JPS5795684A - Thermoelectric element and manufacturing method - Google Patents

Thermoelectric element and manufacturing method

Info

Publication number
JPS5795684A
JPS5795684A JP55172470A JP17247080A JPS5795684A JP S5795684 A JPS5795684 A JP S5795684A JP 55172470 A JP55172470 A JP 55172470A JP 17247080 A JP17247080 A JP 17247080A JP S5795684 A JPS5795684 A JP S5795684A
Authority
JP
Japan
Prior art keywords
soldering
contact resistance
copper plates
solder layer
thermoelectric element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55172470A
Other languages
Japanese (ja)
Inventor
Takashi Nakajima
Makoto Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP55172470A priority Critical patent/JPS5795684A/en
Publication of JPS5795684A publication Critical patent/JPS5795684A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PURPOSE:To facilitate low contact resistance and maintain heat resistivity by evaporating a metal thin film for electrode lead by a certain electric welding method making a solder layer at an electrode opening of a thermoelectric element using supersonic soldering. CONSTITUTION:A junction 3 and a gap 4 are formed by integrating P type and N type elements 2A, 2B of iron silicide sinter. A soler layer 6 is made at the ends 5A, 5B of low temperature side with a soldering iron that vibrates by supersonic waves. Then a thin copper plates 7A, 7B are electrically welded to 5A and 5B by the parallel gap method. A current applied between the electrodes 10a, 10b heats up the copper plates and soldering is performed. Inerposition of the solder layer maintains low contact resistance, a high heat resistance and a high mechanical strength.
JP55172470A 1980-12-06 1980-12-06 Thermoelectric element and manufacturing method Pending JPS5795684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55172470A JPS5795684A (en) 1980-12-06 1980-12-06 Thermoelectric element and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55172470A JPS5795684A (en) 1980-12-06 1980-12-06 Thermoelectric element and manufacturing method

Publications (1)

Publication Number Publication Date
JPS5795684A true JPS5795684A (en) 1982-06-14

Family

ID=15942578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55172470A Pending JPS5795684A (en) 1980-12-06 1980-12-06 Thermoelectric element and manufacturing method

Country Status (1)

Country Link
JP (1) JPS5795684A (en)

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