JPS5759973A - Adhesive composition for flexible printed circuit board - Google Patents
Adhesive composition for flexible printed circuit boardInfo
- Publication number
- JPS5759973A JPS5759973A JP13492480A JP13492480A JPS5759973A JP S5759973 A JPS5759973 A JP S5759973A JP 13492480 A JP13492480 A JP 13492480A JP 13492480 A JP13492480 A JP 13492480A JP S5759973 A JPS5759973 A JP S5759973A
- Authority
- JP
- Japan
- Prior art keywords
- monomer
- circuit board
- printed circuit
- adhesive composition
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To prepare the titled composition free from corrosive properties and staining properties to metallic foil, and having excellent folding endurance, by adding a specific amount of a non-acidic polyfunctional compound as a crosslinking agent to the copolymer of a specific monomer and acrylonitrile.
CONSTITUTION: The objective composition is prepared by compounding (A) a copolymer composed of (i) 40W80wt% of a monomer of formulaI(R1 is 2W8C alkyl), e.g. ethyl acrylate, n-butyl acrylate, etc., (ii) 15W50wt% of acrylonitrile, and (iii) 1W 25wt% of a monomer of formula II (R2 is H or methyl; R3 is 2W3C alkylene), e.g. 2- hydroxyethyl acrylate, with (B) a non-acidic polyfunctional compound (e.g. tolylene diisocyanate) as a crosslinking agent. The amount of the component (B) is 0.1W4 equivalent based on the alcoholic hydroxyl group of the component (iii).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13492480A JPS5759973A (en) | 1980-09-27 | 1980-09-27 | Adhesive composition for flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13492480A JPS5759973A (en) | 1980-09-27 | 1980-09-27 | Adhesive composition for flexible printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5759973A true JPS5759973A (en) | 1982-04-10 |
JPH0127114B2 JPH0127114B2 (en) | 1989-05-26 |
Family
ID=15139718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13492480A Granted JPS5759973A (en) | 1980-09-27 | 1980-09-27 | Adhesive composition for flexible printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5759973A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63225677A (en) * | 1987-03-13 | 1988-09-20 | Nitto Electric Ind Co Ltd | Pressure-sensitive adhesive |
-
1980
- 1980-09-27 JP JP13492480A patent/JPS5759973A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63225677A (en) * | 1987-03-13 | 1988-09-20 | Nitto Electric Ind Co Ltd | Pressure-sensitive adhesive |
Also Published As
Publication number | Publication date |
---|---|
JPH0127114B2 (en) | 1989-05-26 |
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