JPS577609A - Sealing method for quartz oscillator - Google Patents
Sealing method for quartz oscillatorInfo
- Publication number
- JPS577609A JPS577609A JP8158680A JP8158680A JPS577609A JP S577609 A JPS577609 A JP S577609A JP 8158680 A JP8158680 A JP 8158680A JP 8158680 A JP8158680 A JP 8158680A JP S577609 A JPS577609 A JP S577609A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- adhesive
- base
- case
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE:To obtain an inexpensive quartz oscillator less in secular change by applying an adhesive, cured at the normal temperatures, to fitted-in part where a base made of synthetic resin supporting a quartz oscillating far is fitted in a case made of synthetic resin, and by sealing the part with an adhesive cured by heat. CONSTITUTION:In a case 6 made of synthetic resin, a base 5' is pressed with a quartz oscillating far 1 inside. The base 5' enters the case 6 and is held temporarily. In this state, the 1st adhesive cured at the normal temperatures is applied to form the 1st layer 7, which is curved at the normal temperatures. In the formation of the layer 7, the adhesive may be applied only at the circmference of the fitted-in part B between the base 5' and case 6 instead of applying it over the entire surface of the bottom. Then, the 2nd adhesive capable of curing by heat is applied to form the 2nd layer 8, which is cured thermally. Thus, the adhesives superior in shock resistance for the layer 7 and in airtightness for the layer 8 are used in combination to perform sealing which is less in secular change and extremely stable at low cost.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8158680A JPS577609A (en) | 1980-06-17 | 1980-06-17 | Sealing method for quartz oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8158680A JPS577609A (en) | 1980-06-17 | 1980-06-17 | Sealing method for quartz oscillator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS577609A true JPS577609A (en) | 1982-01-14 |
Family
ID=13750417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8158680A Pending JPS577609A (en) | 1980-06-17 | 1980-06-17 | Sealing method for quartz oscillator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS577609A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61151429U (en) * | 1985-03-12 | 1986-09-19 |
-
1980
- 1980-06-17 JP JP8158680A patent/JPS577609A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61151429U (en) * | 1985-03-12 | 1986-09-19 |
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