JPS5763851A - Tape carrier - Google Patents

Tape carrier

Info

Publication number
JPS5763851A
JPS5763851A JP55140296A JP14029680A JPS5763851A JP S5763851 A JPS5763851 A JP S5763851A JP 55140296 A JP55140296 A JP 55140296A JP 14029680 A JP14029680 A JP 14029680A JP S5763851 A JPS5763851 A JP S5763851A
Authority
JP
Japan
Prior art keywords
tape
lead
outer lead
opening
terminal part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55140296A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322461B2 (https=
Inventor
Osamu Sugano
Gunichi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Shindo Denshi Kogyo KK
Original Assignee
Ricoh Co Ltd
Shindo Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd, Shindo Denshi Kogyo KK filed Critical Ricoh Co Ltd
Priority to JP55140296A priority Critical patent/JPS5763851A/ja
Publication of JPS5763851A publication Critical patent/JPS5763851A/ja
Publication of JPS6322461B2 publication Critical patent/JPS6322461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs

Landscapes

  • Electronic Switches (AREA)
  • Wire Bonding (AREA)
JP55140296A 1980-10-07 1980-10-07 Tape carrier Granted JPS5763851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55140296A JPS5763851A (en) 1980-10-07 1980-10-07 Tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55140296A JPS5763851A (en) 1980-10-07 1980-10-07 Tape carrier

Publications (2)

Publication Number Publication Date
JPS5763851A true JPS5763851A (en) 1982-04-17
JPS6322461B2 JPS6322461B2 (https=) 1988-05-12

Family

ID=15265477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55140296A Granted JPS5763851A (en) 1980-10-07 1980-10-07 Tape carrier

Country Status (1)

Country Link
JP (1) JPS5763851A (https=)

Also Published As

Publication number Publication date
JPS6322461B2 (https=) 1988-05-12

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