JPS5796565A - Solid state pickup device - Google Patents

Solid state pickup device

Info

Publication number
JPS5796565A
JPS5796565A JP55174421A JP17442180A JPS5796565A JP S5796565 A JPS5796565 A JP S5796565A JP 55174421 A JP55174421 A JP 55174421A JP 17442180 A JP17442180 A JP 17442180A JP S5796565 A JPS5796565 A JP S5796565A
Authority
JP
Japan
Prior art keywords
charge transfer
pickup device
row
substrate
transfer unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55174421A
Other languages
Japanese (ja)
Inventor
Kunihiro Tanigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55174421A priority Critical patent/JPS5796565A/en
Publication of JPS5796565A publication Critical patent/JPS5796565A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14875—Infrared CCD or CID imagers
    • H01L27/14881—Infrared CCD or CID imagers of the hybrid type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14831—Area CCD imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Abstract

PURPOSE:To improve the performance of the pickup device by a method wherein a charge transfer unit having both photoelectric conversion to infrared light and a TDI function is formed to the first semiconductor substrate, and a charge transfer element for reading, which has the high efficiency of transfer and can transfer at high speed, is shaped to the second substrate and unified. CONSTITUTION:A charge transfer unit group 5 is composed in such a manner that the charge transfer units 1, 2-m which transfer charges in the row P direction while using the optical image moving direction of a pickup object as the row direction are mounted in parallel in the line direction on the first semiconductor substrate A. The electrodes 6, 8, 10, 12 of the charge transfer units are light transmitting electrodes, and light receiving sections 1a-1d, 2a-2d, ma-md arranged in line and row shapes are formed. Time delay integral signals outputted from such a charge transfer unit group are inputted to the charge transfer element 15 for reading disposed to the second substrate B through bonding wires 16, and outputted from an output terminal 17 as picture signals. Accordingly, the performance of the pickup device is improved.
JP55174421A 1980-12-08 1980-12-08 Solid state pickup device Pending JPS5796565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55174421A JPS5796565A (en) 1980-12-08 1980-12-08 Solid state pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55174421A JPS5796565A (en) 1980-12-08 1980-12-08 Solid state pickup device

Publications (1)

Publication Number Publication Date
JPS5796565A true JPS5796565A (en) 1982-06-15

Family

ID=15978250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55174421A Pending JPS5796565A (en) 1980-12-08 1980-12-08 Solid state pickup device

Country Status (1)

Country Link
JP (1) JPS5796565A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2947684A4 (en) * 2013-01-18 2016-10-05 Hamamatsu Photonics Kk Electronic component device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2947684A4 (en) * 2013-01-18 2016-10-05 Hamamatsu Photonics Kk Electronic component device
US9502456B2 (en) 2013-01-18 2016-11-22 Hamamatsu Photonics K.K. Electronic component device

Similar Documents

Publication Publication Date Title
US4330796A (en) Block readable charge coupled device
JPS5474700A (en) Collection and delivery system for traffic information by photo electric conversion element group
JPS54158818A (en) Color solid-state pickup unit
DE69320428T2 (en) Solid state imaging device
KR940020786A (en) SOLID STATE IMAGING DEVICE AND THE METHOD FOR DRIVING THEREOF
JPS57173966A (en) Solid state image pickup device
JPS56160081A (en) Solid state image pickup apparatus
EP0132075A3 (en) Solid-state image pickup apparatus
JPS5796565A (en) Solid state pickup device
KR970068514A (en) Solid-state imaging device, its driving method and camera using solid-state imaging device
US4860326A (en) Solid-state image pickup device
JPS57141178A (en) Solid-state image pickup device
JPS607767A (en) Semiconductor device
JPS57166767A (en) Manuscript reader
JPS57173273A (en) Solid-state image pickup device
CA2173390A1 (en) Multiple output ccd type charge transfer read register
JP3018712B2 (en) Solid-state imaging device having a plurality of charge transfer paths and driving method thereof
JPS5531333A (en) Solid state pickup device
JPS57173969A (en) Solid state image pickup device
JPS57180276A (en) Solid-state image pickup device
JPS5632880A (en) Picture recorder
JPS5745971A (en) Image pickup device for solid state
JPS56141668A (en) Read device
JPS56160176A (en) Solid state pickup device
JPS58103267A (en) Reading system