JPS5756558B2 - - Google Patents
Info
- Publication number
- JPS5756558B2 JPS5756558B2 JP50004629A JP462975A JPS5756558B2 JP S5756558 B2 JPS5756558 B2 JP S5756558B2 JP 50004629 A JP50004629 A JP 50004629A JP 462975 A JP462975 A JP 462975A JP S5756558 B2 JPS5756558 B2 JP S5756558B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Electrochemical Coating By Surface Reaction (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43134274A | 1974-01-07 | 1974-01-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50101234A JPS50101234A (de) | 1975-08-11 |
JPS5756558B2 true JPS5756558B2 (de) | 1982-11-30 |
Family
ID=23711503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50004629A Expired JPS5756558B2 (de) | 1974-01-07 | 1975-01-07 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5756558B2 (de) |
CA (1) | CA1044636A (de) |
DE (1) | DE2500160C2 (de) |
GB (1) | GB1462001A (de) |
LU (1) | LU71602A1 (de) |
SE (1) | SE7500053L (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58224059A (ja) * | 1982-06-22 | 1983-12-26 | Tokai Rika Co Ltd | ダイカスト鋳造機 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4169018A (en) * | 1978-01-16 | 1979-09-25 | Gould Inc. | Process for electroforming copper foil |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4846918A (en) * | 1988-02-24 | 1989-07-11 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
US5670033A (en) * | 1993-04-19 | 1997-09-23 | Electrocopper Products Limited | Process for making copper metal powder, copper oxides and copper foil |
CN1084803C (zh) * | 1993-04-19 | 2002-05-15 | Ga-Tek公司 | 制造金属铜粉、铜氧化物和铜箔的方法 |
US5366612A (en) * | 1993-04-19 | 1994-11-22 | Magma Copper Company | Process for making copper foil |
SG101924A1 (en) * | 1998-10-19 | 2004-02-27 | Mitsui Mining & Smelting Co | Composite material used in making printed wiring boards |
EP0996318B1 (de) * | 1998-10-19 | 2006-04-19 | Mitsui Mining & Smelting Co., Ltd. | Neue Verbundfolie, Verfahren zu deren Herstellung und Kupferkaschiertes Laminat |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
-
1974
- 1974-12-18 CA CA216,635A patent/CA1044636A/en not_active Expired
-
1975
- 1975-01-02 GB GB12675A patent/GB1462001A/en not_active Expired
- 1975-01-03 DE DE2500160A patent/DE2500160C2/de not_active Expired
- 1975-01-03 SE SE7500053A patent/SE7500053L/xx unknown
- 1975-01-07 LU LU71602A patent/LU71602A1/xx unknown
- 1975-01-07 JP JP50004629A patent/JPS5756558B2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58224059A (ja) * | 1982-06-22 | 1983-12-26 | Tokai Rika Co Ltd | ダイカスト鋳造機 |
Also Published As
Publication number | Publication date |
---|---|
CA1044636A (en) | 1978-12-19 |
DE2500160C2 (de) | 1982-12-23 |
JPS50101234A (de) | 1975-08-11 |
LU71602A1 (de) | 1975-06-17 |
GB1462001A (en) | 1977-01-19 |
DE2500160A1 (de) | 1975-07-17 |
SE7500053L (de) | 1975-07-08 |