JPS5758074B2 - - Google Patents

Info

Publication number
JPS5758074B2
JPS5758074B2 JP11290874A JP11290874A JPS5758074B2 JP S5758074 B2 JPS5758074 B2 JP S5758074B2 JP 11290874 A JP11290874 A JP 11290874A JP 11290874 A JP11290874 A JP 11290874A JP S5758074 B2 JPS5758074 B2 JP S5758074B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11290874A
Other languages
Japanese (ja)
Other versions
JPS5140088A (enrdf_load_stackoverflow
Inventor
Yoshikazu Uchiumi
Masahiko Hirano
Toshio Aranishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11290874A priority Critical patent/JPS5758074B2/ja
Publication of JPS5140088A publication Critical patent/JPS5140088A/ja
Publication of JPS5758074B2 publication Critical patent/JPS5758074B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11290874A 1974-10-01 1974-10-01 Expired JPS5758074B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11290874A JPS5758074B2 (enrdf_load_stackoverflow) 1974-10-01 1974-10-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11290874A JPS5758074B2 (enrdf_load_stackoverflow) 1974-10-01 1974-10-01

Publications (2)

Publication Number Publication Date
JPS5140088A JPS5140088A (enrdf_load_stackoverflow) 1976-04-03
JPS5758074B2 true JPS5758074B2 (enrdf_load_stackoverflow) 1982-12-08

Family

ID=14598491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11290874A Expired JPS5758074B2 (enrdf_load_stackoverflow) 1974-10-01 1974-10-01

Country Status (1)

Country Link
JP (1) JPS5758074B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2683033B2 (ja) * 1988-05-13 1997-11-26 川崎製鉄株式会社 熱処理炉の炉壁構造
JP2525454Y2 (ja) * 1989-12-25 1997-02-12 松下電工株式会社 浴室床暖房用パネル

Also Published As

Publication number Publication date
JPS5140088A (enrdf_load_stackoverflow) 1976-04-03

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