JPS5788743A - Positioning device for vertical-type lead frame - Google Patents

Positioning device for vertical-type lead frame

Info

Publication number
JPS5788743A
JPS5788743A JP16499780A JP16499780A JPS5788743A JP S5788743 A JPS5788743 A JP S5788743A JP 16499780 A JP16499780 A JP 16499780A JP 16499780 A JP16499780 A JP 16499780A JP S5788743 A JPS5788743 A JP S5788743A
Authority
JP
Japan
Prior art keywords
frame
vertical
lever
lead
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16499780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS627697B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Ushiki
Yoshimitsu Kushima
Hisaaki Kojima
Masao Yamazaki
Masashi Nishizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Sharp Corp
Original Assignee
Shinkawa Ltd
Sharp Corp
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Sharp Corp, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP16499780A priority Critical patent/JPS5788743A/ja
Publication of JPS5788743A publication Critical patent/JPS5788743A/ja
Publication of JPS627697B2 publication Critical patent/JPS627697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP16499780A 1980-11-21 1980-11-21 Positioning device for vertical-type lead frame Granted JPS5788743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16499780A JPS5788743A (en) 1980-11-21 1980-11-21 Positioning device for vertical-type lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16499780A JPS5788743A (en) 1980-11-21 1980-11-21 Positioning device for vertical-type lead frame

Publications (2)

Publication Number Publication Date
JPS5788743A true JPS5788743A (en) 1982-06-02
JPS627697B2 JPS627697B2 (enrdf_load_stackoverflow) 1987-02-18

Family

ID=15803875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16499780A Granted JPS5788743A (en) 1980-11-21 1980-11-21 Positioning device for vertical-type lead frame

Country Status (1)

Country Link
JP (1) JPS5788743A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002068362A (ja) * 2000-08-25 2002-03-08 Right Manufacturing Co Ltd 搬送容器の蓋着脱装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526696A (en) * 1979-07-30 1980-02-26 Hitachi Ltd Bonding method
JPS5596647A (en) * 1979-01-18 1980-07-23 Toshiba Corp Apparatus for positioning lead frame
JPS55102250A (en) * 1979-01-30 1980-08-05 Matsushita Electronics Corp Method of aligning position of lead frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596647A (en) * 1979-01-18 1980-07-23 Toshiba Corp Apparatus for positioning lead frame
JPS55102250A (en) * 1979-01-30 1980-08-05 Matsushita Electronics Corp Method of aligning position of lead frame
JPS5526696A (en) * 1979-07-30 1980-02-26 Hitachi Ltd Bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002068362A (ja) * 2000-08-25 2002-03-08 Right Manufacturing Co Ltd 搬送容器の蓋着脱装置

Also Published As

Publication number Publication date
JPS627697B2 (enrdf_load_stackoverflow) 1987-02-18

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