JPS5752809A - Measuring method for warp of printed wiring board and jig for measuring thereof - Google Patents

Measuring method for warp of printed wiring board and jig for measuring thereof

Info

Publication number
JPS5752809A
JPS5752809A JP12717580A JP12717580A JPS5752809A JP S5752809 A JPS5752809 A JP S5752809A JP 12717580 A JP12717580 A JP 12717580A JP 12717580 A JP12717580 A JP 12717580A JP S5752809 A JPS5752809 A JP S5752809A
Authority
JP
Japan
Prior art keywords
wiring board
pins
measured
distance
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12717580A
Other languages
Japanese (ja)
Inventor
Kiichi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12717580A priority Critical patent/JPS5752809A/en
Publication of JPS5752809A publication Critical patent/JPS5752809A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/30—Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge

Abstract

PURPOSE:To make it possible to measure the warp of the printed wiring board accurately by the simple jig, by inserting a group of pins which are slidably supported by a measuring reference member into through holes in the printed wiring board, and soldering the pins. CONSTITUTION:Ends of the pins which are slidably supported by the measuring reference member are inserted into the through holes in the printed wiring board. The distance between said reference member and said wiring board is measured at the ends and the central part in the longitudinal direction. Then, the pins and the wiring board are soldered. The distance between the same positions is measured. After the temperature of the solder has decreased, the same distance is measured again. The accurate amount of the warp of the wiring board is obtained from the measured results. For example, the pins 11 which are slidably sttached to the measuring reference member 8 are slidably inserted into the through holes 5 in the printed wiring board, and the distance A at the end part and the distance B at the central part are measured. Then the pins and the wiring board are connected by the solder 12, and the distance C is measured. After the solder has cooled, the protruded amount D of the pins 11 is measured. The amounts of the warping imediately after the soldering and after the cooling of the solder are obtained by B-A, C-B-A, and C-D-A.
JP12717580A 1980-09-16 1980-09-16 Measuring method for warp of printed wiring board and jig for measuring thereof Pending JPS5752809A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12717580A JPS5752809A (en) 1980-09-16 1980-09-16 Measuring method for warp of printed wiring board and jig for measuring thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12717580A JPS5752809A (en) 1980-09-16 1980-09-16 Measuring method for warp of printed wiring board and jig for measuring thereof

Publications (1)

Publication Number Publication Date
JPS5752809A true JPS5752809A (en) 1982-03-29

Family

ID=14953518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12717580A Pending JPS5752809A (en) 1980-09-16 1980-09-16 Measuring method for warp of printed wiring board and jig for measuring thereof

Country Status (1)

Country Link
JP (1) JPS5752809A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343503B1 (en) * 1998-12-08 2002-02-05 Samsung Electronics Co., Ltd. Module appearance inspection apparatus
CN102455162A (en) * 2010-10-22 2012-05-16 亚旭电脑股份有限公司 Board bending degree detection jig
CN109211182A (en) * 2018-10-18 2019-01-15 广州小鹏汽车科技有限公司 A kind of circuit board deformability measuring device and method
CN109780961A (en) * 2019-02-01 2019-05-21 奥士康精密电路（惠州）有限公司 A kind of overall dimensions detection instrument and preparation method thereof
CN112478370A (en) * 2020-11-17 2021-03-12 昆山国显光电有限公司 Tray, warpage detection system and warpage detection method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343503B1 (en) * 1998-12-08 2002-02-05 Samsung Electronics Co., Ltd. Module appearance inspection apparatus
CN102455162A (en) * 2010-10-22 2012-05-16 亚旭电脑股份有限公司 Board bending degree detection jig
CN109211182A (en) * 2018-10-18 2019-01-15 广州小鹏汽车科技有限公司 A kind of circuit board deformability measuring device and method
CN109780961A (en) * 2019-02-01 2019-05-21 奥士康精密电路（惠州）有限公司 A kind of overall dimensions detection instrument and preparation method thereof
CN112478370A (en) * 2020-11-17 2021-03-12 昆山国显光电有限公司 Tray, warpage detection system and warpage detection method

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