JPS576697B2 - - Google Patents
Info
- Publication number
- JPS576697B2 JPS576697B2 JP8950277A JP8950277A JPS576697B2 JP S576697 B2 JPS576697 B2 JP S576697B2 JP 8950277 A JP8950277 A JP 8950277A JP 8950277 A JP8950277 A JP 8950277A JP S576697 B2 JPS576697 B2 JP S576697B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8950277A JPS5423466A (en) | 1977-07-25 | 1977-07-25 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8950277A JPS5423466A (en) | 1977-07-25 | 1977-07-25 | Manufacture for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5423466A JPS5423466A (en) | 1979-02-22 |
JPS576697B2 true JPS576697B2 (xx) | 1982-02-06 |
Family
ID=13972534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8950277A Granted JPS5423466A (en) | 1977-07-25 | 1977-07-25 | Manufacture for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5423466A (xx) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4095034A (en) * | 1975-05-02 | 1978-06-13 | Basf Aktiengesellschaft | Manufacture of α-naphthyl-N-methyl-carbamate |
JPS5994434A (ja) * | 1982-11-19 | 1984-05-31 | Nitto Electric Ind Co Ltd | 半導体素子の脱着方法 |
JP6392445B2 (ja) | 2015-03-24 | 2018-09-19 | 株式会社東芝 | 音訳支援装置、音訳支援方法及び音訳支援プログラム |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS497864A (xx) * | 1972-03-30 | 1974-01-24 | ||
JPS49105445A (xx) * | 1973-02-07 | 1974-10-05 |
-
1977
- 1977-07-25 JP JP8950277A patent/JPS5423466A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS497864A (xx) * | 1972-03-30 | 1974-01-24 | ||
JPS49105445A (xx) * | 1973-02-07 | 1974-10-05 |
Also Published As
Publication number | Publication date |
---|---|
JPS5423466A (en) | 1979-02-22 |