Number Publication Date
JPS5382265A true JPS5382265A (en) 1978-07-20
JPS579699B2 JPS579699B2 (en) 1982-02-23

Family

ID=15651946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15754276A Granted JPS5382265A (en) 1976-12-28 1976-12-28 Tension control method

Country Status (1)

Country Link
JP (1) JPS5382265A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668387A (en) * 1985-09-23 1987-05-26 Envirex Inc. Deep submergence rotating biological contactor apparatus
JPH02122637A (en) * 1988-11-01 1990-05-10 Shinkawa Ltd Wire bonding apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8709564U1 (en) * 1987-07-11 1987-09-17 Schütz-Werke GmbH & Co KG, 5418 Selters Boom attachment for surfboards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668387A (en) * 1985-09-23 1987-05-26 Envirex Inc. Deep submergence rotating biological contactor apparatus
JPH02122637A (en) * 1988-11-01 1990-05-10 Shinkawa Ltd Wire bonding apparatus
JPH088271B2 (en) * 1988-11-01 1996-01-29 株式会社新川 Wire bonding equipment

Also Published As

Publication number Publication date
JPS579699B2 (en) 1982-02-23

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