JPS5140088A - - Google Patents

Info

Publication number
JPS5140088A
JPS5140088A JP11290874A JP11290874A JPS5140088A JP S5140088 A JPS5140088 A JP S5140088A JP 11290874 A JP11290874 A JP 11290874A JP 11290874 A JP11290874 A JP 11290874A JP S5140088 A JPS5140088 A JP S5140088A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11290874A
Other languages
Japanese (ja)
Other versions
JPS5758074B2 (enrdf_load_stackoverflow
Inventor
Yoshikazu Uchiumi
Masahiko Hirano
Toshio Shinsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11290874A priority Critical patent/JPS5758074B2/ja
Publication of JPS5140088A publication Critical patent/JPS5140088A/ja
Publication of JPS5758074B2 publication Critical patent/JPS5758074B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP11290874A 1974-10-01 1974-10-01 Expired JPS5758074B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11290874A JPS5758074B2 (enrdf_load_stackoverflow) 1974-10-01 1974-10-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11290874A JPS5758074B2 (enrdf_load_stackoverflow) 1974-10-01 1974-10-01

Publications (2)

Publication Number Publication Date
JPS5140088A true JPS5140088A (enrdf_load_stackoverflow) 1976-04-03
JPS5758074B2 JPS5758074B2 (enrdf_load_stackoverflow) 1982-12-08

Family

ID=14598491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11290874A Expired JPS5758074B2 (enrdf_load_stackoverflow) 1974-10-01 1974-10-01

Country Status (1)

Country Link
JP (1) JPS5758074B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01285783A (ja) * 1988-05-13 1989-11-16 Kawasaki Steel Corp 熱処理炉の炉壁構造
JPH0387117U (enrdf_load_stackoverflow) * 1989-12-25 1991-09-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01285783A (ja) * 1988-05-13 1989-11-16 Kawasaki Steel Corp 熱処理炉の炉壁構造
JPH0387117U (enrdf_load_stackoverflow) * 1989-12-25 1991-09-04

Also Published As

Publication number Publication date
JPS5758074B2 (enrdf_load_stackoverflow) 1982-12-08

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