JPS5748245A - Pellet jig - Google Patents

Pellet jig

Info

Publication number
JPS5748245A
JPS5748245A JP12356380A JP12356380A JPS5748245A JP S5748245 A JPS5748245 A JP S5748245A JP 12356380 A JP12356380 A JP 12356380A JP 12356380 A JP12356380 A JP 12356380A JP S5748245 A JPS5748245 A JP S5748245A
Authority
JP
Japan
Prior art keywords
pellet
jig
dimension
kinds
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12356380A
Other languages
Japanese (ja)
Inventor
Setsuo Noguchi
Fumio Miyagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUKAN DENSHI KK
Hitachi Ltd
Original Assignee
NITSUKAN DENSHI KK
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUKAN DENSHI KK, Hitachi Ltd filed Critical NITSUKAN DENSHI KK
Priority to JP12356380A priority Critical patent/JPS5748245A/en
Publication of JPS5748245A publication Critical patent/JPS5748245A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To reduce cost and provide a pellet jig suited for versatility and variety in product, by a method wherein a plurality of steps different in dimension are formed in a housing hole in one pellet jig so that a plurality of kinds of pellets may be housed in common use manner. CONSTITUTION:In a pellet jig 10, a large number of pellet-housing holes 12 are formed in rows. Inside each pellet-housing hole 12, two steps are disposed: the upper hole part 14 having an inverted trapezoid-shaped cross-section of larger dimensions and the lower hole part 16 having a similarly shaped cross-section of smaller dimensions. Thereby, it is possible to house a plurality of kinds of pellets different in dimension in one jig. Accordingly, cost can be largely reduced.
JP12356380A 1980-09-08 1980-09-08 Pellet jig Pending JPS5748245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12356380A JPS5748245A (en) 1980-09-08 1980-09-08 Pellet jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12356380A JPS5748245A (en) 1980-09-08 1980-09-08 Pellet jig

Publications (1)

Publication Number Publication Date
JPS5748245A true JPS5748245A (en) 1982-03-19

Family

ID=14863675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12356380A Pending JPS5748245A (en) 1980-09-08 1980-09-08 Pellet jig

Country Status (1)

Country Link
JP (1) JPS5748245A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103889A2 (en) * 1982-09-20 1984-03-28 Siemens Aktiengesellschaft Method and device to mount single integrated circuits on film (micropacks)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103889A2 (en) * 1982-09-20 1984-03-28 Siemens Aktiengesellschaft Method and device to mount single integrated circuits on film (micropacks)

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