JPS5759973A - Adhesive composition for flexible printed circuit board - Google Patents

Adhesive composition for flexible printed circuit board

Info

Publication number
JPS5759973A
JPS5759973A JP13492480A JP13492480A JPS5759973A JP S5759973 A JPS5759973 A JP S5759973A JP 13492480 A JP13492480 A JP 13492480A JP 13492480 A JP13492480 A JP 13492480A JP S5759973 A JPS5759973 A JP S5759973A
Authority
JP
Japan
Prior art keywords
monomer
circuit board
printed circuit
adhesive composition
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13492480A
Other languages
Japanese (ja)
Other versions
JPH0127114B2 (en
Inventor
Fujio Kitamura
Haruo Tabata
Katsuhiko Yamaguchi
Yasufumi Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP13492480A priority Critical patent/JPS5759973A/en
Publication of JPS5759973A publication Critical patent/JPS5759973A/en
Publication of JPH0127114B2 publication Critical patent/JPH0127114B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To prepare the titled composition free from corrosive properties and staining properties to metallic foil, and having excellent folding endurance, by adding a specific amount of a non-acidic polyfunctional compound as a crosslinking agent to the copolymer of a specific monomer and acrylonitrile.
CONSTITUTION: The objective composition is prepared by compounding (A) a copolymer composed of (i) 40W80wt% of a monomer of formulaI(R1 is 2W8C alkyl), e.g. ethyl acrylate, n-butyl acrylate, etc., (ii) 15W50wt% of acrylonitrile, and (iii) 1W 25wt% of a monomer of formula II (R2 is H or methyl; R3 is 2W3C alkylene), e.g. 2- hydroxyethyl acrylate, with (B) a non-acidic polyfunctional compound (e.g. tolylene diisocyanate) as a crosslinking agent. The amount of the component (B) is 0.1W4 equivalent based on the alcoholic hydroxyl group of the component (iii).
COPYRIGHT: (C)1982,JPO&Japio
JP13492480A 1980-09-27 1980-09-27 Adhesive composition for flexible printed circuit board Granted JPS5759973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13492480A JPS5759973A (en) 1980-09-27 1980-09-27 Adhesive composition for flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13492480A JPS5759973A (en) 1980-09-27 1980-09-27 Adhesive composition for flexible printed circuit board

Publications (2)

Publication Number Publication Date
JPS5759973A true JPS5759973A (en) 1982-04-10
JPH0127114B2 JPH0127114B2 (en) 1989-05-26

Family

ID=15139718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13492480A Granted JPS5759973A (en) 1980-09-27 1980-09-27 Adhesive composition for flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPS5759973A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63225677A (en) * 1987-03-13 1988-09-20 Nitto Electric Ind Co Ltd Pressure-sensitive adhesive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63225677A (en) * 1987-03-13 1988-09-20 Nitto Electric Ind Co Ltd Pressure-sensitive adhesive

Also Published As

Publication number Publication date
JPH0127114B2 (en) 1989-05-26

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