JPS5771352U - - Google Patents
Info
- Publication number
- JPS5771352U JPS5771352U JP1980149431U JP14943180U JPS5771352U JP S5771352 U JPS5771352 U JP S5771352U JP 1980149431 U JP1980149431 U JP 1980149431U JP 14943180 U JP14943180 U JP 14943180U JP S5771352 U JPS5771352 U JP S5771352U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Microcomputers (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980149431U JPH027472Y2 (en:Method) | 1980-10-20 | 1980-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980149431U JPH027472Y2 (en:Method) | 1980-10-20 | 1980-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5771352U true JPS5771352U (en:Method) | 1982-04-30 |
| JPH027472Y2 JPH027472Y2 (en:Method) | 1990-02-22 |
Family
ID=29508811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980149431U Expired JPH027472Y2 (en:Method) | 1980-10-20 | 1980-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH027472Y2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166755A (ja) * | 1982-03-29 | 1983-10-01 | Hitachi Ltd | 回路アセンブリ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196286A (en:Method) * | 1975-01-14 | 1976-08-24 | ||
| JPS5473570A (en) * | 1977-11-25 | 1979-06-12 | Seiko Epson Corp | Semiconductor device |
-
1980
- 1980-10-20 JP JP1980149431U patent/JPH027472Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196286A (en:Method) * | 1975-01-14 | 1976-08-24 | ||
| JPS5473570A (en) * | 1977-11-25 | 1979-06-12 | Seiko Epson Corp | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166755A (ja) * | 1982-03-29 | 1983-10-01 | Hitachi Ltd | 回路アセンブリ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH027472Y2 (en:Method) | 1990-02-22 |