JPS5745936A - Feeding device for semiconductor substrate - Google Patents

Feeding device for semiconductor substrate

Info

Publication number
JPS5745936A
JPS5745936A JP55122063A JP12206380A JPS5745936A JP S5745936 A JPS5745936 A JP S5745936A JP 55122063 A JP55122063 A JP 55122063A JP 12206380 A JP12206380 A JP 12206380A JP S5745936 A JPS5745936 A JP S5745936A
Authority
JP
Japan
Prior art keywords
pin
substrate
fed
spring
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55122063A
Other languages
English (en)
Inventor
Jiyouji Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55122063A priority Critical patent/JPS5745936A/ja
Publication of JPS5745936A publication Critical patent/JPS5745936A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP55122063A 1980-09-02 1980-09-02 Feeding device for semiconductor substrate Pending JPS5745936A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55122063A JPS5745936A (en) 1980-09-02 1980-09-02 Feeding device for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55122063A JPS5745936A (en) 1980-09-02 1980-09-02 Feeding device for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5745936A true JPS5745936A (en) 1982-03-16

Family

ID=14826701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55122063A Pending JPS5745936A (en) 1980-09-02 1980-09-02 Feeding device for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5745936A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH026090A (ja) * 1987-12-14 1990-01-10 Dana Corp 電磁継手の多極連結ディスク及びその製造方法
JPH02155584A (ja) * 1988-10-27 1990-06-14 Dana Corp 多極カップリングディスクを形成する方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH026090A (ja) * 1987-12-14 1990-01-10 Dana Corp 電磁継手の多極連結ディスク及びその製造方法
JPH02155584A (ja) * 1988-10-27 1990-06-14 Dana Corp 多極カップリングディスクを形成する方法

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