JPS5771352U - - Google Patents

Info

Publication number
JPS5771352U
JPS5771352U JP1980149431U JP14943180U JPS5771352U JP S5771352 U JPS5771352 U JP S5771352U JP 1980149431 U JP1980149431 U JP 1980149431U JP 14943180 U JP14943180 U JP 14943180U JP S5771352 U JPS5771352 U JP S5771352U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980149431U
Other languages
Japanese (ja)
Other versions
JPH027472Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980149431U priority Critical patent/JPH027472Y2/ja
Publication of JPS5771352U publication Critical patent/JPS5771352U/ja
Application granted granted Critical
Publication of JPH027472Y2 publication Critical patent/JPH027472Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Landscapes

  • Microcomputers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1980149431U 1980-10-20 1980-10-20 Expired JPH027472Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980149431U JPH027472Y2 (enrdf_load_html_response) 1980-10-20 1980-10-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980149431U JPH027472Y2 (enrdf_load_html_response) 1980-10-20 1980-10-20

Publications (2)

Publication Number Publication Date
JPS5771352U true JPS5771352U (enrdf_load_html_response) 1982-04-30
JPH027472Y2 JPH027472Y2 (enrdf_load_html_response) 1990-02-22

Family

ID=29508811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980149431U Expired JPH027472Y2 (enrdf_load_html_response) 1980-10-20 1980-10-20

Country Status (1)

Country Link
JP (1) JPH027472Y2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166755A (ja) * 1982-03-29 1983-10-01 Hitachi Ltd 回路アセンブリ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5196286A (enrdf_load_html_response) * 1975-01-14 1976-08-24
JPS5473570A (en) * 1977-11-25 1979-06-12 Seiko Epson Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5196286A (enrdf_load_html_response) * 1975-01-14 1976-08-24
JPS5473570A (en) * 1977-11-25 1979-06-12 Seiko Epson Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166755A (ja) * 1982-03-29 1983-10-01 Hitachi Ltd 回路アセンブリ

Also Published As

Publication number Publication date
JPH027472Y2 (enrdf_load_html_response) 1990-02-22

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