JPS5744017B2 - - Google Patents

Info

Publication number
JPS5744017B2
JPS5744017B2 JP50107586A JP10758675A JPS5744017B2 JP S5744017 B2 JPS5744017 B2 JP S5744017B2 JP 50107586 A JP50107586 A JP 50107586A JP 10758675 A JP10758675 A JP 10758675A JP S5744017 B2 JPS5744017 B2 JP S5744017B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50107586A
Other languages
Japanese (ja)
Other versions
JPS5153491A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5153491A publication Critical patent/JPS5153491A/ja
Publication of JPS5744017B2 publication Critical patent/JPS5744017B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP50107586A 1974-09-10 1975-09-06 Expired JPS5744017B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7430623A FR2284981A1 (en) 1974-09-10 1974-09-10 PROCESS FOR OBTAINING AN INTEGRATED SEMICONDUCTOR CIRCUIT

Publications (2)

Publication Number Publication Date
JPS5153491A JPS5153491A (en) 1976-05-11
JPS5744017B2 true JPS5744017B2 (en) 1982-09-18

Family

ID=9142928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50107586A Expired JPS5744017B2 (en) 1974-09-10 1975-09-06

Country Status (10)

Country Link
JP (1) JPS5744017B2 (en)
AT (1) AT359562B (en)
CA (1) CA1035470A (en)
CH (1) CH591163A5 (en)
DE (1) DE2538264C3 (en)
FR (1) FR2284981A1 (en)
GB (1) GB1518988A (en)
IT (1) IT1042339B (en)
NL (1) NL7510427A (en)
SE (1) SE415421B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5496775A (en) * 1978-01-17 1979-07-31 Hitachi Ltd Method of forming circuit
FR2535525A1 (en) * 1982-10-29 1984-05-04 Western Electric Co METHOD FOR MANUFACTURING INTEGRATED CIRCUITS COMPRISING THIN INSULATING LAYERS
JPH053192A (en) * 1991-10-25 1993-01-08 Matsushita Electron Corp Semiconductor integrated circuit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979768A (en) * 1966-03-23 1976-09-07 Hitachi, Ltd. Semiconductor element having surface coating comprising silicon nitride and silicon oxide films
FR1536321A (en) * 1966-06-30 1968-08-10 Texas Instruments Inc Ohmic contacts for semiconductor devices
FR1531852A (en) * 1966-07-15 1968-07-05 Itt Method of masking the surface of a support
US3474310A (en) * 1967-02-03 1969-10-21 Hitachi Ltd Semiconductor device having a sulfurtreated silicon compound thereon and a method of making the same
US3442012A (en) * 1967-08-03 1969-05-06 Teledyne Inc Method of forming a flip-chip integrated circuit
DE2059116C3 (en) * 1970-12-01 1974-11-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen Method for manufacturing a semiconductor component
GB1363815A (en) * 1971-12-06 1974-08-21 Tektronix Inc Semiconductor device and method of producing same
JPS4960870A (en) * 1972-10-16 1974-06-13

Also Published As

Publication number Publication date
ATA692075A (en) 1980-04-15
DE2538264A1 (en) 1976-03-18
FR2284981A1 (en) 1976-04-09
IT1042339B (en) 1980-01-30
SE415421B (en) 1980-09-29
DE2538264B2 (en) 1981-04-30
GB1518988A (en) 1978-07-26
NL7510427A (en) 1976-03-12
JPS5153491A (en) 1976-05-11
AT359562B (en) 1980-11-25
AU8461075A (en) 1977-03-17
DE2538264C3 (en) 1982-01-14
CA1035470A (en) 1978-07-25
FR2284981B1 (en) 1978-11-24
SE7509970L (en) 1976-03-11
CH591163A5 (en) 1977-09-15

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