JPS5773173A - Electroless plated body - Google Patents

Electroless plated body

Info

Publication number
JPS5773173A
JPS5773173A JP55148486A JP14848680A JPS5773173A JP S5773173 A JPS5773173 A JP S5773173A JP 55148486 A JP55148486 A JP 55148486A JP 14848680 A JP14848680 A JP 14848680A JP S5773173 A JPS5773173 A JP S5773173A
Authority
JP
Japan
Prior art keywords
substrate
layer
plating
2mum
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55148486A
Other languages
Japanese (ja)
Other versions
JPS6021225B2 (en
Inventor
Yoshihiro Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP55148486A priority Critical patent/JPS6021225B2/en
Publication of JPS5773173A publication Critical patent/JPS5773173A/en
Publication of JPS6021225B2 publication Critical patent/JPS6021225B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Liquid Crystal (AREA)
  • General Chemical & Material Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Camera Data Copying Or Recording (AREA)
  • Surface Treatment Of Glass (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To obtain a uniform plated film with excellent adhesive properties by forming a semiconductor layer on a substrate of an insulator and plating the layer with the desired metal in a specified thickness or below. CONSTITUTION:A layer of a semiconductor such as In2O3, SnO2 or TiO2 is formed on a substrate of an insulator such as glass, plastics, ceramics or a crystal body by CVD, sputtering, vapor deposition, dipping or other method. The substrate is then subjected to pretreatment for electroless plating by an ordinary method, and it is immersed in an electorless Ni bath to form an Ni plated film having <=2mum thicknes on the substrate. When the plating thickness exceeds 2mum, the adhesion is deteriorated.
JP55148486A 1980-10-23 1980-10-23 Electroless plating body Expired JPS6021225B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55148486A JPS6021225B2 (en) 1980-10-23 1980-10-23 Electroless plating body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55148486A JPS6021225B2 (en) 1980-10-23 1980-10-23 Electroless plating body

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP1064606A Division JPH0263014A (en) 1989-03-16 1989-03-16 Light transmitting liquid crystal display
JP6460589A Division JPH0257336A (en) 1989-03-16 1989-03-16 Electroless plating for plastic

Publications (2)

Publication Number Publication Date
JPS5773173A true JPS5773173A (en) 1982-05-07
JPS6021225B2 JPS6021225B2 (en) 1985-05-25

Family

ID=15453826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55148486A Expired JPS6021225B2 (en) 1980-10-23 1980-10-23 Electroless plating body

Country Status (1)

Country Link
JP (1) JPS6021225B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59116721A (en) * 1982-12-24 1984-07-05 Hitachi Ltd Liquid-crystal display device
US5270229A (en) * 1989-03-07 1993-12-14 Matsushita Electric Industrial Co., Ltd. Thin film semiconductor device and process for producing thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050946A (en) * 1973-09-03 1975-05-07
JPS51131296A (en) * 1975-05-12 1976-11-15 Hitachi Ltd Liquid crystal matrix panel
JPS535690A (en) * 1976-07-01 1978-01-19 United States Surgical Corp Disposable liquid sample card and measuring instrument using same
JPS5752021A (en) * 1980-09-12 1982-03-27 Citizen Watch Co Ltd Manufacture of liquid crystal display cell

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050946A (en) * 1973-09-03 1975-05-07
JPS51131296A (en) * 1975-05-12 1976-11-15 Hitachi Ltd Liquid crystal matrix panel
JPS535690A (en) * 1976-07-01 1978-01-19 United States Surgical Corp Disposable liquid sample card and measuring instrument using same
JPS5752021A (en) * 1980-09-12 1982-03-27 Citizen Watch Co Ltd Manufacture of liquid crystal display cell

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59116721A (en) * 1982-12-24 1984-07-05 Hitachi Ltd Liquid-crystal display device
US5270229A (en) * 1989-03-07 1993-12-14 Matsushita Electric Industrial Co., Ltd. Thin film semiconductor device and process for producing thereof

Also Published As

Publication number Publication date
JPS6021225B2 (en) 1985-05-25

Similar Documents

Publication Publication Date Title
US3212918A (en) Electroless plating process
JPS5625960A (en) Surface-coated high speed steel material for cutting tool
GB914865A (en) Method of making magnetic data storage devices
KR860008300A (en) SiO_2-X coated article and coating method by chemical vapor deposition by plasma
US3378400A (en) Autocatalytic deposition of nickel, cobalt and alloys thereof
JPS5773173A (en) Electroless plated body
GB1115911A (en) Method for depositing thin metal coatings
US3807971A (en) Deposition of non-porous and durable tin-gold surface layers in microinch thicknesses
JPS58213871A (en) Method for coating iron substrate with zinc coating with superior adhesive strength
ES8206663A1 (en) Cu-Ni coatings on ferrous substrates
EP0185967A3 (en) Process for avoiding blister formation in electroless metallization of ceramic substrates
JPS5560043A (en) Sealing parts
GB1124684A (en) Nickel alloy article with improved properties and method of making same
JPS5520250A (en) Device or member made of platinum for high temperature use
JPS57120663A (en) Electroless plating method
IE832294L (en) Electroplated steel exhibiting low hydrogen embrittlement.
Schultz et al. Electroless nickel plating of aluminum
JPS5266374A (en) Galvanization of non electrolytic nickel for semiconductor substrate
GB1122256A (en) Improvements in and relating to electroless deposition
ATE371266T1 (en) IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH
JPS6411960A (en) Film forming method
JPS6411993A (en) Production of zn alloy plated steel sheet
JPS6436788A (en) Pretreatment for plating titanium material with noble metal
GB1180583A (en) Metal Plated Plastics and process therefor
JPS56107564A (en) Amorphous silicon thin film element