JPS5752834A - Temperature sensor element - Google Patents
Temperature sensor elementInfo
- Publication number
- JPS5752834A JPS5752834A JP12897080A JP12897080A JPS5752834A JP S5752834 A JPS5752834 A JP S5752834A JP 12897080 A JP12897080 A JP 12897080A JP 12897080 A JP12897080 A JP 12897080A JP S5752834 A JPS5752834 A JP S5752834A
- Authority
- JP
- Japan
- Prior art keywords
- cup
- metal pipe
- forming body
- semiconductor material
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
PURPOSE:To reduce substance interposed between semiconductor material and a metal pipe and raise the thermal response property, by a method wherein a cup- shaped forming body of heat-resistant insulation material is inserted in the metal pipe and the cup-shaped forming body is filled with the semiconductor material. CONSTITUTION:A cup-shaped forming body 10 made of heat-resistant insulation material such as alumina, mullite or forsterite is inserted in a metal pipe 9. Then a metal terminal 11 is inserted in the cup 9. Semiconductor material with large resisrance-temperature coefficient is filled in the cup-forming body 10 and tip of the metal terminal is inserted. In turn, heat resistant insulation material 12 of powder of magnesia or alumina is filled in residual space of the metal pipe 9. Thereby the diameter of the metal pipe is reduced and the semiconductor material 15 is heated and sintered so as to perform sealing 13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12897080A JPS5752834A (en) | 1980-09-13 | 1980-09-13 | Temperature sensor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12897080A JPS5752834A (en) | 1980-09-13 | 1980-09-13 | Temperature sensor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5752834A true JPS5752834A (en) | 1982-03-29 |
JPS6241337B2 JPS6241337B2 (en) | 1987-09-02 |
Family
ID=14997904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12897080A Granted JPS5752834A (en) | 1980-09-13 | 1980-09-13 | Temperature sensor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5752834A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0140543A2 (en) * | 1983-11-03 | 1985-05-08 | Becton Dickinson and Company | Method and composition for enhancement of microorganism growth |
JPH0534543U (en) * | 1991-10-11 | 1993-05-07 | 日本特殊陶業株式会社 | Temperature sensor |
FR2783602A1 (en) * | 1998-09-17 | 2000-03-24 | Denso Corp | TEMPERATURE SENSOR |
-
1980
- 1980-09-13 JP JP12897080A patent/JPS5752834A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0140543A2 (en) * | 1983-11-03 | 1985-05-08 | Becton Dickinson and Company | Method and composition for enhancement of microorganism growth |
JPH0534543U (en) * | 1991-10-11 | 1993-05-07 | 日本特殊陶業株式会社 | Temperature sensor |
FR2783602A1 (en) * | 1998-09-17 | 2000-03-24 | Denso Corp | TEMPERATURE SENSOR |
Also Published As
Publication number | Publication date |
---|---|
JPS6241337B2 (en) | 1987-09-02 |
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