JPS576044B2 - - Google Patents

Info

Publication number
JPS576044B2
JPS576044B2 JP14771674A JP14771674A JPS576044B2 JP S576044 B2 JPS576044 B2 JP S576044B2 JP 14771674 A JP14771674 A JP 14771674A JP 14771674 A JP14771674 A JP 14771674A JP S576044 B2 JPS576044 B2 JP S576044B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14771674A
Other versions
JPS50105153A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50105153A publication Critical patent/JPS50105153A/ja
Publication of JPS576044B2 publication Critical patent/JPS576044B2/ja
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP14771674A 1974-01-25 1974-12-24 Expired JPS576044B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/436,411 US3957376A (en) 1974-01-25 1974-01-25 Measuring method and system using a diffraction pattern

Publications (2)

Publication Number Publication Date
JPS50105153A JPS50105153A (ja) 1975-08-19
JPS576044B2 true JPS576044B2 (ja) 1982-02-03

Family

ID=23732285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14771674A Expired JPS576044B2 (ja) 1974-01-25 1974-12-24

Country Status (4)

Country Link
US (1) US3957376A (ja)
JP (1) JPS576044B2 (ja)
DE (1) DE2458807A1 (ja)
FR (1) FR2259349B1 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4140397A (en) * 1977-05-12 1979-02-20 General Motors Corporation Method for sensing the pattern side of microcircuit chips
DE2728361C2 (de) * 1977-06-23 1981-09-24 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Feststellen eines vorgebbaren Endzustands eines Entwicklungs- oder Ätzvorgangs
US4172664A (en) * 1977-12-30 1979-10-30 International Business Machines Corporation High precision pattern registration and overlay measurement system and process
US4472029A (en) * 1982-03-01 1984-09-18 Itek Corporation Integrated wavefront compensator
JPS5972134A (ja) * 1982-10-18 1984-04-24 Hitachi Ltd パタ−ン検出装置
FR2549952B1 (fr) * 1983-07-26 1986-12-19 Guillaume Michel Dispositif de mesure de la dimension bord a bord d'un objet par voie optique
GB8415670D0 (en) * 1984-06-20 1984-07-25 Penlon Ltd Gas analysis apparatus
CH666547A5 (de) * 1984-12-20 1988-07-29 Fischer Ag Georg Optisch-elektronisches messverfahren, eine dafuer erforderliche einrichtung und deren verwendung.
JPS61217704A (ja) * 1985-03-22 1986-09-27 Dainippon Screen Mfg Co Ltd 線幅測定装置
US4815856A (en) * 1986-06-05 1989-03-28 Storage Technology Partners Ii Method and apparatus for measuring the absolute thickness of dust defocus layers
US4754130A (en) * 1986-10-31 1988-06-28 Stanford University Method and means for detecting optically transmitted signals and establishing optical interference pattern between electrodes
US5331370A (en) * 1993-05-03 1994-07-19 Hewlett-Packard Company Method and apparatus for determining a feature-forming variant of a lithographic system
US6240219B1 (en) 1996-12-11 2001-05-29 Itt Industries Inc. Apparatus and method for providing optical sensors with super resolution
EP1096295A1 (en) * 1999-10-28 2001-05-02 Itt Manufacturing Enterprises, Inc. Apparatus and method for providing optical sensors with improved resolution
US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6950196B2 (en) 2000-09-20 2005-09-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen
DE10058216C1 (de) * 2000-11-23 2002-06-06 Infineon Technologies Ag Verfahren zur Bestimmung eines Abstandes periodischer Strukturen
DE10244554B4 (de) * 2002-09-25 2004-08-26 Sms Meer Gmbh Verfahren und Vorrichtung zur Messung der Wanddicke eines Rohres in einem Rohrwalzwerk
US7400417B2 (en) * 2005-05-23 2008-07-15 Federal Mogul World Wide, Inc. Diffraction method for measuring thickness of a workpart

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518007A (en) * 1965-05-17 1970-06-30 Nippon Electric Co Measuring device utilizing the diffraction of light
US3797939A (en) * 1968-08-09 1974-03-19 T Pryor Diffractographic measurement of profile
US3709610A (en) * 1970-05-20 1973-01-09 Holobeam Method and apparatus for measuring and controlling the thickness of a filament or the like
US3664239A (en) * 1971-01-20 1972-05-23 Container Corp Label registration for helically wound container bodies
US3764216A (en) * 1971-03-02 1973-10-09 Bausch & Lomb Interferometric apparatus

Also Published As

Publication number Publication date
FR2259349B1 (ja) 1976-10-22
FR2259349A1 (ja) 1975-08-22
JPS50105153A (ja) 1975-08-19
DE2458807A1 (de) 1975-07-31
US3957376A (en) 1976-05-18

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