JPS5755953U - - Google Patents

Info

Publication number
JPS5755953U
JPS5755953U JP1980132701U JP13270180U JPS5755953U JP S5755953 U JPS5755953 U JP S5755953U JP 1980132701 U JP1980132701 U JP 1980132701U JP 13270180 U JP13270180 U JP 13270180U JP S5755953 U JPS5755953 U JP S5755953U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980132701U
Other languages
Japanese (ja)
Other versions
JPS6144431Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980132701U priority Critical patent/JPS6144431Y2/ja
Publication of JPS5755953U publication Critical patent/JPS5755953U/ja
Application granted granted Critical
Publication of JPS6144431Y2 publication Critical patent/JPS6144431Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1980132701U 1980-09-17 1980-09-17 Expired JPS6144431Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980132701U JPS6144431Y2 (enrdf_load_stackoverflow) 1980-09-17 1980-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980132701U JPS6144431Y2 (enrdf_load_stackoverflow) 1980-09-17 1980-09-17

Publications (2)

Publication Number Publication Date
JPS5755953U true JPS5755953U (enrdf_load_stackoverflow) 1982-04-01
JPS6144431Y2 JPS6144431Y2 (enrdf_load_stackoverflow) 1986-12-15

Family

ID=29492933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980132701U Expired JPS6144431Y2 (enrdf_load_stackoverflow) 1980-09-17 1980-09-17

Country Status (1)

Country Link
JP (1) JPS6144431Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986287A (ja) * 1982-11-08 1984-05-18 株式会社新川 アウタ−リ−ドボンデイング装置
JPH0281464A (ja) * 1988-09-17 1990-03-22 Rohm Co Ltd 半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52105779A (en) * 1976-03-01 1977-09-05 Dainippon Screen Mfg Device for bonding outer lead
JPS5449069A (en) * 1977-09-27 1979-04-18 Nec Corp Method and device for lead correction

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52105779A (en) * 1976-03-01 1977-09-05 Dainippon Screen Mfg Device for bonding outer lead
JPS5449069A (en) * 1977-09-27 1979-04-18 Nec Corp Method and device for lead correction

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986287A (ja) * 1982-11-08 1984-05-18 株式会社新川 アウタ−リ−ドボンデイング装置
JPH0281464A (ja) * 1988-09-17 1990-03-22 Rohm Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6144431Y2 (enrdf_load_stackoverflow) 1986-12-15

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