JPS5742708A - Heat-resistance photosensitive material - Google Patents
Heat-resistance photosensitive materialInfo
- Publication number
- JPS5742708A JPS5742708A JP11805180A JP11805180A JPS5742708A JP S5742708 A JPS5742708 A JP S5742708A JP 11805180 A JP11805180 A JP 11805180A JP 11805180 A JP11805180 A JP 11805180A JP S5742708 A JPS5742708 A JP S5742708A
- Authority
- JP
- Japan
- Prior art keywords
- dibasic acid
- photosensitive material
- heat
- imide
- polymerizable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Polyesters Or Polycarbonates (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: A photosensitive material capable of being cured well by light to form films excellent in heat resistance and adhesiveness, prepared by reacting a polyhydric alcohol with a dibasic acid containing a photo-polymerizable C-C double bond and an imido bond-containing dibasic acid.
CONSTITUTION: An unsaturated polyester-imide is prepared by reacting, with heating, a mixture of (i) a photo-polymerizable C-C double bond-containing dibasic acid, e.g., maleic acid, and (ii) an imido bond-containing dibasic acid of the formula, wherein R is an amino acid residue, with (iii) an excess of a polyhydric alcohol and further heating the reaction mixture after distilling off the unreacted alcohol in vacuum. 100pts.wt. above-produced polyester-imide, not more than 5pts.wt. photosensitizer, e.g., benzoin, if necessary, and a small amount of a solvent are mixed to form a photosensitive material. This material is coated on an object and irradiated with light to cure the film.
EFFECT: Excellent storage stability.
USE: Electric and electronic protective material, insulating material, solder resist, adhesive, coating material and heat-resistant photoresist for semiconductor elements.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11805180A JPS5910730B2 (en) | 1980-08-26 | 1980-08-26 | Heat-resistant photosensitive material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11805180A JPS5910730B2 (en) | 1980-08-26 | 1980-08-26 | Heat-resistant photosensitive material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5742708A true JPS5742708A (en) | 1982-03-10 |
JPS5910730B2 JPS5910730B2 (en) | 1984-03-10 |
Family
ID=14726802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11805180A Expired JPS5910730B2 (en) | 1980-08-26 | 1980-08-26 | Heat-resistant photosensitive material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5910730B2 (en) |
-
1980
- 1980-08-26 JP JP11805180A patent/JPS5910730B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5910730B2 (en) | 1984-03-10 |
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