JPS5771352U - - Google Patents
Info
- Publication number
- JPS5771352U JPS5771352U JP1980149431U JP14943180U JPS5771352U JP S5771352 U JPS5771352 U JP S5771352U JP 1980149431 U JP1980149431 U JP 1980149431U JP 14943180 U JP14943180 U JP 14943180U JP S5771352 U JPS5771352 U JP S5771352U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Landscapes
- Microcomputers (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980149431U JPH027472Y2 (cs) | 1980-10-20 | 1980-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980149431U JPH027472Y2 (cs) | 1980-10-20 | 1980-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5771352U true JPS5771352U (cs) | 1982-04-30 |
| JPH027472Y2 JPH027472Y2 (cs) | 1990-02-22 |
Family
ID=29508811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980149431U Expired JPH027472Y2 (cs) | 1980-10-20 | 1980-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH027472Y2 (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166755A (ja) * | 1982-03-29 | 1983-10-01 | Hitachi Ltd | 回路アセンブリ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196286A (cs) * | 1975-01-14 | 1976-08-24 | ||
| JPS5473570A (en) * | 1977-11-25 | 1979-06-12 | Seiko Epson Corp | Semiconductor device |
-
1980
- 1980-10-20 JP JP1980149431U patent/JPH027472Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196286A (cs) * | 1975-01-14 | 1976-08-24 | ||
| JPS5473570A (en) * | 1977-11-25 | 1979-06-12 | Seiko Epson Corp | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166755A (ja) * | 1982-03-29 | 1983-10-01 | Hitachi Ltd | 回路アセンブリ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH027472Y2 (cs) | 1990-02-22 |