JPS5755953U - - Google Patents
Info
- Publication number
- JPS5755953U JPS5755953U JP1980132701U JP13270180U JPS5755953U JP S5755953 U JPS5755953 U JP S5755953U JP 1980132701 U JP1980132701 U JP 1980132701U JP 13270180 U JP13270180 U JP 13270180U JP S5755953 U JPS5755953 U JP S5755953U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980132701U JPS6144431Y2 (en:Method) | 1980-09-17 | 1980-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980132701U JPS6144431Y2 (en:Method) | 1980-09-17 | 1980-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5755953U true JPS5755953U (en:Method) | 1982-04-01 |
| JPS6144431Y2 JPS6144431Y2 (en:Method) | 1986-12-15 |
Family
ID=29492933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980132701U Expired JPS6144431Y2 (en:Method) | 1980-09-17 | 1980-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144431Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5986287A (ja) * | 1982-11-08 | 1984-05-18 | 株式会社新川 | アウタ−リ−ドボンデイング装置 |
| JPH0281464A (ja) * | 1988-09-17 | 1990-03-22 | Rohm Co Ltd | 半導体装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52105779A (en) * | 1976-03-01 | 1977-09-05 | Dainippon Screen Mfg | Device for bonding outer lead |
| JPS5449069A (en) * | 1977-09-27 | 1979-04-18 | Nec Corp | Method and device for lead correction |
-
1980
- 1980-09-17 JP JP1980132701U patent/JPS6144431Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52105779A (en) * | 1976-03-01 | 1977-09-05 | Dainippon Screen Mfg | Device for bonding outer lead |
| JPS5449069A (en) * | 1977-09-27 | 1979-04-18 | Nec Corp | Method and device for lead correction |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5986287A (ja) * | 1982-11-08 | 1984-05-18 | 株式会社新川 | アウタ−リ−ドボンデイング装置 |
| JPH0281464A (ja) * | 1988-09-17 | 1990-03-22 | Rohm Co Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6144431Y2 (en:Method) | 1986-12-15 |