JPS5748869B2 - - Google Patents

Info

Publication number
JPS5748869B2
JPS5748869B2 JP47018038A JP1803872A JPS5748869B2 JP S5748869 B2 JPS5748869 B2 JP S5748869B2 JP 47018038 A JP47018038 A JP 47018038A JP 1803872 A JP1803872 A JP 1803872A JP S5748869 B2 JPS5748869 B2 JP S5748869B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47018038A
Other languages
Japanese (ja)
Other versions
JPS4888884A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47018038A priority Critical patent/JPS5748869B2/ja
Priority to US410524A priority patent/US3909620A/en
Publication of JPS4888884A publication Critical patent/JPS4888884A/ja
Publication of JPS5748869B2 publication Critical patent/JPS5748869B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP47018038A 1972-02-23 1972-02-23 Expired JPS5748869B2 (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (enrdf_load_stackoverflow) 1972-02-23 1972-02-23
US410524A US3909620A (en) 1972-02-23 1973-10-29 Time controlled switching system with override control of manual operation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (enrdf_load_stackoverflow) 1972-02-23 1972-02-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58120362A Division JPS5936980A (ja) 1983-07-04 1983-07-04 セラミック配線基板とその製造方法

Publications (2)

Publication Number Publication Date
JPS4888884A JPS4888884A (enrdf_load_stackoverflow) 1973-11-21
JPS5748869B2 true JPS5748869B2 (enrdf_load_stackoverflow) 1982-10-19

Family

ID=11960493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47018038A Expired JPS5748869B2 (enrdf_load_stackoverflow) 1972-02-23 1972-02-23

Country Status (1)

Country Link
JP (1) JPS5748869B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516473B2 (enrdf_load_stackoverflow) * 1974-05-20 1980-05-02
JPS5175178U (enrdf_load_stackoverflow) * 1974-12-10 1976-06-12
JPS51107281U (enrdf_load_stackoverflow) * 1975-02-25 1976-08-27
JPS5937598B2 (ja) * 1980-04-07 1984-09-11 日本電気株式会社 半導体装置
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
JPS6063957A (ja) * 1983-09-17 1985-04-12 Toshiba Corp イメ−ジセンサ
JPH0680839B2 (ja) * 1984-06-12 1994-10-12 三洋電機株式会社 発光ダイオ−ド配列体
JPH08759Y2 (ja) * 1989-06-26 1996-01-10 京セラ株式会社 半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JPS4888884A (enrdf_load_stackoverflow) 1973-11-21

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